JPS61192447U - - Google Patents
Info
- Publication number
- JPS61192447U JPS61192447U JP1985077270U JP7727085U JPS61192447U JP S61192447 U JPS61192447 U JP S61192447U JP 1985077270 U JP1985077270 U JP 1985077270U JP 7727085 U JP7727085 U JP 7727085U JP S61192447 U JPS61192447 U JP S61192447U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- upper inner
- semiconductor chip
- recess
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985077270U JPS61192447U (enExample) | 1985-05-24 | 1985-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985077270U JPS61192447U (enExample) | 1985-05-24 | 1985-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192447U true JPS61192447U (enExample) | 1986-11-29 |
Family
ID=30620184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985077270U Pending JPS61192447U (enExample) | 1985-05-24 | 1985-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192447U (enExample) |
-
1985
- 1985-05-24 JP JP1985077270U patent/JPS61192447U/ja active Pending