JPS6437054U - - Google Patents
Info
- Publication number
- JPS6437054U JPS6437054U JP1987131721U JP13172187U JPS6437054U JP S6437054 U JPS6437054 U JP S6437054U JP 1987131721 U JP1987131721 U JP 1987131721U JP 13172187 U JP13172187 U JP 13172187U JP S6437054 U JPS6437054 U JP S6437054U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- package structure
- mold
- frame
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131721U JPS6437054U (enExample) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131721U JPS6437054U (enExample) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437054U true JPS6437054U (enExample) | 1989-03-06 |
Family
ID=31388049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987131721U Pending JPS6437054U (enExample) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437054U (enExample) |
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1987
- 1987-08-28 JP JP1987131721U patent/JPS6437054U/ja active Pending