JPH0325253U - - Google Patents
Info
- Publication number
- JPH0325253U JPH0325253U JP1989086593U JP8659389U JPH0325253U JP H0325253 U JPH0325253 U JP H0325253U JP 1989086593 U JP1989086593 U JP 1989086593U JP 8659389 U JP8659389 U JP 8659389U JP H0325253 U JPH0325253 U JP H0325253U
- Authority
- JP
- Japan
- Prior art keywords
- bare chip
- bonding pads
- integrated circuit
- hybrid integrated
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/931—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989086593U JPH0325253U (enExample) | 1989-07-24 | 1989-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989086593U JPH0325253U (enExample) | 1989-07-24 | 1989-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325253U true JPH0325253U (enExample) | 1991-03-15 |
Family
ID=31636168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989086593U Pending JPH0325253U (enExample) | 1989-07-24 | 1989-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325253U (enExample) |
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1989
- 1989-07-24 JP JP1989086593U patent/JPH0325253U/ja active Pending