JPH01146531U - - Google Patents

Info

Publication number
JPH01146531U
JPH01146531U JP4206688U JP4206688U JPH01146531U JP H01146531 U JPH01146531 U JP H01146531U JP 4206688 U JP4206688 U JP 4206688U JP 4206688 U JP4206688 U JP 4206688U JP H01146531 U JPH01146531 U JP H01146531U
Authority
JP
Japan
Prior art keywords
semiconductor element
package
wire
bottom side
base ends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4206688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4206688U priority Critical patent/JPH01146531U/ja
Publication of JPH01146531U publication Critical patent/JPH01146531U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Description

【図面の簡単な説明】
第１図は本考案の第一の実施例に係る実装体構
造を示す断面図、第２図は第二の実施例に係る実
装体構造を示す断面図、第３図は従来の実装体構
造の一例を示す断面図である。 １，１１，２１…半導体素子、１ａ，１１ａ，
２１ａ…電極部、３，１３，２３…リード端子、
３ａ，１３ａ，２３ａ…基端部、３ｂ，１３ｂ，
２３ｂ…突出部、４，１４，２４…ワイヤ、５，
１５，２５…パツケージ、５ａ，１５ａ，２５ａ
…底面。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子の電極部と半導体素子の両側に配さ
    れたリード端子の基端部とをワイヤで接続し、半
    導体素子、上記基端部及びワイヤを樹脂製のパツ
    ケージ内に封入し、該パツケージ外部に突出した
    リード端子の突出部を該パツケージの底面側に折
    曲してなる半導体素子の実装体構造において、 半導体素子をその電極部が上記底面側に向くよ
    うに配設し、上記ワイヤを上記折曲するリード端
    子の突出部に沿うようにしたことを特徴とする半
    導体素子の実装体構造。
JP4206688U 1988-03-31 1988-03-31 Pending JPH01146531U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206688U JPH01146531U (ja) 1988-03-31 1988-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206688U JPH01146531U (ja) 1988-03-31 1988-03-31

Publications (1)

Publication Number Publication Date
JPH01146531U true JPH01146531U (ja) 1989-10-09

Family

ID=31268491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206688U Pending JPH01146531U (ja) 1988-03-31 1988-03-31

Country Status (1)

Country Link
JP (1) JPH01146531U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (ja) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp 薄型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (ja) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp 薄型半導体装置

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