DE3227606A1 - Halbleitervorrichtung und verfahren zu ihrer herstellung - Google Patents

Halbleitervorrichtung und verfahren zu ihrer herstellung

Info

Publication number
DE3227606A1
DE3227606A1 DE19823227606 DE3227606A DE3227606A1 DE 3227606 A1 DE3227606 A1 DE 3227606A1 DE 19823227606 DE19823227606 DE 19823227606 DE 3227606 A DE3227606 A DE 3227606A DE 3227606 A1 DE3227606 A1 DE 3227606A1
Authority
DE
Germany
Prior art keywords
aluminum
film
semiconductor device
conductive layer
aluminum oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823227606
Other languages
German (de)
English (en)
Inventor
Tamotsu Kokubunji Tokyo Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56115080A external-priority patent/JPS5817627A/ja
Priority claimed from JP56115082A external-priority patent/JPS5817629A/ja
Priority claimed from JP56115081A external-priority patent/JPS5817628A/ja
Priority claimed from JP56122994A external-priority patent/JPS5825241A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3227606A1 publication Critical patent/DE3227606A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/465—
    • H10W72/019—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/45686—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE19823227606 1981-07-24 1982-07-23 Halbleitervorrichtung und verfahren zu ihrer herstellung Withdrawn DE3227606A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56115080A JPS5817627A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56115082A JPS5817629A (ja) 1981-07-24 1981-07-24 半導体集積回路装置の製造方法
JP56115081A JPS5817628A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56122994A JPS5825241A (ja) 1981-08-07 1981-08-07 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
DE3227606A1 true DE3227606A1 (de) 1983-03-03

Family

ID=27470225

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823227606 Withdrawn DE3227606A1 (de) 1981-07-24 1982-07-23 Halbleitervorrichtung und verfahren zu ihrer herstellung

Country Status (6)

Country Link
DE (1) DE3227606A1 (enExample)
FR (1) FR2510307A1 (enExample)
GB (3) GB2105107B (enExample)
HK (3) HK46686A (enExample)
IT (1) IT1152455B (enExample)
MY (2) MY8600558A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
DE19736090A1 (de) * 1997-08-20 1999-03-04 Daimler Benz Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung des Bauelements

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
WO2000074131A1 (en) * 1999-05-31 2000-12-07 Infineon Technologies A.G. A method of assembling a semiconductor device package
GB0018643D0 (en) * 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
CN101536184B (zh) 2006-11-13 2011-07-13 Nxp股份有限公司 焊盘结构和制造该焊盘结构的方法
CN110911353A (zh) * 2019-12-05 2020-03-24 上海华虹宏力半导体制造有限公司 形成导电互连线的方法
JP7305587B2 (ja) 2020-03-17 2023-07-10 株式会社東芝 半導体装置および検査装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
DE2052424A1 (de) * 1969-10-25 1971-09-30 Nippon Electric Co Verfahren zum Herstellen elektrischer Leitungsverbindungen
DE2403149A1 (de) * 1974-01-23 1975-07-24 Siemens Ag Halbleitervorrichtung
DE2637667A1 (de) * 1975-08-22 1977-02-24 Hitachi Ltd Halbleiteranordnung
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2243011C3 (de) * 1972-09-01 1982-04-01 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum Herstellen eines Thermokompressionskontaktes
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
DE2052424A1 (de) * 1969-10-25 1971-09-30 Nippon Electric Co Verfahren zum Herstellen elektrischer Leitungsverbindungen
DE2403149A1 (de) * 1974-01-23 1975-07-24 Siemens Ag Halbleitervorrichtung
DE2637667A1 (de) * 1975-08-22 1977-02-24 Hitachi Ltd Halbleiteranordnung
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US-Z: Electronics, Bd.38, Nr.14, 1965, S.99-104 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
DE19736090A1 (de) * 1997-08-20 1999-03-04 Daimler Benz Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung des Bauelements
DE19736090B4 (de) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement

Also Published As

Publication number Publication date
GB8402057D0 (en) 1984-02-29
HK45886A (en) 1986-06-27
GB2134709B (en) 1985-07-31
GB2105107A (en) 1983-03-16
IT8222563A0 (it) 1982-07-23
GB8402099D0 (en) 1984-02-29
MY8700228A (en) 1987-12-31
FR2510307A1 (fr) 1983-01-28
HK46786A (en) 1986-06-27
GB2134709A (en) 1984-08-15
MY8600558A (en) 1986-12-31
FR2510307B1 (enExample) 1984-11-30
IT1152455B (it) 1986-12-31
GB2105107B (en) 1985-07-31
HK46686A (en) 1986-06-27
GB2135121A (en) 1984-08-22
GB2135121B (en) 1985-08-07

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Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8139 Disposal/non-payment of the annual fee