IT1152455B - Dispositivo a semiconduttori e procedimento per la sua fabbricazione - Google Patents

Dispositivo a semiconduttori e procedimento per la sua fabbricazione

Info

Publication number
IT1152455B
IT1152455B IT22563/82A IT2256382A IT1152455B IT 1152455 B IT1152455 B IT 1152455B IT 22563/82 A IT22563/82 A IT 22563/82A IT 2256382 A IT2256382 A IT 2256382A IT 1152455 B IT1152455 B IT 1152455B
Authority
IT
Italy
Prior art keywords
oxide film
bonding pad
aluminum
semiconductor device
aluminum oxide
Prior art date
Application number
IT22563/82A
Other languages
English (en)
Other versions
IT8222563A0 (it
Inventor
Usami Tamotsu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56115082A external-priority patent/JPS5817629A/ja
Priority claimed from JP56115080A external-priority patent/JPS5817627A/ja
Priority claimed from JP56115081A external-priority patent/JPS5817628A/ja
Priority claimed from JP56122994A external-priority patent/JPS5825241A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8222563A0 publication Critical patent/IT8222563A0/it
Application granted granted Critical
Publication of IT1152455B publication Critical patent/IT1152455B/it

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IT22563/82A 1981-07-24 1982-07-23 Dispositivo a semiconduttori e procedimento per la sua fabbricazione IT1152455B (it)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56115082A JPS5817629A (ja) 1981-07-24 1981-07-24 半導体集積回路装置の製造方法
JP56115080A JPS5817627A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56115081A JPS5817628A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56122994A JPS5825241A (ja) 1981-08-07 1981-08-07 半導体集積回路装置およびその製造方法

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IT8222563A0 IT8222563A0 (it) 1982-07-23
IT1152455B true IT1152455B (it) 1986-12-31

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FR (1) FR2510307A1 (it)
GB (3) GB2105107B (it)
HK (3) HK46686A (it)
IT (1) IT1152455B (it)
MY (2) MY8600558A (it)

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US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
DE19736090B4 (de) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement
EP1188182B1 (en) * 1999-05-31 2012-08-22 Infineon Technologies AG A method of assembling a semiconductor device package
GB0018643D0 (en) * 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
WO2008059433A1 (en) * 2006-11-13 2008-05-22 Nxp B.V. Bond pad structure and method for producing same
CN110911353A (zh) * 2019-12-05 2020-03-24 上海华虹宏力半导体制造有限公司 形成导电互连线的方法

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Publication number Priority date Publication date Assignee Title
US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit
DE2243011C3 (de) * 1972-09-01 1982-04-01 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum Herstellen eines Thermokompressionskontaktes
DE2403149A1 (de) * 1974-01-23 1975-07-24 Siemens Ag Halbleitervorrichtung
JPS5851425B2 (ja) * 1975-08-22 1983-11-16 株式会社日立製作所 ハンドウタイソウチ
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

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DE3227606A1 (de) 1983-03-03
GB2105107A (en) 1983-03-16
GB8402099D0 (en) 1984-02-29
HK45886A (en) 1986-06-27
GB2105107B (en) 1985-07-31
MY8700228A (en) 1987-12-31
GB2135121B (en) 1985-08-07
HK46786A (en) 1986-06-27
GB2134709A (en) 1984-08-15
FR2510307B1 (it) 1984-11-30
GB2134709B (en) 1985-07-31
HK46686A (en) 1986-06-27
GB2135121A (en) 1984-08-22
IT8222563A0 (it) 1982-07-23
GB8402057D0 (en) 1984-02-29
MY8600558A (en) 1986-12-31
FR2510307A1 (fr) 1983-01-28

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