DE3129558A1 - Verfahren zur herstellung einer integrierten halbleiterschaltung - Google Patents

Verfahren zur herstellung einer integrierten halbleiterschaltung

Info

Publication number
DE3129558A1
DE3129558A1 DE19813129558 DE3129558A DE3129558A1 DE 3129558 A1 DE3129558 A1 DE 3129558A1 DE 19813129558 DE19813129558 DE 19813129558 DE 3129558 A DE3129558 A DE 3129558A DE 3129558 A1 DE3129558 A1 DE 3129558A1
Authority
DE
Germany
Prior art keywords
layer
groove
substrate
polysilicon
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813129558
Other languages
German (de)
English (en)
Other versions
DE3129558C2 (enExample
Inventor
Satoshi Yokohama Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10334180A external-priority patent/JPS5728341A/ja
Priority claimed from JP55175293A external-priority patent/JPS5799754A/ja
Priority claimed from JP55175292A external-priority patent/JPS5799753A/ja
Priority claimed from JP56031602A external-priority patent/JPS57147249A/ja
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of DE3129558A1 publication Critical patent/DE3129558A1/de
Application granted granted Critical
Publication of DE3129558C2 publication Critical patent/DE3129558C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/40—Isolation regions comprising polycrystalline semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/041—Manufacture or treatment of isolation regions comprising polycrystalline semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/082—Ion implantation FETs/COMs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/914—Doping
    • Y10S438/924—To facilitate selective etching

Landscapes

  • Element Separation (AREA)
DE19813129558 1980-07-28 1981-07-27 Verfahren zur herstellung einer integrierten halbleiterschaltung Granted DE3129558A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10334180A JPS5728341A (en) 1980-07-28 1980-07-28 Manufacture of semiconductor integrated circuit
JP55175293A JPS5799754A (en) 1980-12-12 1980-12-12 Manufacture of semiconductor integrated circuit
JP55175292A JPS5799753A (en) 1980-12-12 1980-12-12 Manufacture of semiconductor integrated circuit
JP56031602A JPS57147249A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
DE3129558A1 true DE3129558A1 (de) 1982-03-18
DE3129558C2 DE3129558C2 (enExample) 1987-07-30

Family

ID=27459463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813129558 Granted DE3129558A1 (de) 1980-07-28 1981-07-27 Verfahren zur herstellung einer integrierten halbleiterschaltung

Country Status (2)

Country Link
US (1) US4507849A (enExample)
DE (1) DE3129558A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0097789A3 (en) * 1982-06-30 1986-08-20 International Business Machines Corporation Method of filling trenches in semiconductor substrates with silicon
EP0498475A3 (en) * 1991-01-14 1994-06-01 Philips Nv Method of manufacturing a semiconductor device
EP0810650A3 (en) * 1996-05-16 1998-03-18 Siemens Aktiengesellschaft Uniform trench fill recess by means of isotropic etching

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710992A (en) * 1980-06-24 1982-01-20 Sumitomo Electric Ind Ltd Semiconductor device and manufacture therefor
DE3375541D1 (en) * 1982-02-10 1988-03-03 Hitachi Ltd Semiconductor memory and method for fabricating the same
US4604150A (en) * 1985-01-25 1986-08-05 At&T Bell Laboratories Controlled boron doping of silicon
US4676847A (en) * 1985-01-25 1987-06-30 American Telephone And Telegraph Company At&T Bell Laboratories Controlled boron doping of silicon
JP2706469B2 (ja) * 1988-06-01 1998-01-28 松下電器産業株式会社 半導体装置の製造方法
US5135884A (en) * 1991-03-28 1992-08-04 Sgs-Thomson Microelectronics, Inc. Method of producing isoplanar isolated active regions
US6015737A (en) * 1991-07-26 2000-01-18 Denso Corporation Production method of a vertical type MOSFET
EP0550770B1 (en) * 1991-07-26 1997-11-12 Denso Corporation Method of producing vertical mosfets
US6603173B1 (en) 1991-07-26 2003-08-05 Denso Corporation Vertical type MOSFET
DE4340590A1 (de) * 1992-12-03 1994-06-09 Hewlett Packard Co Grabenisolation unter Verwendung dotierter Seitenwände
DE19538005A1 (de) * 1995-10-12 1997-04-17 Fraunhofer Ges Forschung Verfahren zum Erzeugen einer Grabenisolation in einem Substrat
US5872045A (en) * 1997-07-14 1999-02-16 Industrial Technology Research Institute Method for making an improved global planarization surface by using a gradient-doped polysilicon trench--fill in shallow trench isolation
US5811345A (en) * 1997-09-18 1998-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Planarization of shallow- trench- isolation without chemical mechanical polishing
EP0929098A1 (en) * 1998-01-13 1999-07-14 STMicroelectronics S.r.l. Process for selectively implanting dopants into the bottom of a deep trench
US6040597A (en) * 1998-02-13 2000-03-21 Advanced Micro Devices, Inc. Isolation boundaries in flash memory cores
WO2003044863A1 (en) * 2001-11-20 2003-05-30 The Regents Of The University Of California Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications
US7008839B2 (en) * 2002-03-08 2006-03-07 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor thin film
US20070042563A1 (en) * 2005-08-19 2007-02-22 Honeywell International Inc. Single crystal based through the wafer connections technical field
KR100761354B1 (ko) * 2006-10-02 2007-09-27 주식회사 하이닉스반도체 다면채널을 갖는 반도체소자의 듀얼폴리게이트 및 그의형성 방법
US12610605B2 (en) * 2022-11-28 2026-04-21 Globalfoundries U.S. Inc. IC structure with gate electrode fully within V-shaped cavity

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3892608A (en) * 1974-02-28 1975-07-01 Motorola Inc Method for filling grooves and moats used on semiconductor devices
US3979237A (en) * 1972-04-24 1976-09-07 Harris Corporation Device isolation in integrated circuits
US4026736A (en) * 1974-01-03 1977-05-31 Motorola, Inc. Integrated semiconductor structure with combined dielectric and PN junction isolation including fabrication method therefor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534442A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
US4269636A (en) * 1978-12-29 1981-05-26 Harris Corporation Method of fabricating self-aligned bipolar transistor process and device utilizing etching and self-aligned masking
JPS6043024B2 (ja) * 1978-12-30 1985-09-26 富士通株式会社 半導体装置の製造方法
US4286374A (en) * 1979-02-24 1981-09-01 International Computers Limited Large scale integrated circuit production
US4255207A (en) * 1979-04-09 1981-03-10 Harris Corporation Fabrication of isolated regions for use in self-aligning device process utilizing selective oxidation
JPS5636143A (en) * 1979-08-31 1981-04-09 Hitachi Ltd Manufacture of semiconductor device
US4255209A (en) * 1979-12-21 1981-03-10 Harris Corporation Process of fabricating an improved I2 L integrated circuit utilizing diffusion and epitaxial deposition
US4260436A (en) * 1980-02-19 1981-04-07 Harris Corporation Fabrication of moat resistor ram cell utilizing polycrystalline deposition and etching
US4409609A (en) * 1981-03-18 1983-10-11 Fujitsu Limited Semiconductor device and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979237A (en) * 1972-04-24 1976-09-07 Harris Corporation Device isolation in integrated circuits
US4026736A (en) * 1974-01-03 1977-05-31 Motorola, Inc. Integrated semiconductor structure with combined dielectric and PN junction isolation including fabrication method therefor
US3892608A (en) * 1974-02-28 1975-07-01 Motorola Inc Method for filling grooves and moats used on semiconductor devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US-Z: "IBM TDB", Bd. 22, Nr. 11, 1980, S. 4900-4902 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0097789A3 (en) * 1982-06-30 1986-08-20 International Business Machines Corporation Method of filling trenches in semiconductor substrates with silicon
EP0498475A3 (en) * 1991-01-14 1994-06-01 Philips Nv Method of manufacturing a semiconductor device
EP0810650A3 (en) * 1996-05-16 1998-03-18 Siemens Aktiengesellschaft Uniform trench fill recess by means of isotropic etching

Also Published As

Publication number Publication date
US4507849A (en) 1985-04-02
DE3129558C2 (enExample) 1987-07-30

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: HENKEL, G., DR.PHIL. FEILER, L., DR.RER.NAT. HAENZ

8127 New person/name/address of the applicant

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee