DE202017001425U1 - Kontakte aus Edelmetallegierungen - Google Patents

Kontakte aus Edelmetallegierungen Download PDF

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Publication number
DE202017001425U1
DE202017001425U1 DE202017001425.4U DE202017001425U DE202017001425U1 DE 202017001425 U1 DE202017001425 U1 DE 202017001425U1 DE 202017001425 U DE202017001425 U DE 202017001425U DE 202017001425 U1 DE202017001425 U1 DE 202017001425U1
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DE
Germany
Prior art keywords
contact
layer
copper
gold
over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202017001425.4U
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Apple Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apple Inc filed Critical Apple Inc
Publication of DE202017001425U1 publication Critical patent/DE202017001425U1/de
Expired - Lifetime legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
DE202017001425.4U 2016-03-18 2017-03-16 Kontakte aus Edelmetallegierungen Expired - Lifetime DE202017001425U1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662310445P 2016-03-18 2016-03-18
US62/310,445 2016-03-18
US201662383381P 2016-09-02 2016-09-02
US62/383,381 2016-09-02
US201662384120P 2016-09-06 2016-09-06
US62/384,120 2016-09-06

Publications (1)

Publication Number Publication Date
DE202017001425U1 true DE202017001425U1 (de) 2017-07-06

Family

ID=59409883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202017001425.4U Expired - Lifetime DE202017001425U1 (de) 2016-03-18 2017-03-16 Kontakte aus Edelmetallegierungen

Country Status (5)

Country Link
US (1) US10411379B2 (https=)
JP (1) JP3211820U (https=)
KR (1) KR200489473Y1 (https=)
CN (1) CN207638036U (https=)
DE (1) DE202017001425U1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107630149A (zh) * 2017-08-30 2018-01-26 惠州市好得高精密五金有限公司 一种硬质千足金表壳及其制配方法
US10411379B2 (en) 2016-03-18 2019-09-10 Apple Inc. Precious-metal-alloy contacts
DE102018009544A1 (de) * 2018-11-29 2020-06-04 Serafettin Kesim Taster Hubdruckvorrichtung für Elektro- und Automaten Anlagen
DE102019104644B3 (de) 2019-02-25 2020-07-09 Carl Zeiss Industrielle Messtechnik Gmbh Taststiftwechselhalterung und Taststift
EP3664224A4 (en) * 2017-09-20 2020-09-02 Huawei Technologies Co., Ltd. ELECTRICAL CONNECTOR, MOBILE TERMINAL AND ELECTRICAL CONNECTOR MANUFACTURING PROCESS
US10998657B2 (en) 2016-03-18 2021-05-04 Apple Inc. Precious-metal-alloy contacts
EP3982495A1 (en) * 2020-10-08 2022-04-13 Samsung Electronics Co., Ltd. Electronic device including host connector and memory device

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US20190103693A1 (en) * 2017-09-29 2019-04-04 Apple Inc. Electrical contacts having sacrificial layer for corrosion protection
CN109659750B (zh) 2017-10-12 2021-09-17 富士康(昆山)电脑接插件有限公司 电连接器及其制造方法
CN109787007A (zh) 2017-11-15 2019-05-21 富士康(昆山)电脑接插件有限公司 电连接器及其导电端子
FR3074193B1 (fr) * 2017-11-28 2020-07-10 Linxens Holding Circuit electrique, module electronique pour carte a puce realise sur ce circuit electrique et procede pour la realisation d’un tel circuit electrique.
CN109904705B (zh) * 2017-12-07 2021-10-08 泰科电子(上海)有限公司 导电端子坯料条的制造方法和导电端子的制造方法
US11674235B2 (en) * 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux
US11201426B2 (en) * 2018-08-13 2021-12-14 Apple Inc. Electrical contact appearance and protection
CN110350339B (zh) * 2018-08-29 2022-04-22 富士康(昆山)电脑接插件有限公司 导电端子及其制造方法和电连接器
KR102148316B1 (ko) 2018-12-11 2020-08-26 히로세코리아 주식회사 전기적 접촉 단자
JP2020187971A (ja) * 2019-05-16 2020-11-19 株式会社オートネットワーク技術研究所 コネクタ端子、端子付き電線、及び端子対
CN110416782A (zh) * 2019-08-27 2019-11-05 问问智能信息科技有限公司 一种充电触点组合结构及其制备方法
CN110504574A (zh) * 2019-08-27 2019-11-26 问问智能信息科技有限公司 一种充电触点结构及其制备方法
WO2021036137A1 (zh) * 2019-08-23 2021-03-04 问问智能信息科技有限公司 触点、触点结构、电子设备和充电设备
CN112467431B (zh) * 2019-09-09 2022-04-19 苹果公司 贵金属合金触点
WO2021188674A1 (en) * 2020-03-18 2021-09-23 Xtalic Corporation Nanostructured palladium-based alloys and related methods
CN111961906B (zh) * 2020-07-29 2021-11-05 济南大学 一种高强高韧耐蚀镍基复合材料的制备方法及所得产品
CN112725653A (zh) * 2020-12-21 2021-04-30 有研亿金新材料有限公司 一种新型高塑性金基电刷材料及其制备方法
US11764505B2 (en) * 2021-07-21 2023-09-19 Dell Products L.P. Add-in card connector contact optimization for high-speed signaling
AU2022375737A1 (en) 2021-10-26 2024-03-21 Halliburton Energy Services, Inc. Auto-insulating concentric wet-mate electrical connector for downhole applications
DE102024130366A1 (de) * 2024-10-18 2026-04-23 Te Connectivity Solutions Gmbh Elektrischer Steckverbinderkontakt und Anschlusselement mit elektrischem Steckverbinderkontakt

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10411379B2 (en) 2016-03-18 2019-09-10 Apple Inc. Precious-metal-alloy contacts
US10998657B2 (en) 2016-03-18 2021-05-04 Apple Inc. Precious-metal-alloy contacts
CN107630149A (zh) * 2017-08-30 2018-01-26 惠州市好得高精密五金有限公司 一种硬质千足金表壳及其制配方法
EP3664224A4 (en) * 2017-09-20 2020-09-02 Huawei Technologies Co., Ltd. ELECTRICAL CONNECTOR, MOBILE TERMINAL AND ELECTRICAL CONNECTOR MANUFACTURING PROCESS
US11128074B2 (en) * 2017-09-20 2021-09-21 Huawei Technologies Co., Ltd. Electrical connector, mobile terminal, and electrical connector manufacturing method
EP4060821A1 (en) * 2017-09-20 2022-09-21 Huawei Technologies Co., Ltd. Electrical connector and mobile terminal
US11626702B2 (en) 2017-09-20 2023-04-11 Huawei Technologies Co., Ltd. Electrical connector, mobile terminal, and electrical connector manufacturing method
EP4310225A3 (en) * 2017-09-20 2024-04-17 Huawei Technologies Co., Ltd. Electrical connector, mobile terminal, and electrical connector manufacturing method
DE102018009544A1 (de) * 2018-11-29 2020-06-04 Serafettin Kesim Taster Hubdruckvorrichtung für Elektro- und Automaten Anlagen
DE102019104644B3 (de) 2019-02-25 2020-07-09 Carl Zeiss Industrielle Messtechnik Gmbh Taststiftwechselhalterung und Taststift
EP3982495A1 (en) * 2020-10-08 2022-04-13 Samsung Electronics Co., Ltd. Electronic device including host connector and memory device
US11791579B2 (en) 2020-10-08 2023-10-17 Samsung Electronics Co., Ltd. Electronic device including host connector and memory device

Also Published As

Publication number Publication date
KR200489473Y1 (ko) 2019-06-21
CN207638036U (zh) 2018-07-20
KR20170003367U (ko) 2017-09-27
US10411379B2 (en) 2019-09-10
US20170271800A1 (en) 2017-09-21
JP3211820U (ja) 2017-08-03

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