CN1989607A - 紫外线照射装置 - Google Patents

紫外线照射装置 Download PDF

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Publication number
CN1989607A
CN1989607A CNA2005800247145A CN200580024714A CN1989607A CN 1989607 A CN1989607 A CN 1989607A CN A2005800247145 A CNA2005800247145 A CN A2005800247145A CN 200580024714 A CN200580024714 A CN 200580024714A CN 1989607 A CN1989607 A CN 1989607A
Authority
CN
China
Prior art keywords
light
emitting diodes
emitting diode
ultraviolet irradiation
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800247145A
Other languages
English (en)
Chinese (zh)
Inventor
河崎仁彦
小林贤治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN1989607A publication Critical patent/CN1989607A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CNA2005800247145A 2004-07-22 2005-07-20 紫外线照射装置 Pending CN1989607A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP214534/2004 2004-07-22
JP2004214534A JP4279738B2 (ja) 2004-07-22 2004-07-22 紫外線照射装置

Publications (1)

Publication Number Publication Date
CN1989607A true CN1989607A (zh) 2007-06-27

Family

ID=35785260

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800247145A Pending CN1989607A (zh) 2004-07-22 2005-07-20 紫外线照射装置

Country Status (7)

Country Link
US (1) US20080023639A1 (enExample)
JP (1) JP4279738B2 (enExample)
KR (1) KR20070032791A (enExample)
CN (1) CN1989607A (enExample)
DE (1) DE112005001733T5 (enExample)
TW (1) TW200608479A (enExample)
WO (1) WO2006009152A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102023417A (zh) * 2009-09-17 2011-04-20 优志旺电机株式会社 光照射装置
CN110676283A (zh) * 2019-10-16 2020-01-10 福州大学 一种基于纳米线的μLED显示设计方法
CN118998650A (zh) * 2024-10-22 2024-11-22 东莞锐视光电科技有限公司 一种紫外固化光源

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624931B2 (ja) * 2006-01-19 2011-02-02 キヤノンマシナリー株式会社 ピックアップ装置及びピックアップ方法
JP2007329300A (ja) * 2006-06-08 2007-12-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた切削機
JP5117709B2 (ja) * 2006-12-04 2013-01-16 リンテック株式会社 紫外線照射装置及び紫外線照射方法
WO2008142975A1 (ja) * 2007-05-18 2008-11-27 Tokyo Seimitsu Co., Ltd. ダイシング装置およびダイシング方法
JP5178268B2 (ja) * 2008-03-19 2013-04-10 トッパン・フォームズ株式会社 紫外線照射装置
JP5279309B2 (ja) * 2008-03-19 2013-09-04 トッパン・フォームズ株式会社 紫外線照射装置
JP5416918B2 (ja) * 2008-05-21 2014-02-12 リンテック株式会社 光照射装置及びこれに用いられる発光ダイオードの照度補正方法
JP4934112B2 (ja) * 2008-07-10 2012-05-16 リンテック株式会社 光照射装置
JP5075789B2 (ja) * 2008-10-20 2012-11-21 株式会社アルバック 光照射装置
JP2010171076A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
JP5035272B2 (ja) * 2009-03-03 2012-09-26 ウシオ電機株式会社 光照射装置
JP5607310B2 (ja) * 2009-03-10 2014-10-15 リンテック株式会社 光照射装置及び光照射方法
JP5402121B2 (ja) * 2009-03-17 2014-01-29 セイコーエプソン株式会社 液滴吐出装置
JP5485570B2 (ja) * 2009-03-23 2014-05-07 リンテック株式会社 光照射装置及び光照射方法
JP5386232B2 (ja) 2009-05-26 2014-01-15 日東電工株式会社 紫外線照射装置
JP5547954B2 (ja) * 2009-12-14 2014-07-16 日東電工株式会社 粘着テープ剥離方法およびその装置
WO2011117946A1 (ja) * 2010-03-26 2011-09-29 シャープ株式会社 紫外線照射装置
US9456508B2 (en) * 2010-05-28 2016-09-27 Apple Inc. Methods for assembling electronic devices by internally curing light-sensitive adhesive
US9499338B2 (en) 2010-12-15 2016-11-22 Symbotic, LLC Automated bot transfer arm drive system
US11078017B2 (en) 2010-12-15 2021-08-03 Symbotic Llc Automated bot with transfer arm
US9266310B2 (en) 2011-12-16 2016-02-23 Apple Inc. Methods of joining device structures with adhesive
US9302457B2 (en) * 2012-09-07 2016-04-05 Apple Inc. Liquid optically clear adhesive lamination process control
EP2975098B1 (en) 2013-03-11 2021-07-21 Lintec Corporation Adhesive sheet, and production method for processed device-related members
KR101671808B1 (ko) * 2014-12-03 2016-11-03 주식회사 필옵틱스 발광 다이오드를 이용한 자외선 경화 장치
JP6866631B2 (ja) * 2016-12-20 2021-04-28 東京エレクトロン株式会社 光処理装置、塗布、現像装置、光処理方法及び記憶媒体
JP6770428B2 (ja) * 2016-12-28 2020-10-14 株式会社Ｓｃｒｅｅｎホールディングス 除電装置および除電方法
JP6902452B2 (ja) 2017-10-19 2021-07-14 株式会社荏原製作所 研磨装置
JP6805123B2 (ja) 2017-12-27 2020-12-23 日機装株式会社 流体殺菌装置
KR102650608B1 (ko) * 2020-12-18 2024-03-25 세메스 주식회사 광 처리 부재, 그를 포함하는 기판 처리 장치 및 기판 처리 방법
KR20240036978A (ko) 2022-09-14 2024-03-21 삼성전자주식회사 광 조사 장치, 이를 포함하는 기판 디본딩 시스템 및 이를 이용한 기판 디본딩 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616529B2 (ja) * 1986-02-17 1994-03-02 ウシオ電機株式会社 粘着シ−ト処理装置
US6597008B1 (en) * 1999-09-09 2003-07-22 Fuji Photo Film Co., Ltd. Method of reading a radiation image converting panel
WO2001026576A1 (en) * 1999-10-08 2001-04-19 Britesmile, Inc. Apparatus for simultaneous illumination of teeth
JP2003145812A (ja) * 2001-08-29 2003-05-21 Fuji Photo Film Co Ltd 定着器
JP2003098677A (ja) * 2001-09-25 2003-04-04 Pentax Corp 露光システム
US6596977B2 (en) * 2001-10-05 2003-07-22 Koninklijke Philips Electronics N.V. Average light sensing for PWM control of RGB LED based white light luminaries
US20030233138A1 (en) * 2002-06-12 2003-12-18 Altus Medical, Inc. Concentration of divergent light from light emitting diodes into therapeutic light energy
US7175712B2 (en) * 2003-01-09 2007-02-13 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US6903809B2 (en) * 2003-05-29 2005-06-07 Perkinelmer, Inc. Integrated, in-line bumping and exposure system
US6828576B2 (en) * 2003-06-11 2004-12-07 Paul Spivak UV LED light projection method and apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102023417A (zh) * 2009-09-17 2011-04-20 优志旺电机株式会社 光照射装置
CN110676283A (zh) * 2019-10-16 2020-01-10 福州大学 一种基于纳米线的μLED显示设计方法
CN110676283B (zh) * 2019-10-16 2022-03-25 福州大学 一种基于纳米线的μLED显示设计方法
CN118998650A (zh) * 2024-10-22 2024-11-22 东莞锐视光电科技有限公司 一种紫外固化光源
CN118998650B (zh) * 2024-10-22 2025-01-10 东莞锐视光电科技有限公司 一种紫外固化光源

Also Published As

Publication number Publication date
WO2006009152A1 (ja) 2006-01-26
JP2006040944A (ja) 2006-02-09
US20080023639A1 (en) 2008-01-31
TW200608479A (en) 2006-03-01
DE112005001733T5 (de) 2007-06-14
JP4279738B2 (ja) 2009-06-17
KR20070032791A (ko) 2007-03-22

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