CN1885580A - 具有金属反射层的发光二极管封装及其制造方法 - Google Patents
具有金属反射层的发光二极管封装及其制造方法 Download PDFInfo
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- CN1885580A CN1885580A CNA2006100922828A CN200610092282A CN1885580A CN 1885580 A CN1885580 A CN 1885580A CN A2006100922828 A CNA2006100922828 A CN A2006100922828A CN 200610092282 A CN200610092282 A CN 200610092282A CN 1885580 A CN1885580 A CN 1885580A
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- 238000004544 sputter deposition Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
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- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
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- 239000007791 liquid phase Substances 0.000 claims description 3
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050053163 | 2005-06-20 | ||
KR1020050053163A KR100638868B1 (ko) | 2005-06-20 | 2005-06-20 | 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1885580A true CN1885580A (zh) | 2006-12-27 |
CN100444417C CN100444417C (zh) | 2008-12-17 |
Family
ID=37572540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100922828A Active CN100444417C (zh) | 2005-06-20 | 2006-06-16 | 具有金属反射层的发光二极管封装的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20060284207A1 (zh) |
JP (1) | JP4824487B2 (zh) |
KR (1) | KR100638868B1 (zh) |
CN (1) | CN100444417C (zh) |
TW (1) | TWI307973B (zh) |
Cited By (4)
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CN102157661A (zh) * | 2010-02-11 | 2011-08-17 | 亿光电子工业股份有限公司 | 发光二极管封装结构及其制作方法 |
CN104737307A (zh) * | 2012-10-17 | 2015-06-24 | 欧司朗光电半导体有限公司 | 用于制造多个光电子半导体构件的方法 |
CN108346720A (zh) * | 2018-01-23 | 2018-07-31 | 浙江东晶博蓝特光电有限公司 | 一种用于发光器件封装的制备方法 |
CN108431972A (zh) * | 2015-10-07 | 2018-08-21 | 亮锐控股有限公司 | 具有可变数目的发射表面的倒装芯片smt led |
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EP1597777B1 (en) | 2003-02-26 | 2013-04-24 | Cree, Inc. | Composite white light source and method for fabricating |
JP2006525682A (ja) | 2003-04-30 | 2006-11-09 | クリー インコーポレイテッド | 高出力固体発光素子パッケージ |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
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US20080145960A1 (en) * | 2006-12-15 | 2008-06-19 | Gelcore, Llc | Super thin LED package for the backlighting applications and fabrication method |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
KR100888180B1 (ko) | 2007-10-30 | 2009-03-10 | 서울반도체 주식회사 | 측면 발광 led 조립체 |
US8552444B2 (en) * | 2007-11-19 | 2013-10-08 | Panasonic Corporation | Semiconductor light-emitting device and manufacturing method of the same |
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US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
KR100972979B1 (ko) | 2008-03-17 | 2010-07-29 | 삼성엘이디 주식회사 | 엘이디 패키지 및 그 제조방법 |
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- 2006-06-20 US US11/455,648 patent/US20060284207A1/en not_active Abandoned
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2008
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Cited By (7)
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CN102157661A (zh) * | 2010-02-11 | 2011-08-17 | 亿光电子工业股份有限公司 | 发光二极管封装结构及其制作方法 |
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CN104737307B (zh) * | 2012-10-17 | 2017-11-10 | 欧司朗光电半导体有限公司 | 用于制造多个光电子半导体构件的方法 |
CN108431972A (zh) * | 2015-10-07 | 2018-08-21 | 亮锐控股有限公司 | 具有可变数目的发射表面的倒装芯片smt led |
US10693048B2 (en) | 2015-10-07 | 2020-06-23 | Lumileds Llc | Flip-chip SMT LEDs with variable number of emitting surfaces |
US11374155B2 (en) | 2015-10-07 | 2022-06-28 | Lumileds Llc | Flip-chip SMT LEDs with variable number of emitting surfaces |
CN108346720A (zh) * | 2018-01-23 | 2018-07-31 | 浙江东晶博蓝特光电有限公司 | 一种用于发光器件封装的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100444417C (zh) | 2008-12-17 |
JP2007005801A (ja) | 2007-01-11 |
TW200723566A (en) | 2007-06-16 |
JP4824487B2 (ja) | 2011-11-30 |
US20060284207A1 (en) | 2006-12-21 |
US20080233666A1 (en) | 2008-09-25 |
TWI307973B (en) | 2009-03-21 |
KR100638868B1 (ko) | 2006-10-27 |
US7687292B2 (en) | 2010-03-30 |
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