CN102044600A - 发光二极管封装结构及其制备方法 - Google Patents

发光二极管封装结构及其制备方法 Download PDF

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CN102044600A
CN102044600A CN2009102048451A CN200910204845A CN102044600A CN 102044600 A CN102044600 A CN 102044600A CN 2009102048451 A CN2009102048451 A CN 2009102048451A CN 200910204845 A CN200910204845 A CN 200910204845A CN 102044600 A CN102044600 A CN 102044600A
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electrode
emitting diode
light
substrate
backlight unit
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林昇柏
张超雄
曾文良
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to CN2009102048451A priority Critical patent/CN102044600A/zh
Priority to KR1020100092465A priority patent/KR101141349B1/ko
Priority to US12/902,332 priority patent/US8378378B2/en
Publication of CN102044600A publication Critical patent/CN102044600A/zh
Priority to US13/736,108 priority patent/US8551794B2/en
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Abstract

一种发光二极管封装结构及其制备方法，该封装结构包含一具有一第一表面的基部、连接于该基部的一电极部、设置于该第一表面上的一对内电极、一对外电极、一对导电柱、一发光二极管芯片以及一覆盖层。各外电极包含一端面段与一侧面段，所述端面段相对应于所述内电极而设置于电极部的第二表面上。各所述侧面段位于相对应的该电极部的该侧面。所述导电柱穿设于所述内电极与所述外电极之间。发光二极管芯片设置于该第一表面上，且电性连接所述内电极。覆盖层覆盖于该发光二极管芯片。本发明结合捞槽技术与板材贴合技术，使发光二极管可以正向与侧向等方式安装，且使其检测上更为便利。

Description

发光二极管封装结构及其制备方法
技术领域
本发明涉及一种发光二极管封装，特别涉及一种发光二极管封装结构及其制备方法。
背景技术
现今，便携式移动装置如笔记本电脑、个人数字助理(Persnal Digital Assistant)或手机等陆陆续续地采用以发光二极管为光源的背光模块作为其显示用的照明。随着这些便携式移动装置往轻、薄发展，使得运用于其上的发光二极管的体积也必须变得更小。
为上述的目的，美国专利申请第2006/0,284,207号揭示一种发光二极管封装结构，其包含一基板、形成于该基板上的一内电极、设置于该基板上的一发光二极管以及覆盖该发光二极管与该基板的一覆盖材料。前述的发光二极管封装结构另具有垂直电极及设于背面的外电极，垂直电极连接于前述的内电极与外电极，借此导通内电极与外电极。然而，由于前述的发光二极管封装结构的体积小，因此其外电极小，不利于外部电性连接或电性检测。而且，由于外部电极位于背面，使得前述的发光二极管封装结构的安装方式受限。
由于传统上小体积的发光二极管仍未臻完善，因此有必要提供新的无前述缺陷的小体积的发光二极管。
发明内容
鉴于前述的缺陷，本发明提供一种发光二极管封装结构及其制备方法。本发明揭示的方法结合捞槽技术与板材贴合技术，使发光二极管可以正向与侧向等方式安装，且使其检测上更为便利。
本发明一实施例揭示一种发光二极管封装结构，其包含一基部、一电极部、一对内电极、一对外电极、一对导电柱、一发光二极管芯片以及一覆盖层。基部具有一第一表面。电极部连接于该基部，且位于该第一表面的相反侧。电极部具有与该第一表面相对的一第二表面及周绕该第二表面的一侧面。所述内电极设置于该第一表面上。各外电极包含一端面段与一侧面段，其中该侧面段自该端面段延伸。所述端面段相对应于所述内电极设置于该第二表面。各所述侧面段位于相对应的该电极部的该侧面。所述导电柱穿设于所述内电极与所述外电极之间。发光二极管芯片设置于该第一表面上，且电性连接所述内电极。覆盖层覆盖于该发光二极管芯片。
本发明一实施例揭示一种发光二极管封装结构的制备方法，该方法包含下列步骤：提供一第一基板，其包含一第一金属层；于该第一基板上，形成多条贯穿的沟槽，以获得多条条状结构；提供一第二基板，包含一第二金属层；接合该第一基板与该第二基板，其中该第一金属层与该第二金属层位于外侧；蚀刻该第一金属层与该第二金属层，使得各所述条状结构上形成两分离的条状第一金属层，且在第二基板上形成相对应的两条状第二金属层；于各相对应的该第一金属层与该第二金属层间，形成多个导电柱；电镀所述条状第一金属层与所述条状第二金属层，以获得相对应的多条外电极层与多条内电极层；根据所述导电柱的位置，将多个发光二极管芯片沿各所述条状结构电性连接于相邻的所述内电极层；形成一覆盖层覆盖所述发光二极管芯片上；于该覆盖层上，沿所述沟槽与沿横向于该沟槽排列的相邻两列的所述发光二极管芯片之间，形成多道纵横交错的切割道；模塑该切割道，以形成一格状件；以及沿该格状件的各框架进行切割。
综上所述，相较于公知发光二极管的封装方法，本发明揭示的方法结合捞槽技术与板材贴合技术，使发光二极管可以正向与侧向等方式安装，且使其检测上更为便利。
附图说明
图1显示本发明一实施例的发光二极管封装结构的俯视示意图；
图2显示本发明一实施例的发光二极管封装结构的仰视示意图；
图3为图1沿A-A剖面线的剖视示意图；
图4至图15显示本发明一实施例的发光二极管封装结构的制造流程示意图；及
图16显示本发明另一实施例的发光二极管封装结构的剖视示意图。
上述附图中的附图标记说明如下：
1、1′发光二极管封装结构
11基部
12电极部
13导电柱
14内电极
15外电极
16、16′发光二极管芯片
17覆盖层
18反射件
19贯穿孔
20导线
21、21′第一基板
22、22′、22″第一金属层
23沟槽
24第二基板
25、25′第二金属层
26内电极层
27外电极层
28条状结构
29黏胶
30切割道
31凸块
32格状件
111第一表面
121第二表面
122侧面
151端面段
152侧面段
具体实施方式
参照图1至图3，本发明一实施例揭示一种发光二极管封装结构1，其包含一基部11、一电极部12、一对导电柱13、一对内电极14、一对外电极15、一发光二极管芯片16、一覆盖层17以及一反射件18。基部11具有一第一表面111，发光二极管芯片16设置于该第一表面111。电极部12连接于基部11，且如图3所示，位于第一表面111的相反侧。
参照图3所示，电极部12具有一第二表面121和一侧面122，第二表面121相对于第一表面111呈反向设置，又侧面122周绕着该第二表面121。一对贯穿孔19穿设于基部11和电极部12，并介于第一表面111与第二表面121之间。各贯穿孔19中形成相对应的导电柱13。一对内电极14设置于第一表面111上，相对应于贯穿孔19设置，并与导电柱13相连接。各外电极15包含一端面段151以及一侧面段152，各所述端面段151位于第二表面121上，相对应于贯穿孔19设置，并连接相对应的导电柱13。各外电极15的侧面段152则自该端面段151延伸，而形成于电极部12的侧面122的表面。通过导电柱13的连接，使一对内电极14可分别地与一对外电极15电性连接。
再次参照图3所示，在本发明实施例中，发光二极管芯片16设置于一对内电极14之一的上方，并以一导线20连接该发光二极管芯片16与该一对内电极14的另一个上。反射件18设置于基部11的第一表面111上，围绕于该发光二极管芯片16，借此可将发光二极管芯片16的侧向发光往反射件18开口处反射，以增进本发明发光二集体封装结构1的发光效率。覆盖层17填充于反射件18内，覆盖着发光二极管芯片16及第一表面111。
特而言之，本发明实施例中，基部11可从印刷电路板或陶瓷基板裁切而成，其可为长方体形状。电极部12也可从印刷电路板或陶瓷基板裁切而成，其也可具有长方体形状，其宽度可与基部11的宽度相当，而其长度可小于基部11的长度。基部11与电极部12间可利用一黏胶29黏接。内电极14与外电极15的材料可包含镍金或镍银等的合金。导通内电极14与外电极15的导电柱13的材料可为导电胶，其可包含环氧树脂及掺杂于其中的银粉末。外电极15分别形成于导电柱13的一端，并向垂直电极部12长轴的两端部表面延伸，如此外电极15的外形为L形的带状。覆盖层17可为一荧光层，荧光层可吸收部分发光二极管芯片16的发光，产生可互补发光二极管芯片16的发光的光线。反射件18为反射材料所制作，其可包含二氧化钛。
图4至图15为一工艺流程结构示意图，其显示本发明一实施例所揭示的一种发光二极管封装结构的制备方法。参照图4所示，本实施例揭示的方法首先提供一第一基板21，其中第一基板21可为印刷电路板或陶瓷基板。然后，在第一基板21的一表面上形成一第一金属层22，其中该第一金属层22可为一铜箔。
图5A显示本发明一实施例的一第一基板21′的俯视示意图，而图5B为图5A沿B-B剖面线的剖视图。利用捞槽技术，形成具有多条沿一特定方向上间隔排列的贯穿沟槽23的第一基板21′。换言之，多条沟槽的形成，使第一基板21′分割出多条条状结构28，其中各条状结构28沿横向于该特定方向上延伸。沟槽23也贯穿原第一金属层，使第一金属层22′上具有多条状镂空。
参照图6所示，提供一第二基板24，且在第二基板24上形成一第二金属层25，其中该第二金属层25可为铜箔。接着，利用黏胶29将第一基板21′与第二基板24黏合，其中第一金属层22′与第二金属层25分别位于两相反的外侧。
参照图7所示，利用蚀刻技术，将第一金属层22′与第二金属层25分别蚀刻成位置上彼此相对应且独立的多条状第一金属层22″与多条状第二金属层25′。
参照图8所示，利用机械钻孔或激光钻孔的方法，沿各条状结构28的纵向上(垂直纸面方向)，在两第二金属层25′的位置，形成多对成对的贯穿孔19。特言之，所述贯穿孔19在横向于条状结构28的方向上可对齐。成对的贯穿孔19于条状结构28的纵向上可以等间距方式排列。
参照图9所示，将导电胶分别填充于各贯穿孔19，待导电胶凝固后，形成多根导电柱13。前述的导电胶可包含环氧树脂及混合于其中的银粉末。
参照图10所示，利用电镀技术，电镀第一金属层22″与第二金属层25′的表面。电镀工艺使各第一金属层22″处形成相对应的条状外电极层27，其中由于各条状结构28旁的侧面上同时电镀有金属层，使各外电极层27的横向截面具有L外形。同样地，电镀工艺也使第二金属层25′上形成条状内电极层26，其中内电极层26与外电极层27可通过导电柱13电性导通。内电极层26与外电极层27可包含镍金或镍银等合金。
参照图11所示，多个发光二极管芯片16沿条状结构28的纵向及横向上设置在内电极层26上。各发光二极管芯片16位于内电极层26和一导电柱13的连接所在，且以至少一导线20于条状结构28的横向上电性连接位于同一条状结构28上的另一内电极层26及相邻导电柱13的连接位置所在。换言之，各发光二极管芯片16位于成对的一导电柱13的位置上且电性连接内电极层26，然后利用一导线20电性连接至同对的另一导电柱13的位置上的内电极层26。
参照图12所示，利用传递成型(transfer molding)或射出成型(injection molding)将覆盖层17形成在第二基板24上，并覆盖所述发光二极管芯片16及所述内电极层26。覆盖层17可为具有荧光粉的透明胶层，例如掺杂荧光粉的环氧树脂。
参照图13所示，在相对应于条状结构28间的沟槽23的位置上，以及横向于沟槽23排列的相邻两列的发光二极管芯片16之间的位置上，以切割的方法形成多道纵横交错的切割道30于覆盖层17上。参照图14所示，利用传递成型(transfer molding)或射出成型(injection molding)将图13所示的切割道30，以反射材料填充。待固化后，即形成一格状件32。格状件32的高度可与覆盖层17的高度相当。格状件32的材料可包含二氧化钛等反光性佳的材料。
参照图15所示，最后沿格状件32的各框架，在约略等分的位置上，将格状件32及其下方的第二基板24切断，即可获得多个独立具有反射件18的发光二极管封装结构1。
参照图16所示，本发明另一实施例揭示一种发光二极管封装结构1′包含一基部11、一电极部12、一对导电柱13、一对内电极14、一对外电极15、一发光二极管芯片16、一覆盖层17以及一反射件18。电极部12连接于基部11，且位于第一表面111的相反侧。导电柱13贯穿第一表面111及第二表面121，内电极14与外电极15分别形成于相对应的导电柱13的两端，使内电极14与外电极15可通过导电柱13电性连接。
发光二极管芯片16′以倒装芯片接合的方式，以凸块31电性连接于内电极14。反射件18设置于基部11的第一表面111上，围绕于该发光二极管芯片16′，借此可将发光二极管芯片16的侧向发光，往反射件18开口处反射。覆盖层17填充于反射件18内，覆盖着发光二极管芯片16及第一表面111。
综上所述，相较于公知发光二极管的封装方法，本发明一实施例揭示的方法结合捞槽技术与板材贴合技术，使发光二极管可以正向与侧向等方式安装，且使其检测上更为便利。
本发明的技术内容及技术特点已揭示如上，然而本领域普通技术人员仍可能基于本发明的教导及揭示而作种种不背离本发明精神的替换及修饰。因此，本发明的保护范围应不限于实施例所揭示，而应包括各种不背离本发明的替换及修饰，并为所附的权利要求所涵盖。

Claims (10)

1.一种发光二极管封装结构，包含：
一基部，具有一第一表面；
一电极部，连接于该基部，且位于该第一表面的相反侧，该电极部具有与该第一表面相对的一第二表面及周绕该第二表面的一侧面；
一对内电极，设置于该第一表面上；
一对外电极，各所述外电极包含一端面段与一侧面段，所述端面段设置于该第二表面且相对应于所述内电极，而各所述侧面段位于相对应的该电极部的该侧面；
一对导电柱，穿设于所述内电极与所述外电极之间；
一发光二极管芯片，设置于该第一表面上，且电性连接所述内电极；以及
一覆盖层，覆盖于该发光二极管芯片。
2.根据权利要求1所述的发光二极管封装结构，其还包含一反射件及一黏胶，该反射件设置于该第一表面并围绕于该发光二极管芯片，其中该反射件包含二氧化钛；该基部与该电极部以该黏胶接合，且该基部与该电极部包含印刷电路板或陶瓷基板。
3.根据权利要求1所述的发光二极管封装结构，其中该内电极与该外电极的材料是镍金或镍银，而该导电柱包含环氧树脂及银粉。
4.根据权利要求1所述的发光二极管封装结构，其还包含一导线，其中该发光二极管芯片设置于所述内电极之一上，而该导线连接该发光二极管芯片与所述内电极的另一个。
5.根据权利要求1所述的发光二极管封装结构，其中该发光二极管芯片是倒装芯片接合于所述内电极。
6.一种发光二极管封装结构的制备方法，包含下列步骤：
提供一具有一第一金属层的第一基板；
于该第一基板上，形成多条贯穿的沟槽，以获得多条条状结构；
提供一具有第二金属层的第二基板；
接合该第一基板与该第二基板，其中该第一金属层与该第二金属层位于外侧；
蚀刻该第一金属层与该第二金属层，使得各所述条状结构上形成两分离的条状第一金属层，且在第二基板上形成相对应的两条状第二金属层；
于各相对应的该第一金属层与该第二金属层间，形成多个导电柱；
电镀所述条状第一金属层与所述条状第二金属层，以获得相对应的多条外电极层与多条内电极层；
根据所述导电柱的位置，将多个发光二极管芯片沿各所述条状结构电性连接于相邻的所述内电极层；
形成一覆盖层覆盖所述发光二极管芯片上；
于该覆盖层上，沿所述沟槽与沿横向于该沟槽排列的相邻两列的所述发光二极管芯片之间，形成多道纵横交错的切割道；
模塑该切割道，以形成一格状件；以及
沿该格状件的各框架进行切割。
7.根据权利要求6所述的发光二极管封装结构的制备方法，其中将多个发光二极管芯片电性连接于相邻的所述内电极层的该步骤，包含下列步骤：
根据所述导电柱的位置，将多个发光二极管芯片沿各所述条状结构排列于相邻的所述内电极层之一上；以及
根据所述导电柱的位置，利用一导线将各所述发光二极管芯片电性连接于相邻的所述内电极层的另一个。
8.根据权利要求6所述的发光二极管封装结构的制备方法，其中各所述发光二极管芯片根据所述导电柱的所述位置，倒装芯片接合于两相邻的所述内电极层。
9.根据权利要求6所述的发光二极管封装结构的制备方法，其中该格状件与该覆盖层利用传递成型或射出成型而模塑形成；且该格状件包含二氧化钛，该内电极层与该外电极层的材料是镍金或镍银，而该导电柱包含环氧树脂及银粉。
10.根据权利要求6所述的发光二极管封装结构的制备方法，其中接合该第一基板与该第二基板的该步骤包含以一黏胶接合该第一基板与该第二基板的步骤，其中该第一基板与该第二基板包含印刷电路板或陶瓷基板。
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US8551794B2 (en) 2013-10-08

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