CN1871692B - 片材剥离装置及剥离方法 - Google Patents

片材剥离装置及剥离方法 Download PDF

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Publication number
CN1871692B
CN1871692B CN2004800308318A CN200480030831A CN1871692B CN 1871692 B CN1871692 B CN 1871692B CN 2004800308318 A CN2004800308318 A CN 2004800308318A CN 200480030831 A CN200480030831 A CN 200480030831A CN 1871692 B CN1871692 B CN 1871692B
Authority
CN
China
Prior art keywords
sheet
peeling
adhesive tape
angle
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004800308318A
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English (en)
Chinese (zh)
Other versions
CN1871692A (zh
Inventor
辻本正树
吉冈孝久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN1871692A publication Critical patent/CN1871692A/zh
Application granted granted Critical
Publication of CN1871692B publication Critical patent/CN1871692B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2004800308318A 2003-10-27 2004-10-21 片材剥离装置及剥离方法 Expired - Fee Related CN1871692B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP365859/2003 2003-10-27
JP2003365859A JP4494753B2 (ja) 2003-10-27 2003-10-27 シート剥離装置及び剥離方法
PCT/JP2004/015581 WO2005041282A1 (ja) 2003-10-27 2004-10-21 シート剥離装置及び剥離方法

Publications (2)

Publication Number Publication Date
CN1871692A CN1871692A (zh) 2006-11-29
CN1871692B true CN1871692B (zh) 2010-06-09

Family

ID=34510197

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800308318A Expired - Fee Related CN1871692B (zh) 2003-10-27 2004-10-21 片材剥离装置及剥离方法

Country Status (8)

Country Link
US (1) US7686916B2 (enExample)
EP (1) EP1679739B1 (enExample)
JP (1) JP4494753B2 (enExample)
KR (1) KR101059430B1 (enExample)
CN (1) CN1871692B (enExample)
SG (1) SG147455A1 (enExample)
TW (1) TW200518215A (enExample)
WO (1) WO2005041282A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4541237B2 (ja) * 2005-06-29 2010-09-08 リンテック株式会社 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置
JP4697014B2 (ja) * 2006-04-06 2011-06-08 株式会社デンソー 半導体装置の製造方法および半導体製造装置。
JP2011116486A (ja) * 2009-12-02 2011-06-16 Sharp Corp フィルム剥離装置
JP5563349B2 (ja) * 2010-03-30 2014-07-30 日本板硝子株式会社 転写体の製造方法
KR101929527B1 (ko) * 2012-09-17 2018-12-17 삼성디스플레이 주식회사 필름 박리 장치
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
CN107210247A (zh) * 2014-11-19 2017-09-26 康宁股份有限公司 包括剥离的加工方法
JP2016160072A (ja) * 2015-03-04 2016-09-05 株式会社ジャパンディスプレイ 剥離装置及び剥離ヘッド
WO2017043862A1 (ko) * 2015-09-07 2017-03-16 주식회사 엘지화학 판상 물질의 박리 장치
JP2017224671A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 剥離装置
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
JP6954611B2 (ja) * 2017-11-13 2021-10-27 Uht株式会社 テープ貼付装置及びテープ貼付方法
JP7033310B2 (ja) * 2018-04-27 2022-03-10 三星ダイヤモンド工業株式会社 端材除去機構並びに端材除去方法
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
JP2022074816A (ja) * 2020-11-05 2022-05-18 三菱電機株式会社 清掃装置および清掃方法
CN115256539B (zh) * 2021-03-31 2024-05-17 苏州壬和控股有限公司 一种保护膜的零损伤式加工设备
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
JP2023059151A (ja) * 2021-10-14 2023-04-26 株式会社東京精密 ワーク加工装置
TWI803340B (zh) * 2022-06-07 2023-05-21 精材科技股份有限公司 撕膠設備及其操作方法
CN115876689B (zh) * 2022-12-30 2024-04-05 浙江京华激光科技股份有限公司 一种剥离性能检测设备及剥离检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310442A (en) * 1991-05-13 1994-05-10 Nitto Denko Corporation Apparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfaces
CN1203181A (zh) * 1997-06-20 1998-12-30 琳得科株式会社 移去薄片的设备和方法
CN1412830A (zh) * 2001-10-19 2003-04-23 富士通株式会社 半导体衬底夹具和半导体器件的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302572A (ja) * 1993-04-12 1994-10-28 Hitachi Ltd 半導体装置の製造方法及びテープ貼付剥離装置
JP4204653B2 (ja) * 1997-06-20 2009-01-07 リンテック株式会社 シート剥離装置および方法
KR100420390B1 (ko) * 1998-09-11 2004-02-26 히다찌 가세이 고오교 가부시끼가이샤 적층 장치 및 적층 방법
DE19845624C1 (de) 1998-10-05 2000-05-11 Duerkopp Adler Ag Nähanlage zur Herstellung einer paspelierten Taschenöffnung
JP2001291760A (ja) * 2000-01-31 2001-10-19 Hitachi Chem Co Ltd 剥離方法及び剥離用テープ
JP4166920B2 (ja) 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
JP3880397B2 (ja) 2001-12-27 2007-02-14 日東電工株式会社 保護テープの貼付・剥離方法
JP3990264B2 (ja) * 2002-12-10 2007-10-10 富士フイルム株式会社 保護シート剥離装置
JP2004349591A (ja) * 2003-05-26 2004-12-09 Shinko Electric Ind Co Ltd 接着剤付きウェーハの製造方法及び製造装置
JP4538242B2 (ja) * 2004-01-23 2010-09-08 株式会社東芝 剥離装置及び剥離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310442A (en) * 1991-05-13 1994-05-10 Nitto Denko Corporation Apparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfaces
CN1203181A (zh) * 1997-06-20 1998-12-30 琳得科株式会社 移去薄片的设备和方法
CN1412830A (zh) * 2001-10-19 2003-04-23 富士通株式会社 半导体衬底夹具和半导体器件的制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-302572A 1994.10.28

Also Published As

Publication number Publication date
KR101059430B1 (ko) 2011-08-25
JP4494753B2 (ja) 2010-06-30
US7686916B2 (en) 2010-03-30
TW200518215A (en) 2005-06-01
EP1679739B1 (en) 2015-06-24
SG147455A1 (en) 2008-11-28
EP1679739A1 (en) 2006-07-12
WO2005041282A1 (ja) 2005-05-06
CN1871692A (zh) 2006-11-29
EP1679739A4 (en) 2010-01-13
US20090014124A1 (en) 2009-01-15
JP2005129829A (ja) 2005-05-19
TWI376738B (enExample) 2012-11-11
KR20060121917A (ko) 2006-11-29

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100609