CN1854743B - 在线电子束测试系统 - Google Patents

在线电子束测试系统 Download PDF

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Publication number
CN1854743B
CN1854743B CN2006100790744A CN200610079074A CN1854743B CN 1854743 B CN1854743 B CN 1854743B CN 2006100790744 A CN2006100790744 A CN 2006100790744A CN 200610079074 A CN200610079074 A CN 200610079074A CN 1854743 B CN1854743 B CN 1854743B
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CN
China
Prior art keywords
test
substrate
area
chamber
substrate support
Prior art date
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Expired - Lifetime
Application number
CN2006100790744A
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English (en)
Chinese (zh)
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CN1854743A (zh
Inventor
法耶茨·E·阿波德
西拉姆·克里施纳斯瓦弥
本杰明·M·约翰斯通
亨·T·恩古尹
麦特瑟斯·波拉纳
拉尔夫·施密德
约翰·M·怀特
栗田伸一
詹姆斯·C·亨特
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of CN1854743A publication Critical patent/CN1854743A/zh
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Publication of CN1854743B publication Critical patent/CN1854743B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2809—Scanning microscopes characterised by the imaging problems involved
    • H01J2237/2811—Large objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN2006100790744A 2005-04-29 2006-04-29 在线电子束测试系统 Expired - Lifetime CN1854743B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67655805P 2005-04-29 2005-04-29
US60/676,558 2005-04-29
US11/375,625 2006-03-14
US11/375,625 US7535238B2 (en) 2005-04-29 2006-03-14 In-line electron beam test system

Publications (2)

Publication Number Publication Date
CN1854743A CN1854743A (zh) 2006-11-01
CN1854743B true CN1854743B (zh) 2012-12-12

Family

ID=37195046

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100790744A Expired - Lifetime CN1854743B (zh) 2005-04-29 2006-04-29 在线电子束测试系统

Country Status (5)

Country Link
US (3) US7535238B2 (https=)
JP (1) JP2006317437A (https=)
KR (1) KR101255750B1 (https=)
CN (1) CN1854743B (https=)
TW (1) TWI277759B (https=)

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* Cited by examiner, † Cited by third party
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US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US8115506B2 (en) * 2007-05-14 2012-02-14 Applied Materials, Inc. Localization of driver failures within liquid crystal displays
EP2180327A1 (en) 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
EP2390906A1 (en) 2010-05-26 2011-11-30 Applied Materials, Inc. Apparatus and method for electrostatic discharge (ESD) reduction
WO2013012616A2 (en) 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
KR102119930B1 (ko) * 2014-08-31 2020-06-08 케이엘에이 코포레이션 복수의 이동가능한 빔 칼럼을 갖는 이미징 장치 및 실질적으로 일치하도록 의도된 기판의 복수의 영역을 검사하는 방법
WO2018187674A1 (en) 2017-04-06 2018-10-11 Cve Technology Group, Inc. Novel automated functional testing systems and methods of making and using the same
US10663382B2 (en) * 2018-08-30 2020-05-26 Canada Scaffold Supply Co. Ltd. Testing apparatus for applying test load using vacuum pressure
CN119375567A (zh) * 2023-07-25 2025-01-28 Jcet星科金朋韩国有限公司 用于测试电子器件的设备

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US20060244467A1 (en) 2006-11-02
US7535238B2 (en) 2009-05-19
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US20100327162A1 (en) 2010-12-30
US7973546B2 (en) 2011-07-05
JP2006317437A (ja) 2006-11-24
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KR101255750B1 (ko) 2013-04-17
US20090195262A1 (en) 2009-08-06

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