CN1848420A - 用于半导体封装的引线框 - Google Patents
用于半导体封装的引线框 Download PDFInfo
- Publication number
- CN1848420A CN1848420A CNA2005101070604A CN200510107060A CN1848420A CN 1848420 A CN1848420 A CN 1848420A CN A2005101070604 A CNA2005101070604 A CN A2005101070604A CN 200510107060 A CN200510107060 A CN 200510107060A CN 1848420 A CN1848420 A CN 1848420A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- coating
- thickness
- surface roughness
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02F—DREDGING; SOIL-SHIFTING
- E02F9/00—Component parts of dredgers or soil-shifting machines, not restricted to one of the kinds covered by groups E02F3/00 - E02F7/00
- E02F9/02—Travelling-gear, e.g. associated with slewing gears
- E02F9/022—Travelling-gear, e.g. associated with slewing gears for moving on rails
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
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- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02F—DREDGING; SOIL-SHIFTING
- E02F9/00—Component parts of dredgers or soil-shifting machines, not restricted to one of the kinds covered by groups E02F3/00 - E02F7/00
- E02F9/20—Drives; Control devices
- E02F9/2058—Electric or electro-mechanical or mechanical control devices of vehicle sub-units
- E02F9/2062—Control of propulsion units
- E02F9/207—Control of propulsion units of the type electric propulsion units, e.g. electric motors or generators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
- H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48663—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/48664—Palladium (Pd) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/85464—Palladium (Pd) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050031420A KR100819800B1 (ko) | 2005-04-15 | 2005-04-15 | 반도체 패키지용 리드 프레임 |
KR1020050031420 | 2005-04-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1848420A true CN1848420A (zh) | 2006-10-18 |
CN100527404C CN100527404C (zh) | 2009-08-12 |
Family
ID=37055660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101070604A Active CN100527404C (zh) | 2005-04-15 | 2005-09-29 | 用于半导体封装的引线框 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7285845B2 (zh) |
JP (1) | JP2006303492A (zh) |
KR (1) | KR100819800B1 (zh) |
CN (1) | CN100527404C (zh) |
DE (1) | DE102006017042B4 (zh) |
MY (1) | MY141288A (zh) |
TW (1) | TWI397981B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100464416C (zh) * | 2007-04-29 | 2009-02-25 | 江苏长电科技股份有限公司 | 防止半导体塑料封装体内元器件分层的封装方法 |
CN100466245C (zh) * | 2007-04-29 | 2009-03-04 | 江苏长电科技股份有限公司 | 有效改善半导体塑料封装体内元器件分层的封装方法 |
CN100483705C (zh) * | 2007-04-29 | 2009-04-29 | 江苏长电科技股份有限公司 | 可以防止半导体塑料封装体内元器件分层的封装方法 |
CN102817055A (zh) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | 引线框超薄镀钯镀金工艺 |
CN104157626A (zh) * | 2014-01-28 | 2014-11-19 | 林俊明 | 具有粗化表面的电子组件支架 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100989802B1 (ko) * | 2006-11-29 | 2010-10-29 | 유니마이크론 테크놀로지 코퍼레이션 | 반도체 소자가 매립된 지지 기판 적층 구조체 및 그제조방법 |
KR101289803B1 (ko) | 2008-05-16 | 2013-07-26 | 삼성테크윈 주식회사 | 회로 기판 및 그 제조 방법 |
KR101241735B1 (ko) * | 2008-09-05 | 2013-03-08 | 엘지이노텍 주식회사 | 리드 프레임 및 그 제조방법 |
JP4853508B2 (ja) * | 2008-11-05 | 2012-01-11 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
KR101426038B1 (ko) | 2008-11-13 | 2014-08-01 | 주식회사 엠디에스 | 인쇄회로기판 및 그 제조방법 |
TWI359714B (en) * | 2008-11-25 | 2012-03-11 | Univ Yuan Ze | Method for inhibiting the formation of palladium-n |
KR101072233B1 (ko) * | 2009-03-17 | 2011-10-12 | 엘지이노텍 주식회사 | 반도체 패키지 및 그 제조방법 |
US8304868B2 (en) | 2010-10-12 | 2012-11-06 | Texas Instruments Incorporated | Multi-component electronic system having leadframe with support-free with cantilever leads |
KR101175982B1 (ko) * | 2011-06-29 | 2012-08-23 | 엘지이노텍 주식회사 | 다열 리드 프레임 및 그 제조방법 |
JP5408457B2 (ja) * | 2011-09-02 | 2014-02-05 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
KR101802851B1 (ko) | 2013-03-11 | 2017-11-29 | 해성디에스 주식회사 | 리드 프레임, 이를 포함하는 반도체 패키지, 및 리드 프레임의 제조 방법 |
EP2992553A4 (en) | 2013-05-03 | 2017-03-08 | Honeywell International Inc. | Lead frame construct for lead-free solder connections |
DE102014211298A1 (de) | 2014-06-13 | 2015-12-17 | Robert Bosch Gmbh | Substrat mit einer Oberflächenbeschichtung und Verfahren zum Beschichten einer Oberfläche eines Substrates |
DE102016117389B4 (de) * | 2015-11-20 | 2020-05-28 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleiterchip und Verfahren zur Herstellung eines Leistungshalbleiterchips und Leistungshalbleitereinrichtung |
JP6724851B2 (ja) | 2017-04-14 | 2020-07-15 | 株式会社デンソー | 基材、それを用いたモールドパーケージ、基材の製造方法、およびモールドパッケージの製造方法 |
JP6667728B2 (ja) * | 2018-03-23 | 2020-03-18 | 古河電気工業株式会社 | リードフレーム材およびその製造方法、ならびにそれを用いた半導体パッケージ |
WO2020217787A1 (ja) * | 2019-04-22 | 2020-10-29 | Ngkエレクトロデバイス株式会社 | 金属部材およびその製造方法 |
US20240124999A1 (en) | 2022-09-26 | 2024-04-18 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions for rough nickel |
US20240117516A1 (en) | 2022-09-26 | 2024-04-11 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions for rough nickel |
Family Cites Families (29)
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JPS59168659A (ja) | 1983-03-15 | 1984-09-22 | Furukawa Electric Co Ltd:The | 集積回路用リ−ドフレ−ム |
JPH01162252U (zh) * | 1988-04-22 | 1989-11-10 | ||
JPH05315511A (ja) * | 1991-12-25 | 1993-11-26 | Nikko Kinzoku Kk | リードフレーム材およびその製造方法 |
JP3693300B2 (ja) * | 1993-09-03 | 2005-09-07 | 日本特殊陶業株式会社 | 半導体パッケージの外部接続端子及びその製造方法 |
JPH09232493A (ja) * | 1995-12-20 | 1997-09-05 | Seiichi Serizawa | リードフレーム |
KR970067816A (ko) * | 1996-03-26 | 1997-10-13 | 이대원 | 집적회로용 리드프레임 및 그 제조방법 |
KR0183645B1 (ko) * | 1996-03-26 | 1999-03-20 | 이대원 | 다층 구조의 도금층을 구비한 반도체 리드 프레임 |
JPH1070224A (ja) * | 1996-08-27 | 1998-03-10 | Daido Steel Co Ltd | Icリードフレーム材およびその製造方法 |
CN1122304C (zh) * | 1997-02-10 | 2003-09-24 | 松下电器产业株式会社 | 树脂封装型半导体装置的制造方法 |
KR100231828B1 (ko) * | 1997-02-20 | 1999-12-01 | 유무성 | 다층 도금 리드프레임 |
US5994767A (en) * | 1997-04-09 | 1999-11-30 | Sitron Precision Co., Ltd. | Leadframe for integrated circuit package and method of manufacturing the same |
JP3642545B2 (ja) | 1997-05-20 | 2005-04-27 | 株式会社ルネサステクノロジ | 樹脂封止型半導体装置 |
KR100231838B1 (ko) * | 1997-05-20 | 1999-12-01 | 유무성 | 집적회로용 리드프레임 및 그 제조방법 |
CN1068064C (zh) * | 1997-05-27 | 2001-07-04 | 旭龙精密工业股份有限公司 | 引线框架及其制造方法 |
KR100275381B1 (ko) * | 1998-04-18 | 2000-12-15 | 이중구 | 반도체 패키지용 리드프레임 및 리드프레임도금방법 |
US6087714A (en) * | 1998-04-27 | 2000-07-11 | Matsushita Electric Industrial Co., Ltd. | Semiconductor devices having tin-based solder film containing no lead and process for producing the devices |
JP2000077594A (ja) * | 1998-09-03 | 2000-03-14 | Hitachi Cable Ltd | 半導体装置用リードフレーム |
JP2000124361A (ja) * | 1998-10-12 | 2000-04-28 | Hitachi Cable Ltd | 接着剤塗布Cu条、高放熱性リードフレーム及び高放熱性パッケージ |
US6469386B1 (en) * | 1999-10-01 | 2002-10-22 | Samsung Aerospace Industries, Ltd. | Lead frame and method for plating the same |
JP2002246534A (ja) * | 2001-02-20 | 2002-08-30 | Hitachi Cable Ltd | 複合リードフレームおよびその製造方法 |
KR100378489B1 (ko) * | 2001-03-16 | 2003-03-29 | 삼성테크윈 주식회사 | 은 또는 은 합금도금을 이용한 반도체 패키지용 리드프레임 및 그 제조방법 |
JP2003023132A (ja) * | 2001-07-10 | 2003-01-24 | Sony Corp | リードフレームおよび電子回路装置、並びにその製造方法 |
JP2003309242A (ja) * | 2002-04-15 | 2003-10-31 | Dainippon Printing Co Ltd | リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法 |
JP4043834B2 (ja) * | 2002-05-02 | 2008-02-06 | 古河電気工業株式会社 | めっき材料とその製造方法、それを用いた電気・電子部品 |
US6828660B2 (en) | 2003-01-17 | 2004-12-07 | Texas Instruments Incorporated | Semiconductor device with double nickel-plated leadframe |
JP3916586B2 (ja) * | 2003-05-16 | 2007-05-16 | 株式会社三井ハイテック | リードフレームのめっき方法 |
JP3841768B2 (ja) * | 2003-05-22 | 2006-11-01 | 新光電気工業株式会社 | パッケージ部品及び半導体パッケージ |
US6917098B1 (en) * | 2003-12-29 | 2005-07-12 | Texas Instruments Incorporated | Three-level leadframe for no-lead packages |
JP2006049698A (ja) * | 2004-08-06 | 2006-02-16 | Denso Corp | 樹脂封止型半導体装置 |
-
2005
- 2005-04-15 KR KR1020050031420A patent/KR100819800B1/ko active IP Right Grant
- 2005-08-01 US US11/194,285 patent/US7285845B2/en active Active
- 2005-09-29 CN CNB2005101070604A patent/CN100527404C/zh active Active
-
2006
- 2006-04-11 DE DE102006017042.3A patent/DE102006017042B4/de active Active
- 2006-04-12 JP JP2006109553A patent/JP2006303492A/ja active Pending
- 2006-04-13 MY MYPI20061703A patent/MY141288A/en unknown
- 2006-04-14 TW TW095113317A patent/TWI397981B/zh active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100464416C (zh) * | 2007-04-29 | 2009-02-25 | 江苏长电科技股份有限公司 | 防止半导体塑料封装体内元器件分层的封装方法 |
CN100466245C (zh) * | 2007-04-29 | 2009-03-04 | 江苏长电科技股份有限公司 | 有效改善半导体塑料封装体内元器件分层的封装方法 |
CN100483705C (zh) * | 2007-04-29 | 2009-04-29 | 江苏长电科技股份有限公司 | 可以防止半导体塑料封装体内元器件分层的封装方法 |
CN102817055A (zh) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | 引线框超薄镀钯镀金工艺 |
CN102817055B (zh) * | 2012-08-15 | 2015-03-25 | 中山品高电子材料有限公司 | 引线框超薄镀钯镀金工艺 |
CN104157626A (zh) * | 2014-01-28 | 2014-11-19 | 林俊明 | 具有粗化表面的电子组件支架 |
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TW200636963A (en) | 2006-10-16 |
US7285845B2 (en) | 2007-10-23 |
TWI397981B (zh) | 2013-06-01 |
KR20060109122A (ko) | 2006-10-19 |
KR100819800B1 (ko) | 2008-04-07 |
JP2006303492A (ja) | 2006-11-02 |
MY141288A (en) | 2010-04-16 |
DE102006017042A1 (de) | 2006-10-19 |
US20060231931A1 (en) | 2006-10-19 |
CN100527404C (zh) | 2009-08-12 |
DE102006017042B4 (de) | 2014-06-26 |
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