CN1068064C - 引线框架及其制造方法 - Google Patents
引线框架及其制造方法 Download PDFInfo
- Publication number
- CN1068064C CN1068064C CN97113487A CN97113487A CN1068064C CN 1068064 C CN1068064 C CN 1068064C CN 97113487 A CN97113487 A CN 97113487A CN 97113487 A CN97113487 A CN 97113487A CN 1068064 C CN1068064 C CN 1068064C
- Authority
- CN
- China
- Prior art keywords
- lead frame
- layer
- palladium
- silver layer
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (43)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97113487A CN1068064C (zh) | 1997-05-27 | 1997-05-27 | 引线框架及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97113487A CN1068064C (zh) | 1997-05-27 | 1997-05-27 | 引线框架及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1200568A CN1200568A (zh) | 1998-12-02 |
CN1068064C true CN1068064C (zh) | 2001-07-04 |
Family
ID=5172685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97113487A Expired - Fee Related CN1068064C (zh) | 1997-05-27 | 1997-05-27 | 引线框架及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1068064C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1802740B (zh) * | 2003-05-21 | 2011-03-30 | 基奥塞拉美国股份有限公司 | 具有金/银/铜合金的填充金属的半导体封装 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI264099B (en) * | 2001-07-09 | 2006-10-11 | Sumitomo Metal Mining Co | Lead frame and manufacturing method therefor |
US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
KR100819800B1 (ko) * | 2005-04-15 | 2008-04-07 | 삼성테크윈 주식회사 | 반도체 패키지용 리드 프레임 |
KR100702956B1 (ko) * | 2005-04-26 | 2007-04-03 | 삼성테크윈 주식회사 | 반도체 팩키지용 리드프레임 및 그 제조 방법 |
KR101646094B1 (ko) * | 2011-12-12 | 2016-08-05 | 해성디에스 주식회사 | 리드 프레임 및 이를 이용하여 제조된 반도체 패키지 |
CN111199940B (zh) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | 一种用于引线框架的涂覆料涂覆方法 |
CN112376094A (zh) * | 2020-11-06 | 2021-02-19 | 东莞市川富电子有限公司 | 充放电模组块连接端子的功能电镀镀层方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996034412A1 (en) * | 1995-04-27 | 1996-10-31 | National Semiconductor Corporation | Protective coating combination for lead frames |
-
1997
- 1997-05-27 CN CN97113487A patent/CN1068064C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996034412A1 (en) * | 1995-04-27 | 1996-10-31 | National Semiconductor Corporation | Protective coating combination for lead frames |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1802740B (zh) * | 2003-05-21 | 2011-03-30 | 基奥塞拉美国股份有限公司 | 具有金/银/铜合金的填充金属的半导体封装 |
Also Published As
Publication number | Publication date |
---|---|
CN1200568A (zh) | 1998-12-02 |
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C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUSHENG CO., LTD. Free format text: FORMER OWNER: XULONG PRECISION INDUSTRY CO., LTD. Effective date: 20030711 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20030711 Address after: Taipei City, Taiwan, China Patentee after: Fusheng Co., Ltd. Address before: Hsinchu Industrial Zone, Taiwan Patentee before: Xulong Precision Industry Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20010704 Termination date: 20110527 |