CN1775656B - 高密度纳米结构互连 - Google Patents

高密度纳米结构互连 Download PDF

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Publication number
CN1775656B
CN1775656B CN2005100628524A CN200510062852A CN1775656B CN 1775656 B CN1775656 B CN 1775656B CN 2005100628524 A CN2005100628524 A CN 2005100628524A CN 200510062852 A CN200510062852 A CN 200510062852A CN 1775656 B CN1775656 B CN 1775656B
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Prior art keywords
nanostructures
substrate
interconnect structure
nanopillars
forces
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Expired - Fee Related
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CN2005100628524A
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Chinese (zh)
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CN1775656A (zh
Inventor
纳戈什·R.·巴萨万哈利
雷蒙德·A.·司瑞利
奥玛·D.·络皮兹
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Nokia of America Corp
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Lucent Technologies Inc
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    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q9/00—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling
    • B60Q9/008—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling for anti-collision purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
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    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
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    • B60Y2400/00—Special features of vehicle units
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    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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    • H01L2224/161—Disposition
    • H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
    • H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
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    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
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    • H01L2224/8134—Bonding interfaces of the bump connector
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    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Recrystallisation Techniques (AREA)
CN2005100628524A 2004-04-01 2005-03-31 高密度纳米结构互连 Expired - Fee Related CN1775656B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/816,527 2004-04-01
US10/816,527 US7327037B2 (en) 2004-04-01 2004-04-01 High density nanostructured interconnection

Publications (2)

Publication Number Publication Date
CN1775656A CN1775656A (zh) 2006-05-24
CN1775656B true CN1775656B (zh) 2013-06-19

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Country Status (5)

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US (3) US7327037B2 (enExample)
EP (1) EP1583146A3 (enExample)
JP (1) JP2005294844A (enExample)
KR (1) KR101186474B1 (enExample)
CN (1) CN1775656B (enExample)

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CN117769664A (zh) * 2022-06-14 2024-03-26 京东方科技集团股份有限公司 显示面板、超表面透镜及其制备方法
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US7327037B2 (en) 2008-02-05
EP1583146A3 (en) 2005-10-26
KR101186474B1 (ko) 2012-09-27
US20050224975A1 (en) 2005-10-13
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US7560817B2 (en) 2009-07-14
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