CN1775656B - 高密度纳米结构互连 - Google Patents

高密度纳米结构互连 Download PDF

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Publication number
CN1775656B
CN1775656B CN2005100628524A CN200510062852A CN1775656B CN 1775656 B CN1775656 B CN 1775656B CN 2005100628524 A CN2005100628524 A CN 2005100628524A CN 200510062852 A CN200510062852 A CN 200510062852A CN 1775656 B CN1775656 B CN 1775656B
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CN
China
Prior art keywords
nanostructures
substrate
interconnect structure
nanopillars
forces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005100628524A
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English (en)
Chinese (zh)
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CN1775656A (zh
Inventor
纳戈什·R.·巴萨万哈利
雷蒙德·A.·司瑞利
奥玛·D.·络皮兹
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Nokia of America Corp
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Lucent Technologies Inc
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Publication date
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Publication of CN1775656A publication Critical patent/CN1775656A/zh
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    • H10W72/20—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q9/00—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling
    • B60Q9/008—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling for anti-collision purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • H10W72/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2200/00—Type of vehicle
    • B60Y2200/10—Road Vehicles
    • B60Y2200/11—Passenger cars; Automobiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • B60Y2400/301—Sensors for position or displacement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • B60Y2400/303—Speed sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H10W72/072—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/224—
    • H10W72/241—
    • H10W72/244—
    • H10W72/248—
    • H10W72/251—
    • H10W72/253—

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Micromachines (AREA)
CN2005100628524A 2004-04-01 2005-03-31 高密度纳米结构互连 Expired - Fee Related CN1775656B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/816,527 US7327037B2 (en) 2004-04-01 2004-04-01 High density nanostructured interconnection
US10/816,527 2004-04-01

Publications (2)

Publication Number Publication Date
CN1775656A CN1775656A (zh) 2006-05-24
CN1775656B true CN1775656B (zh) 2013-06-19

Family

ID=34887764

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100628524A Expired - Fee Related CN1775656B (zh) 2004-04-01 2005-03-31 高密度纳米结构互连

Country Status (5)

Country Link
US (3) US7327037B2 (enExample)
EP (1) EP1583146A3 (enExample)
JP (1) JP2005294844A (enExample)
KR (1) KR101186474B1 (enExample)
CN (1) CN1775656B (enExample)

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WO2008076391A2 (en) * 2006-12-14 2008-06-26 Carnegie Mellon University Dry adhesives and methods for making dry adhesives
SG149711A1 (en) * 2007-07-12 2009-02-27 Agency Science Tech & Res A method for electrical interconnection and an interconnection structure
TWI362525B (en) * 2007-07-31 2012-04-21 Chunghwa Picture Tubes Ltd Active device array substrate and liquid crystal display panel
US7781260B2 (en) * 2007-09-11 2010-08-24 Intel Corporation Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
FR2923078B1 (fr) * 2007-10-26 2017-09-01 Centre Nat De La Rech Scient - Cnrs Procede de fabrication d'un element d'interconnexion mecanique conducteur d'electricite.
US20090109628A1 (en) * 2007-10-30 2009-04-30 International Business Machines Corporation Chip Cooling System with Convex Portion
US7760507B2 (en) 2007-12-26 2010-07-20 The Bergquist Company Thermally and electrically conductive interconnect structures
DE102008019692B4 (de) * 2008-04-15 2010-08-12 Technische Universität Ilmenau Verfahren zur Integration eines Polymer-Funktionsbauteils in ein Silizium-Mikrosystem
US8728602B2 (en) 2008-04-28 2014-05-20 The Charles Stark Draper Laboratory, Inc. Multi-component adhesive system
US7960653B2 (en) * 2008-07-25 2011-06-14 Hewlett-Packard Development Company, L.P. Conductive nanowires for electrical interconnect
CN101668383B (zh) * 2008-09-03 2013-03-06 富葵精密组件(深圳)有限公司 电路板以及电路板封装结构
US8398909B1 (en) 2008-09-18 2013-03-19 Carnegie Mellon University Dry adhesives and methods of making dry adhesives
JP5239768B2 (ja) * 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
DE102009008772A1 (de) 2009-02-13 2011-01-27 Hochschule Furtwangen University Selbstjustierendes Bondverfahren unter Verwendung nanostrukturierter Oberflächen
WO2010148322A1 (en) * 2009-06-19 2010-12-23 Under Armour, Inc. Nanoadhesion structures for sporting gear
JP4913853B2 (ja) * 2009-08-31 2012-04-11 Ｓｍｋ株式会社 微細コネクタ
DE102009059304B4 (de) 2009-12-23 2014-07-03 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels
KR101909490B1 (ko) * 2012-01-19 2018-10-19 삼성전자주식회사 유연 촉각 센서 장치
US9360029B2 (en) 2013-03-01 2016-06-07 The Boeing Company Frictional Coupling
WO2014205193A1 (en) * 2013-06-21 2014-12-24 University Of Connecticut Low-temperature bonding and sealing with spaced nanorods
CN103896207B (zh) * 2014-04-14 2015-11-18 河南省科学院应用物理研究所有限公司 一种基于力电热耦合的碳纳米管阵列键合方法
DE102017104923A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung für einen Halbleiterchip
TWI766072B (zh) * 2017-08-29 2022-06-01 瑞典商斯莫勒科技公司 能量存儲中介層裝置、電子裝置和製造方法
DE102017122865B3 (de) * 2017-10-02 2019-03-14 Infineon Technologies Ag Verfahren zum Bilden einer metallischen Zwischenverbindung, Verfahren zum Herstellen einer Halbleiteranordnung mit einer metallischen Zwischenverbindung und Halbleitervorrichtungsanordnung mit einer metallischen Zwischenverbindung
CN107833839B (zh) * 2017-10-12 2020-04-24 东南大学 一种基于纳米棒结构的按插式键合单元
DE102017126724A1 (de) * 2017-11-14 2019-05-16 Nanowired Gmbh Verfahren und Verbindungselement zum Verbinden von zwei Bauteilen sowie Anordnung von zwei verbundenen Bauteilen
US10833048B2 (en) * 2018-04-11 2020-11-10 International Business Machines Corporation Nanowire enabled substrate bonding and electrical contact formation
DE102018108616A1 (de) * 2018-04-11 2019-10-17 Osram Opto Semiconductors Gmbh Halbleiterbauteile-Anordnung
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
US11195811B2 (en) 2019-04-08 2021-12-07 Texas Instruments Incorporated Dielectric and metallic nanowire bond layers
DE102019128900B4 (de) * 2019-10-25 2025-05-22 Endress+Hauser SE+Co. KG Verfahren zum Herstellen eines SMD-lötbaren Bauelements, SMD-lötbares Bauelement, Elektronikeinheit und Feldgerät
US11069554B1 (en) * 2020-01-22 2021-07-20 Applied Materials, Inc. Carbon nanotube electrostatic chuck
KR102440998B1 (ko) * 2020-04-16 2022-09-13 주식회사 글린트머티리얼즈 양면 패턴부를 포함하는 템포러리 본딩용 미끄럼 방지 패드
US20240385353A1 (en) * 2022-06-14 2024-11-21 Boe Technology Group Co., Ltd. Display panel, metasurface lens and manufacturing method thereof
EP4372807B1 (en) 2022-11-16 2024-10-16 Infineon Technologies AG Substrate arrangement and methods for producing a substrate arrangement

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EP1320111A1 (en) * 2001-12-11 2003-06-18 Abb Research Ltd. Carbon nanotube contact for MEMS

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EP1320111A1 (en) * 2001-12-11 2003-06-18 Abb Research Ltd. Carbon nanotube contact for MEMS

Also Published As

Publication number Publication date
US7402913B2 (en) 2008-07-22
US7327037B2 (en) 2008-02-05
EP1583146A3 (en) 2005-10-26
US20050224975A1 (en) 2005-10-13
JP2005294844A (ja) 2005-10-20
CN1775656A (zh) 2006-05-24
US7560817B2 (en) 2009-07-14
KR101186474B1 (ko) 2012-09-27
EP1583146A2 (en) 2005-10-05
US20080001306A1 (en) 2008-01-03
US20060097252A1 (en) 2006-05-11
KR20060044769A (ko) 2006-05-16

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