JP2005294844A - 高密度ナノ構造化相互接続 - Google Patents

高密度ナノ構造化相互接続 Download PDF

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Publication number
JP2005294844A
JP2005294844A JP2005105721A JP2005105721A JP2005294844A JP 2005294844 A JP2005294844 A JP 2005294844A JP 2005105721 A JP2005105721 A JP 2005105721A JP 2005105721 A JP2005105721 A JP 2005105721A JP 2005294844 A JP2005294844 A JP 2005294844A
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JP
Japan
Prior art keywords
nanostructures
interconnect
substrate
nanostructured
nanoposts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005105721A
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English (en)
Japanese (ja)
Other versions
JP2005294844A5 (enExample
Inventor
Nagesh R Basavanhally
アール．バサヴァンハリー ナジェッシュ
Raymond A Cirelli
エー．シレリ レイモンド
Omar Daniel Lopez
ダニエル ロペス オマール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of JP2005294844A publication Critical patent/JP2005294844A/ja
Publication of JP2005294844A5 publication Critical patent/JP2005294844A5/ja
Pending legal-status Critical Current

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    • H10W72/20—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q9/00—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling
    • B60Q9/008—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling for anti-collision purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • H10W72/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2200/00—Type of vehicle
    • B60Y2200/10—Road Vehicles
    • B60Y2200/11—Passenger cars; Automobiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • B60Y2400/301—Sensors for position or displacement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • B60Y2400/303—Speed sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H10W72/072—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/224—
    • H10W72/241—
    • H10W72/244—
    • H10W72/248—
    • H10W72/251—
    • H10W72/253—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Recrystallisation Techniques (AREA)
JP2005105721A 2004-04-01 2005-04-01 高密度ナノ構造化相互接続 Pending JP2005294844A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/816,527 US7327037B2 (en) 2004-04-01 2004-04-01 High density nanostructured interconnection

Publications (2)

Publication Number Publication Date
JP2005294844A true JP2005294844A (ja) 2005-10-20
JP2005294844A5 JP2005294844A5 (enExample) 2008-05-15

Family

ID=34887764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005105721A Pending JP2005294844A (ja) 2004-04-01 2005-04-01 高密度ナノ構造化相互接続

Country Status (5)

Country Link
US (3) US7327037B2 (enExample)
EP (1) EP1583146A3 (enExample)
JP (1) JP2005294844A (enExample)
KR (1) KR101186474B1 (enExample)
CN (1) CN1775656B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311700A (ja) * 2006-05-22 2007-11-29 Fujitsu Ltd 半導体装置
JP2009523315A (ja) * 2005-12-22 2009-06-18 インテル コーポレイション ナノ構造をベースとしたパッケージの相互接続
JP2011501454A (ja) * 2007-10-26 2011-01-06 サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク 導電性の機械的相互接続部材を作る方法
JP2021503185A (ja) * 2017-11-14 2021-02-04 ナノワイヤード ゲーエムベーハー ２つの構成要素を結合するための方法及び結合装置、並びに２つの結合された構成要素の配置

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US7327037B2 (en) * 2004-04-01 2008-02-05 Lucent Technologies Inc. High density nanostructured interconnection
US7544977B2 (en) * 2006-01-27 2009-06-09 Hewlett-Packard Development Company, L.P. Mixed-scale electronic interface
US7333699B2 (en) * 2005-12-12 2008-02-19 Raytheon Sarcos, Llc Ultra-high density connector
US7456479B2 (en) * 2005-12-15 2008-11-25 United Microelectronics Corp. Method for fabricating a probing pad of an integrated circuit chip
DE102006031322A1 (de) * 2006-07-06 2007-09-27 Siemens Ag Elektromechanisches Bauteil
US7581994B2 (en) * 2006-08-10 2009-09-01 The Boeing Company Method and assembly for establishing an electrical interface between parts
WO2008076390A2 (en) * 2006-12-14 2008-06-26 Carnegie Mellon University Dry adhesives and methods for making dry adhesives
US8524092B2 (en) * 2006-12-14 2013-09-03 Carnegie Mellon University Dry adhesives and methods for making dry adhesives
SG149711A1 (en) * 2007-07-12 2009-02-27 Agency Science Tech & Res A method for electrical interconnection and an interconnection structure
TWI362525B (en) * 2007-07-31 2012-04-21 Chunghwa Picture Tubes Ltd Active device array substrate and liquid crystal display panel
US7781260B2 (en) * 2007-09-11 2010-08-24 Intel Corporation Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
US20090109628A1 (en) * 2007-10-30 2009-04-30 International Business Machines Corporation Chip Cooling System with Convex Portion
US7760507B2 (en) 2007-12-26 2010-07-20 The Bergquist Company Thermally and electrically conductive interconnect structures
DE102008019692B4 (de) * 2008-04-15 2010-08-12 Technische Universität Ilmenau Verfahren zur Integration eines Polymer-Funktionsbauteils in ein Silizium-Mikrosystem
US8728602B2 (en) 2008-04-28 2014-05-20 The Charles Stark Draper Laboratory, Inc. Multi-component adhesive system
US7960653B2 (en) * 2008-07-25 2011-06-14 Hewlett-Packard Development Company, L.P. Conductive nanowires for electrical interconnect
CN101668383B (zh) * 2008-09-03 2013-03-06 富葵精密组件(深圳)有限公司 电路板以及电路板封装结构
US8398909B1 (en) 2008-09-18 2013-03-19 Carnegie Mellon University Dry adhesives and methods of making dry adhesives
JP5239768B2 (ja) 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
DE102009008772A1 (de) 2009-02-13 2011-01-27 Hochschule Furtwangen University Selbstjustierendes Bondverfahren unter Verwendung nanostrukturierter Oberflächen
WO2010148322A1 (en) 2009-06-19 2010-12-23 Under Armour, Inc. Nanoadhesion structures for sporting gear
JP4913853B2 (ja) * 2009-08-31 2012-04-11 Ｓｍｋ株式会社 微細コネクタ
DE102009059304B4 (de) 2009-12-23 2014-07-03 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels
KR101909490B1 (ko) * 2012-01-19 2018-10-19 삼성전자주식회사 유연 촉각 센서 장치
US9360029B2 (en) 2013-03-01 2016-06-07 The Boeing Company Frictional Coupling
WO2014205193A1 (en) * 2013-06-21 2014-12-24 University Of Connecticut Low-temperature bonding and sealing with spaced nanorods
CN103896207B (zh) * 2014-04-14 2015-11-18 河南省科学院应用物理研究所有限公司 一种基于力电热耦合的碳纳米管阵列键合方法
DE102017104923A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung für einen Halbleiterchip
TWI766072B (zh) * 2017-08-29 2022-06-01 瑞典商斯莫勒科技公司 能量存儲中介層裝置、電子裝置和製造方法
DE102017122865B3 (de) * 2017-10-02 2019-03-14 Infineon Technologies Ag Verfahren zum Bilden einer metallischen Zwischenverbindung, Verfahren zum Herstellen einer Halbleiteranordnung mit einer metallischen Zwischenverbindung und Halbleitervorrichtungsanordnung mit einer metallischen Zwischenverbindung
CN107833839B (zh) * 2017-10-12 2020-04-24 东南大学 一种基于纳米棒结构的按插式键合单元
DE102018108616A1 (de) * 2018-04-11 2019-10-17 Osram Opto Semiconductors Gmbh Halbleiterbauteile-Anordnung
US10833048B2 (en) * 2018-04-11 2020-11-10 International Business Machines Corporation Nanowire enabled substrate bonding and electrical contact formation
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
US11195811B2 (en) 2019-04-08 2021-12-07 Texas Instruments Incorporated Dielectric and metallic nanowire bond layers
DE102019128900B4 (de) * 2019-10-25 2025-05-22 Endress+Hauser SE+Co. KG Verfahren zum Herstellen eines SMD-lötbaren Bauelements, SMD-lötbares Bauelement, Elektronikeinheit und Feldgerät
US11069554B1 (en) * 2020-01-22 2021-07-20 Applied Materials, Inc. Carbon nanotube electrostatic chuck
KR102440998B1 (ko) * 2020-04-16 2022-09-13 주식회사 글린트머티리얼즈 양면 패턴부를 포함하는 템포러리 본딩용 미끄럼 방지 패드
US20240385353A1 (en) * 2022-06-14 2024-11-21 Boe Technology Group Co., Ltd. Display panel, metasurface lens and manufacturing method thereof
EP4372807B1 (en) 2022-11-16 2024-10-16 Infineon Technologies AG Substrate arrangement and methods for producing a substrate arrangement

Citations (5)

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JPH04126307A (ja) * 1990-03-16 1992-04-27 Ricoh Co Ltd 異方性導電膜およびその製造方法
JP2003253221A (ja) * 2002-02-28 2003-09-10 Hitachi Chem Co Ltd 接着フィルム及びそれを用いた電極の接続構造
WO2003095190A1 (en) * 2002-05-13 2003-11-20 California, The Regents Of The University An improved adhesive microstructure and method of forming same
JP2004014599A (ja) * 2002-06-04 2004-01-15 Fuji Electric Holdings Co Ltd 半導体装置およびその製造方法
JP2006222436A (ja) * 2004-01-22 2006-08-24 Bondotekku:Kk 接合方法およびこの方法により作成されるデバイス並びに接合装置

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US629763A (en) * 1898-07-07 1899-08-01 Benny Bernstein Trunk-lock.
US6185961B1 (en) * 1999-01-27 2001-02-13 The United States Of America As Represented By The Secretary Of The Navy Nanopost arrays and process for making same
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US6297063B1 (en) 1999-10-25 2001-10-02 Agere Systems Guardian Corp. In-situ nano-interconnected circuit devices and method for making the same
AT408052B (de) 1999-11-10 2001-08-27 Electrovac Verbindungssystem
JP3859199B2 (ja) * 2000-07-18 2006-12-20 エルジー エレクトロニクス インコーポレイティド カーボンナノチューブの水平成長方法及びこれを利用した電界効果トランジスタ
US6407922B1 (en) 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
DE10127351A1 (de) 2001-06-06 2002-12-19 Infineon Technologies Ag Elektronischer Chip und elektronische Chip-Anordnung
EP1320111A1 (en) 2001-12-11 2003-06-18 Abb Research Ltd. Carbon nanotube contact for MEMS
US7229847B2 (en) 2002-03-15 2007-06-12 Lucent Technologies Inc. Forming electrical contacts to a molecular layer
US6828685B2 (en) * 2002-06-14 2004-12-07 Hewlett-Packard Development Company, L.P. Memory device having a semiconducting polymer film
US7067328B2 (en) * 2003-09-25 2006-06-27 Nanosys, Inc. Methods, devices and compositions for depositing and orienting nanostructures
US7327037B2 (en) * 2004-04-01 2008-02-05 Lucent Technologies Inc. High density nanostructured interconnection

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH04126307A (ja) * 1990-03-16 1992-04-27 Ricoh Co Ltd 異方性導電膜およびその製造方法
JP2003253221A (ja) * 2002-02-28 2003-09-10 Hitachi Chem Co Ltd 接着フィルム及びそれを用いた電極の接続構造
WO2003095190A1 (en) * 2002-05-13 2003-11-20 California, The Regents Of The University An improved adhesive microstructure and method of forming same
JP2006505414A (ja) * 2002-05-13 2006-02-16 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 改善接着ミクロ構造体およびその形成方法
JP2004014599A (ja) * 2002-06-04 2004-01-15 Fuji Electric Holdings Co Ltd 半導体装置およびその製造方法
JP2006222436A (ja) * 2004-01-22 2006-08-24 Bondotekku:Kk 接合方法およびこの方法により作成されるデバイス並びに接合装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009523315A (ja) * 2005-12-22 2009-06-18 インテル コーポレイション ナノ構造をベースとしたパッケージの相互接続
JP2007311700A (ja) * 2006-05-22 2007-11-29 Fujitsu Ltd 半導体装置
JP2011501454A (ja) * 2007-10-26 2011-01-06 サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク 導電性の機械的相互接続部材を作る方法
JP2021503185A (ja) * 2017-11-14 2021-02-04 ナノワイヤード ゲーエムベーハー ２つの構成要素を結合するための方法及び結合装置、並びに２つの結合された構成要素の配置
JP7219773B2 (ja) 2017-11-14 2023-02-08 ナノワイヤード ゲーエムベーハー ２つの構成要素を結合するための方法及び結合装置、並びに２つの結合された構成要素の配置

Also Published As

Publication number Publication date
US20050224975A1 (en) 2005-10-13
US7327037B2 (en) 2008-02-05
US20080001306A1 (en) 2008-01-03
EP1583146A3 (en) 2005-10-26
US20060097252A1 (en) 2006-05-11
US7560817B2 (en) 2009-07-14
KR101186474B1 (ko) 2012-09-27
CN1775656B (zh) 2013-06-19
CN1775656A (zh) 2006-05-24
US7402913B2 (en) 2008-07-22
EP1583146A2 (en) 2005-10-05
KR20060044769A (ko) 2006-05-16

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