JP2005294844A - 高密度ナノ構造化相互接続 - Google Patents
高密度ナノ構造化相互接続 Download PDFInfo
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Abstract
【解決手段】電気および/または熱伝導性相互接続を形成する方法および装置が開示され、この接続では、第1の表面と第2の表面は、少なくとも1つの表面に配置されたナノ構造を介して、互いに接触している。一実施形態では、第1の複数のナノ構造の領域は、例示としてマイクロプロセッサのようなエレクトロニクス・パッケージ中の部品に配置される。そして、第1の複数の領域は、基板上の対応する第2の複数のナノ構造の領域と接触し、強い摩擦結合を生じさせる。他の例示の実施形態では、複数のナノ構造は、マイクロプロセッサのような部品上に配置され、そしてこのナノ構造が基板と接触する。分子間力は、ナノ構造の分子と基板の分子の間に引力をもたらし、このようにしてナノ構造と基板の間の結合を生じさせる。
【選択図】図4B
Description
Claims (10)
- 電気部品用の相互接続であって、
第1の表面と、
第2の表面と、
前記第1の表面および前記第2の表面の少なくとも1つに配置された複数のナノ構造と、
前記ナノ構造が前記第1の表面と前記第2の表面の間に少なくとも第1の伝導性接続を形成するようなやり方で、前記第1の表面と前記第2の表面を接着する手段とを備える相互接続。 - 前記伝導性接続が熱的な接続を含む、請求項1に記載の相互接続。
- 前記伝導性接続が電気的な接続を含む、請求項1に記載の相互接続。
- 前記複数のナノ構造が、
前記第1の表面の少なくとも第1の領域に配置された第1の複数のナノ構造と、
前記第2の表面の少なくとも第1の領域に配置された第2の複数のナノ構造とを備え、
前記第1の複数のナノ構造および前記第2の複数のナノ構造が、前記第1の複数のナノ構造から前記第2の複数のナノ構造に熱または電気エネルギーを伝達するように構成されている、請求項1に記載の相互接続。 - 前記第1の表面が複数のナノ構造を備え、前記複数のナノ構造は、前記複数のナノ構造の中の少なくとも一部の前記ナノ構造の分子と前記第2の表面の間の引力によって、前記第2の表面に付着するように構成されている、請求項1に記載の相互接続。
- 前記引力が、引力の分子間力を含む、請求項5に記載の相互接続。
- 前記分子間力が、ファン・デル・ワールスの力を含む、請求項6に記載の相互接続。
- 相互接続を横切って熱または電気エネルギーを伝達する方法であって、
第1の複数の伝導性ナノ構造を第2の複数の伝導性ナノ構造と接触させるステップを含み、
前記第1の複数の中の少なくとも一部の前記ナノ構造および前記第2の複数の中の一部の前記ナノ構造が伝導性材料を含む方法。 - 前記伝導性材料が熱伝導性材料である、請求項8に記載の方法。
- 前記伝導性材料が電気伝導性材料である、請求項8に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/816,527 US7327037B2 (en) | 2004-04-01 | 2004-04-01 | High density nanostructured interconnection |
Publications (2)
Publication Number | Publication Date |
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JP2005294844A true JP2005294844A (ja) | 2005-10-20 |
JP2005294844A5 JP2005294844A5 (ja) | 2008-05-15 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005105721A Pending JP2005294844A (ja) | 2004-04-01 | 2005-04-01 | 高密度ナノ構造化相互接続 |
Country Status (5)
Country | Link |
---|---|
US (3) | US7327037B2 (ja) |
EP (1) | EP1583146A3 (ja) |
JP (1) | JP2005294844A (ja) |
KR (1) | KR101186474B1 (ja) |
CN (1) | CN1775656B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007311700A (ja) * | 2006-05-22 | 2007-11-29 | Fujitsu Ltd | 半導体装置 |
JP2009523315A (ja) * | 2005-12-22 | 2009-06-18 | インテル コーポレイション | ナノ構造をベースとしたパッケージの相互接続 |
JP2011501454A (ja) * | 2007-10-26 | 2011-01-06 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 導電性の機械的相互接続部材を作る方法 |
JP2021503185A (ja) * | 2017-11-14 | 2021-02-04 | ナノワイヤード ゲーエムベーハー | 2つの構成要素を結合するための方法及び結合装置、並びに2つの結合された構成要素の配置 |
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US7327037B2 (en) * | 2004-04-01 | 2008-02-05 | Lucent Technologies Inc. | High density nanostructured interconnection |
US7544977B2 (en) * | 2006-01-27 | 2009-06-09 | Hewlett-Packard Development Company, L.P. | Mixed-scale electronic interface |
US7333699B2 (en) * | 2005-12-12 | 2008-02-19 | Raytheon Sarcos, Llc | Ultra-high density connector |
US7456479B2 (en) * | 2005-12-15 | 2008-11-25 | United Microelectronics Corp. | Method for fabricating a probing pad of an integrated circuit chip |
DE102006031322A1 (de) * | 2006-07-06 | 2007-09-27 | Siemens Ag | Elektromechanisches Bauteil |
US7581994B2 (en) * | 2006-08-10 | 2009-09-01 | The Boeing Company | Method and assembly for establishing an electrical interface between parts |
US8524092B2 (en) * | 2006-12-14 | 2013-09-03 | Carnegie Mellon University | Dry adhesives and methods for making dry adhesives |
WO2008076390A2 (en) * | 2006-12-14 | 2008-06-26 | Carnegie Mellon University | Dry adhesives and methods for making dry adhesives |
SG149711A1 (en) * | 2007-07-12 | 2009-02-27 | Agency Science Tech & Res | A method for electrical interconnection and an interconnection structure |
TWI362525B (en) * | 2007-07-31 | 2012-04-21 | Chunghwa Picture Tubes Ltd | Active device array substrate and liquid crystal display panel |
US7781260B2 (en) * | 2007-09-11 | 2010-08-24 | Intel Corporation | Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby |
US20090109628A1 (en) * | 2007-10-30 | 2009-04-30 | International Business Machines Corporation | Chip Cooling System with Convex Portion |
US7760507B2 (en) | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
DE102008019692B4 (de) * | 2008-04-15 | 2010-08-12 | Technische Universität Ilmenau | Verfahren zur Integration eines Polymer-Funktionsbauteils in ein Silizium-Mikrosystem |
US8728602B2 (en) | 2008-04-28 | 2014-05-20 | The Charles Stark Draper Laboratory, Inc. | Multi-component adhesive system |
US7960653B2 (en) * | 2008-07-25 | 2011-06-14 | Hewlett-Packard Development Company, L.P. | Conductive nanowires for electrical interconnect |
CN101668383B (zh) * | 2008-09-03 | 2013-03-06 | 富葵精密组件(深圳)有限公司 | 电路板以及电路板封装结构 |
US8398909B1 (en) | 2008-09-18 | 2013-03-19 | Carnegie Mellon University | Dry adhesives and methods of making dry adhesives |
JP5239768B2 (ja) * | 2008-11-14 | 2013-07-17 | 富士通株式会社 | 放熱材料並びに電子機器及びその製造方法 |
DE102009008772A1 (de) | 2009-02-13 | 2011-01-27 | Hochschule Furtwangen University | Selbstjustierendes Bondverfahren unter Verwendung nanostrukturierter Oberflächen |
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Also Published As
Publication number | Publication date |
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KR20060044769A (ko) | 2006-05-16 |
CN1775656A (zh) | 2006-05-24 |
EP1583146A2 (en) | 2005-10-05 |
US20050224975A1 (en) | 2005-10-13 |
EP1583146A3 (en) | 2005-10-26 |
CN1775656B (zh) | 2013-06-19 |
US20080001306A1 (en) | 2008-01-03 |
US7327037B2 (en) | 2008-02-05 |
US20060097252A1 (en) | 2006-05-11 |
KR101186474B1 (ko) | 2012-09-27 |
US7560817B2 (en) | 2009-07-14 |
US7402913B2 (en) | 2008-07-22 |
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