JP2009523315A - ナノ構造をベースとしたパッケージの相互接続 - Google Patents
ナノ構造をベースとしたパッケージの相互接続 Download PDFInfo
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Abstract
Description
Claims (20)
- ダイ上に、ナノ構造隆起部を形成するステップであって、前記ナノ構造隆起部は、ナノ寸法の開口を定形するテンプレート、および前記ナノ寸法の開口から成長する金属ナノワイヤを有する、ステップと、
前記ナノ構造隆起部を介して、前記ダイを基板に取り付けるステップと、
を有する方法。 - 前記ナノ構造隆起部を形成するステップは、
前記ダイ上にアルミニウム層を成膜するステップと、
前記アルミニウム層をパターン化するステップと、
前記パターン化されたアルミニウム層をアノダイズ処理するステップであって、ポアの規則配列である前記ナノ寸法の開口を有する、アノダイズ化酸化アルミニウム(AAO)テンプレートが形成されるステップと、
金属を成膜して、前記ポアに前記金属ナノワイヤを形成するステップと、
前記AAOテンプレートをエッチング処理するステップと、
を有することを特徴とする請求項1に記載の方法。 - 前記アノダイズ処理するステップは、前記AAOテンプレートの厚さを制御するステップを有することを特徴とする請求項2に記載の方法。
- 前記エッチング処理するステップは、前記AAOテンプレートの厚さを制御するステップを有することを特徴とする請求項2に記載の方法。
- 前記ナノ構造隆起部を形成するステップは、
前記ダイにポリカーボネート膜をスピンコートするステップと、
イオンビームを用いて、前記ポリカーボネート膜をエッチング処理し、孔として前記ナノ寸法の開口を形成するステップであって、前記エッチングされたポリカーボネート膜は、ポリカーボネートテンプレートを形成するステップと、
金属を成膜して、前記孔に前記金属ナノワイヤを形成するステップと、
前記ポリカーボネートテンプレートの少なくとも表面層を、有機溶媒中でエッチング除去するステップと、
を有することを特徴とする請求項1に記載の方法。 - 前記ダイにスピンコートするステップは、前記ポリカーボネートテンプレートの厚さを制御するステップを有することを特徴とする請求項5に記載の方法。
- 前記ダイを前記基板に取り付けるステップは、
前記基板の基板パッド上に、はんだペーストを設置するステップと、
前記ナノ構造隆起部をリフロー処理して、前記はんだペーストとの接合部を形成するステップと、
を有することを特徴とする請求項1に記載の方法。 - 前記ダイを前記基板に取り付けるステップは、前記ナノ構造隆起部を、前記基板の基板パッドと熱音波接合するステップを有することを特徴とする請求項1に記載の方法。
- 前記ダイを前記基板に取り付けるステップは、さらに、
前記ナノ構造隆起部を熱音波接合するステップの前に、前記基板パッド上に、前記ナノワイヤの金属と同じ種類の金属層を形成するステップを有することを特徴とする請求項8に記載の方法。 - ダイ上に配置されるナノ寸法の開口を定形するテンプレートと、
前記ダイの相互接続接触部に対応する、前記ナノ寸法の開口から延伸する金属ナノワイヤと、
を有するナノ構造隆起部。 - 前記テンプレートは、
アノダイズ化酸化アルミニウム(AAO)テンプレートを有し、該テンプレートは、ポアの規則配列である前記ナノ寸法の開口を有することを特徴とする請求項10に記載のナノ構造隆起部。 - 前記テンプレートは、
ポリカーボネートテンプレートを有し、該テンプレートは、ポリカーボネート膜からエッチング形成された孔である、前記ナノ寸法の開口を有することを特徴とする請求項10に記載のナノ構造隆起部。 - 前記テンプレートは、約100nmから500nmの範囲の厚さを有することを特徴とする請求項10に記載のナノ構造隆起部。
- 前記ナノ寸法の開口は、約5nmから300nmの範囲の寸法を有することを特徴とする請求項10に記載のナノ構造隆起部。
- ダイと、
基板パッドを有する基板と、
前記ダイに設置またはコーティングされ、前記基板と前記基板パッドで取り付けられるナノ構造隆起部と、
を有するパッケージであって、
前記ナノ構造隆起部は、
ナノ寸法の開口を定形するテンプレートと、
前記ダイ上の相互接続接触部に対応する、前記ナノ寸法の開口から延伸する金属ナノワイヤと、
を有することを特徴とするパッケージ。 - 前記テンプレートは、
アノダイズ化酸化アルミニウム(AAO)テンプレートを有し、
該テンプレートは、ポアの規則配列である前記ナノ寸法の開口を有することを特徴とする請求項17に記載のパッケージ。 - 前記テンプレートは、ポリカーボネートテンプレートを有し、
該テンプレートは、ポリカーボネート膜からエッチング形成された、前記ナノ寸法の開口を有することを特徴とする請求項17に記載のパッケージ。 - ベースバンドデータを処理するベースバンド処理ユニットと、
前記ベースバンド処理ユニットと結合され、IF信号を処理する中間周波数(IF)処理ユニットと、
前記IF処理ユニットに結合され、無線周波数(RF)信号を処理するシステムオンパッケージ(SOP)と、
を有するシステムであって、
前記SOPは、パッケージ化装置を有し、
該パッケージ化装置は、
ダイと、
基板パッドを有する基板と、
前記ダイに設置またはコーティングされ、前記基板と前記基板パッドで取り付けられるナノ構造隆起部と、
を有し、
前記ナノ構造隆起部は、ナノ寸法の開口を定形するテンプレート、および前記ダイの相互接続接触部に対応する、前記ナノ寸法の開口から延伸する金属ナノワイヤ、を有することを特徴とするシステム。 - 前記テンプレートは、アノダイズ化酸化アルミニウム(AAO)テンプレートを有し、
該テンプレートは、ポアの規則配列である、前記ナノ寸法の開口を有することを特徴とする請求項18に記載のシステム。 - 前記テンプレートは、ポリカーボネートテンプレートを有し、
該ポリカーボネートテンプレートは、ポリカーボネート膜からエッチング形成された、前記ナノ寸法の開口を有することを特徴とする請求項18に記載のシステム。
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US11/315,532 US7371674B2 (en) | 2005-12-22 | 2005-12-22 | Nanostructure-based package interconnect |
PCT/US2006/047032 WO2007078627A1 (en) | 2005-12-22 | 2006-12-08 | Nanostructure-based package interconnect |
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DE112006002983T5 (de) | 2008-11-13 |
WO2007078627A1 (en) | 2007-07-12 |
CN101317255B (zh) | 2010-12-15 |
CN101317255A (zh) | 2008-12-03 |
JP5546765B2 (ja) | 2014-07-09 |
US20070148949A1 (en) | 2007-06-28 |
TW200736157A (en) | 2007-10-01 |
TWI327131B (en) | 2010-07-11 |
US7371674B2 (en) | 2008-05-13 |
US20080185718A1 (en) | 2008-08-07 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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