WO2009057582A1 - 電気的接続体及びその製造方法 - Google Patents

電気的接続体及びその製造方法 Download PDF

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Publication number
WO2009057582A1
WO2009057582A1 PCT/JP2008/069514 JP2008069514W WO2009057582A1 WO 2009057582 A1 WO2009057582 A1 WO 2009057582A1 JP 2008069514 W JP2008069514 W JP 2008069514W WO 2009057582 A1 WO2009057582 A1 WO 2009057582A1
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WIPO (PCT)
Prior art keywords
electrical connection
connection body
conductive film
conductive particles
fabricating
Prior art date
Application number
PCT/JP2008/069514
Other languages
English (en)
French (fr)
Inventor
Misao Konishi
Yoshito Tanaka
Shobu Saito
Shinya Kawahara
Etsuko Ishikawa
Original Assignee
Sony Chemical & Information Device Corporation
Electroplating Engineers Of Japan Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation, Electroplating Engineers Of Japan Limited filed Critical Sony Chemical & Information Device Corporation
Priority to KR1020097022670A priority Critical patent/KR101505214B1/ko
Publication of WO2009057582A1 publication Critical patent/WO2009057582A1/ja

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Abstract

 異方性導電膜に含まれる導電性粒子の粒子径が小さい場合であっても、これを均一に潰すことが可能であり、良好な導通特性を得ることが可能な電気的接続体を提供する。  電気的接続体は、第１の電子部材である半導体素子１と第２の電子部材である配線基板３とが異方性導電膜５を介して電気的に接続されて構成される。いずれか一方の電子部材（ここでは半導体素子１）には、バンプ（突起電極）２が形成されており、バンプ２の頂部は、表面粗さＲａが０．０５μｍ以下の平坦面とされている。異方性導電膜５に含まれる導電性粒子６の平均粒径は、４μｍ以下である。
PCT/JP2008/069514 2007-10-29 2008-10-28 電気的接続体及びその製造方法 WO2009057582A1 (ja)

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Cited By (3)

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EP3036762A4 (en) * 2013-08-21 2017-03-22 LG Electronics Inc. Semiconductor device
CN113611785A (zh) * 2018-02-01 2021-11-05 新唐科技日本株式会社 半导体装置
TWI809284B (zh) * 2015-01-13 2023-07-21 日商迪睿合股份有限公司 異向導電膜、連接構造體及連接構造體之製造方法

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CN103180944A (zh) 2010-10-25 2013-06-26 松下电器产业株式会社 电子元件的接合方式
TWI456674B (zh) * 2012-01-03 2014-10-11 Chipbond Technology Corp 半導體封裝方法及其結構
JP6209313B2 (ja) 2012-02-20 2017-10-04 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法及び接続方法
JP2015179831A (ja) * 2014-02-27 2015-10-08 デクセリアルズ株式会社 接続体、接続体の製造方法及び検査方法

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TWI809284B (zh) * 2015-01-13 2023-07-21 日商迪睿合股份有限公司 異向導電膜、連接構造體及連接構造體之製造方法
CN113611785A (zh) * 2018-02-01 2021-11-05 新唐科技日本株式会社 半导体装置

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