CN1727081B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN1727081B
CN1727081B CN2005100786509A CN200510078650A CN1727081B CN 1727081 B CN1727081 B CN 1727081B CN 2005100786509 A CN2005100786509 A CN 2005100786509A CN 200510078650 A CN200510078650 A CN 200510078650A CN 1727081 B CN1727081 B CN 1727081B
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CN
China
Prior art keywords
substrate
nozzle
mentioned
gas
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005100786509A
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English (en)
Chinese (zh)
Other versions
CN1727081A (zh
Inventor
宫胜彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skilling Group
Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Publication of CN1727081A publication Critical patent/CN1727081A/zh
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Publication of CN1727081B publication Critical patent/CN1727081B/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
CN2005100786509A 2004-07-30 2005-06-21 基板处理装置和基板处理方法 Expired - Fee Related CN1727081B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004223412A JP4397299B2 (ja) 2004-07-30 2004-07-30 基板処理装置
JP2004223412 2004-07-30
JP2004-223412 2004-07-30

Publications (2)

Publication Number Publication Date
CN1727081A CN1727081A (zh) 2006-02-01
CN1727081B true CN1727081B (zh) 2011-06-08

Family

ID=35730770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100786509A Expired - Fee Related CN1727081B (zh) 2004-07-30 2005-06-21 基板处理装置和基板处理方法

Country Status (4)

Country Link
US (1) US7722736B2 (enExample)
JP (1) JP4397299B2 (enExample)
CN (1) CN1727081B (enExample)
TW (1) TWI258185B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673115B (zh) * 2016-05-25 2019-10-01 SCREEN Holdings Co., Ltd. 基板處理裝置及基板處理方法
US10854477B2 (en) 2016-05-25 2020-12-01 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

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US20070062647A1 (en) * 2005-09-19 2007-03-22 Bailey Joel B Method and apparatus for isolative substrate edge area processing
US20080017316A1 (en) * 2002-04-26 2008-01-24 Accretech Usa, Inc. Clean ignition system for wafer substrate processing
US20080190558A1 (en) * 2002-04-26 2008-08-14 Accretech Usa, Inc. Wafer processing apparatus and method
US20080011332A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Method and apparatus for cleaning a wafer substrate
JP4262004B2 (ja) * 2002-08-29 2009-05-13 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2005045206A (ja) * 2003-07-07 2005-02-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置
JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4907400B2 (ja) * 2006-07-25 2012-03-28 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
JP4708286B2 (ja) * 2006-08-11 2011-06-22 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4762098B2 (ja) * 2006-09-28 2011-08-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4679479B2 (ja) * 2006-09-28 2011-04-27 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5090089B2 (ja) * 2006-10-19 2012-12-05 大日本スクリーン製造株式会社 基板処理装置
JP4936878B2 (ja) * 2006-12-25 2012-05-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4841451B2 (ja) 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4906559B2 (ja) * 2007-03-29 2012-03-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US7958899B2 (en) 2007-08-21 2011-06-14 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and substrate cleaning method
JP5242242B2 (ja) * 2007-10-17 2013-07-24 株式会社荏原製作所 基板洗浄装置
EP2051285B1 (en) * 2007-10-17 2011-08-24 Ebara Corporation Substrate cleaning apparatus
US7879183B2 (en) * 2008-02-27 2011-02-01 Applied Materials, Inc. Apparatus and method for front side protection during backside cleaning
KR101205460B1 (ko) 2008-06-05 2012-11-29 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
KR101065557B1 (ko) * 2008-10-29 2011-09-19 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
JP5623104B2 (ja) * 2010-03-18 2014-11-12 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP5270607B2 (ja) 2010-03-30 2013-08-21 大日本スクリーン製造株式会社 基板処理装置
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing
CN103988257A (zh) * 2011-06-30 2014-08-13 Hoya株式会社 Hdd用玻璃基板的制造方法、hdd用玻璃基板以及hdd用磁记录介质
JP5996381B2 (ja) 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5646528B2 (ja) * 2012-03-09 2014-12-24 東京エレクトロン株式会社 液処理装置
US20130309874A1 (en) * 2012-05-15 2013-11-21 Lam Research Ag Method and apparatus for liquid treatment of wafer-shaped articles
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
US9768041B2 (en) 2013-08-12 2017-09-19 Veeco Precision Surface Processing Llc Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
TWI569349B (zh) 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
TWI597770B (zh) * 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6338904B2 (ja) 2014-03-24 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN104183524A (zh) * 2014-08-27 2014-12-03 上海华力微电子有限公司 一种晶圆边缘的刻蚀装置
TWI661479B (zh) * 2015-02-12 2019-06-01 Screen Holdings Co,. Ltd. 基板處理裝置、基板處理系統以及基板處理方法
US10730059B2 (en) 2015-03-05 2020-08-04 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
DE102015104735A1 (de) * 2015-03-27 2016-09-29 Obducat Ab Drehteller zur Aufnahme eines Substrats für eine Belackungsvorrichtung
TWI661477B (zh) 2015-06-18 2019-06-01 日商思可林集團股份有限公司 基板處理裝置
US9968970B2 (en) * 2015-12-04 2018-05-15 Lam Research Ag Spin chuck with in situ cleaning capability
CN106158709B (zh) * 2016-07-22 2018-09-11 江苏鲁汶仪器有限公司 一种晶圆切割装置和方法
JP6885753B2 (ja) * 2017-03-08 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI797121B (zh) 2017-04-25 2023-04-01 美商維克儀器公司 半導體晶圓製程腔體
JP6842391B2 (ja) * 2017-09-07 2021-03-17 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
KR102355875B1 (ko) * 2017-12-18 2022-02-08 세키스이가가쿠 고교가부시키가이샤 표면 처리 방법 및 장치
CN108133906A (zh) * 2017-12-27 2018-06-08 德淮半导体有限公司 晶片处理设备及晶片处理方法
JP7218098B2 (ja) * 2018-05-31 2023-02-06 株式会社デンソーテン 塗布装置および塗布方法
JP7166089B2 (ja) * 2018-06-29 2022-11-07 東京エレクトロン株式会社 基板処理装置、基板処理システムおよび基板処理方法
WO2020039849A1 (ja) * 2018-08-22 2020-02-27 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR102154486B1 (ko) * 2018-10-11 2020-09-10 주식회사 테스 가스공급유닛
CN111081585B (zh) * 2018-10-18 2022-08-16 北京北方华创微电子装备有限公司 喷淋装置及清洗设备
CN113113328B (zh) * 2021-03-04 2023-01-31 江苏亚电科技有限公司 单片晶圆清洗装置清洗盘结构及单片晶圆清洗装置
CN113539937B (zh) * 2021-07-09 2023-03-03 江西龙芯微科技有限公司 一种晶圆承载装置

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JP2002176020A (ja) * 2000-09-04 2002-06-21 Sony Corp 基板処理装置および基板処理方法、ならびにデバイス製品の製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673115B (zh) * 2016-05-25 2019-10-01 SCREEN Holdings Co., Ltd. 基板處理裝置及基板處理方法
US10854477B2 (en) 2016-05-25 2020-12-01 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US11443960B2 (en) 2016-05-25 2022-09-13 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JP4397299B2 (ja) 2010-01-13
US7722736B2 (en) 2010-05-25
US20060021636A1 (en) 2006-02-02
CN1727081A (zh) 2006-02-01
JP2006041444A (ja) 2006-02-09
TWI258185B (en) 2006-07-11
TW200605209A (en) 2006-02-01

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Owner name: SCREEN GROUP CO., LTD.

Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD.

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Address after: Kyoto City, Kyoto, Japan

Patentee after: Skilling Group

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Patentee before: DAINIPPON SCREEN MFG Co.,Ltd.

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Granted publication date: 20110608

Termination date: 20210621