CN1462481A - 薄膜晶体管及有源矩阵型显示装置及其制造方法 - Google Patents
薄膜晶体管及有源矩阵型显示装置及其制造方法 Download PDFInfo
- Publication number
- CN1462481A CN1462481A CN02801641A CN02801641A CN1462481A CN 1462481 A CN1462481 A CN 1462481A CN 02801641 A CN02801641 A CN 02801641A CN 02801641 A CN02801641 A CN 02801641A CN 1462481 A CN1462481 A CN 1462481A
- Authority
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- China
- Prior art keywords
- insulating film
- region
- film
- gate
- gate electrode
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001149453 | 2001-05-18 | ||
| JP149453/2001 | 2001-05-18 | ||
| JP065794/2002 | 2002-03-11 | ||
| JP2002065794 | 2002-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1462481A true CN1462481A (zh) | 2003-12-17 |
Family
ID=26615339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02801641A Pending CN1462481A (zh) | 2001-05-18 | 2002-05-16 | 薄膜晶体管及有源矩阵型显示装置及其制造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6995048B2 (enExample) |
| EP (1) | EP1388897A1 (enExample) |
| JP (1) | JPWO2002095834A1 (enExample) |
| KR (1) | KR100503581B1 (enExample) |
| CN (1) | CN1462481A (enExample) |
| TW (2) | TWI297549B (enExample) |
| WO (1) | WO2002095834A1 (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810474A (zh) * | 2011-05-31 | 2012-12-05 | 台湾积体电路制造股份有限公司 | 用于提高层间电介质中的金属图案的密度的器件制造方法 |
| CN103035653A (zh) * | 2012-10-10 | 2013-04-10 | 深圳市华星光电技术有限公司 | 薄膜晶体管像素结构及其制作方法 |
| CN103715200A (zh) * | 2013-12-19 | 2014-04-09 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示装置 |
| CN103972243A (zh) * | 2014-04-24 | 2014-08-06 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
| WO2017166398A1 (zh) * | 2016-03-31 | 2017-10-05 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| CN109659357A (zh) * | 2018-12-18 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | 薄膜晶体管和显示面板 |
| CN109888021A (zh) * | 2019-02-27 | 2019-06-14 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
| CN111554692A (zh) * | 2019-02-08 | 2020-08-18 | 株式会社日本显示器 | 半导体器件和半导体器件的制造方法 |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6509616B2 (en) * | 2000-09-29 | 2003-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
| JP2003093370A (ja) * | 2001-09-26 | 2003-04-02 | Sony Corp | 指紋検出装置 |
| KR100846464B1 (ko) * | 2002-05-28 | 2008-07-17 | 삼성전자주식회사 | 비정질실리콘 박막 트랜지스터-액정표시장치 및 그 제조방법 |
| TWI220072B (en) * | 2003-02-19 | 2004-08-01 | Toppoly Optoelectronics Corp | TFT structure with LDD region and manufacturing process of the same |
| JP2005072573A (ja) * | 2003-08-05 | 2005-03-17 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに半導体装置及びその作製方法 |
| US8937580B2 (en) * | 2003-08-08 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of light emitting device and light emitting device |
| JP4677713B2 (ja) * | 2003-11-25 | 2011-04-27 | セイコーエプソン株式会社 | 電気光学装置用基板、電気光学装置用基板の製造方法、電気光学装置および電子機器 |
| JP5072202B2 (ja) * | 2004-07-30 | 2012-11-14 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US8217396B2 (en) | 2004-07-30 | 2012-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising electrode layer contacting wiring in the connection region and extending to pixel region |
| US7524728B2 (en) * | 2004-11-08 | 2009-04-28 | Sanyo Electric Co., Ltd. | Thin film transistor manufacturing method and organic electroluminescent display device |
| JP4731191B2 (ja) * | 2005-03-28 | 2011-07-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR100659112B1 (ko) * | 2005-11-22 | 2006-12-19 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 이의 제조 방법, 이를 구비한평판 디스플레이 장치 |
| TWI267213B (en) * | 2006-01-27 | 2006-11-21 | Ind Tech Res Inst | Organic light emitting device with integrated color filter and method of manufacturing the same |
| JP2009117620A (ja) * | 2007-11-07 | 2009-05-28 | Casio Comput Co Ltd | 画像読取装置およびその製造方法 |
| GB0811962D0 (en) * | 2008-06-30 | 2008-07-30 | Imp Innovations Ltd | Improved fabrication method for thin-film field-effect transistors |
| KR101002665B1 (ko) * | 2008-07-02 | 2010-12-21 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법 및 그를 포함하는유기전계발광표시장치 |
| JP2010245077A (ja) * | 2009-04-01 | 2010-10-28 | Epson Imaging Devices Corp | 光電変換装置、エックス線撮像装置、光電変換装置の製造方法 |
| TWI395334B (zh) * | 2009-11-20 | 2013-05-01 | Au Optronics Corp | 薄膜電晶體元件及其製作方法 |
| JP2012033778A (ja) * | 2010-07-30 | 2012-02-16 | Dainippon Printing Co Ltd | 薄膜トランジスタとその製造方法、薄膜トランジスタアレイとその製造方法、及び、ディスプレイ装置 |
| US8988624B2 (en) | 2011-06-23 | 2015-03-24 | Apple Inc. | Display pixel having oxide thin-film transistor (TFT) with reduced loading |
| CN103915507A (zh) * | 2012-12-31 | 2014-07-09 | 瀚宇彩晶股份有限公司 | 氧化物薄膜晶体管结构及制作氧化物薄膜晶体管的方法 |
| CN103413898B (zh) * | 2013-08-29 | 2015-11-11 | 深圳市华星光电技术有限公司 | 有机发光二极管阳极连接结构及其制作方法 |
| KR102137392B1 (ko) * | 2013-10-08 | 2020-07-24 | 엘지디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| KR102294480B1 (ko) * | 2013-10-25 | 2021-08-27 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판, 박막 트랜지스터 기판의 제조 방법 및 박막트랜지스터 기판을 포함하는 표시 장치 |
| CN103545319A (zh) * | 2013-11-08 | 2014-01-29 | 京东方科技集团股份有限公司 | 低温多晶硅薄膜晶体管阵列基板及其制作方法、显示装置 |
| KR102302362B1 (ko) * | 2014-02-24 | 2021-09-15 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| CN104716196B (zh) * | 2015-03-18 | 2017-08-08 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、阵列基板及显示装置 |
| CN116154003A (zh) * | 2015-11-20 | 2023-05-23 | 株式会社半导体能源研究所 | 半导体装置、包括该半导体装置的显示装置以及包括该半导体装置的电子设备 |
| KR102642198B1 (ko) | 2016-04-04 | 2024-03-05 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
| CN107039351B (zh) * | 2017-04-05 | 2019-10-11 | 武汉华星光电技术有限公司 | Tft基板的制作方法及tft基板 |
| KR102600041B1 (ko) | 2018-06-07 | 2023-11-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| US20200073189A1 (en) * | 2018-08-30 | 2020-03-05 | Sharp Kabushiki Kaisha | Active matrix substrate, display device, and method for manufacturing active matrix substrate |
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| JPH02234134A (ja) * | 1989-03-07 | 1990-09-17 | Nec Corp | 液晶表示装置用アクティブマトリクス基板 |
| JP2857900B2 (ja) * | 1989-12-28 | 1999-02-17 | カシオ計算機株式会社 | 薄膜トランジスタの製造方法 |
| US5508216A (en) * | 1992-06-24 | 1996-04-16 | Seiko Epson Corporation | Thin film transistor, solid device, display device and manufacturing method of a thin film transistor |
| JP3257086B2 (ja) * | 1992-11-12 | 2002-02-18 | セイコーエプソン株式会社 | 相補性薄膜半導体装置の製造方法 |
| JPH06252405A (ja) * | 1993-02-22 | 1994-09-09 | Fuji Xerox Co Ltd | 薄膜半導体装置 |
| JP3598121B2 (ja) * | 1993-03-19 | 2004-12-08 | ソニー株式会社 | 薄膜トランジスタの製造方法 |
| JP3393420B2 (ja) | 1995-02-28 | 2003-04-07 | ソニー株式会社 | 半導体装置 |
| US6100119A (en) * | 1995-08-31 | 2000-08-08 | Lg Electronics Inc. | Thin film transistor and method for fabricating the same |
| JP3645378B2 (ja) * | 1996-01-19 | 2005-05-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JPH09311342A (ja) * | 1996-05-16 | 1997-12-02 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| JPH10209454A (ja) * | 1997-01-17 | 1998-08-07 | Toshiba Corp | 薄膜トランジスタの製造方法 |
| JPH11111993A (ja) | 1997-09-30 | 1999-04-23 | Toshiba Corp | 半導体装置の製造方法 |
| JPH11109406A (ja) * | 1997-09-30 | 1999-04-23 | Sanyo Electric Co Ltd | 表示装置とその製造方法 |
| JP2000183358A (ja) * | 1998-07-17 | 2000-06-30 | Sony Corp | 薄膜半導体装置の製造方法 |
| JP2001023899A (ja) | 1999-07-13 | 2001-01-26 | Hitachi Ltd | 半導体薄膜とその半導体膜を用いた液晶表示装置及びその製造方法 |
| JP3956572B2 (ja) * | 2000-03-13 | 2007-08-08 | セイコーエプソン株式会社 | 液晶装置用基板の製造方法 |
-
2002
- 2002-05-16 WO PCT/JP2002/004750 patent/WO2002095834A1/ja not_active Ceased
- 2002-05-16 US US10/333,194 patent/US6995048B2/en not_active Expired - Lifetime
- 2002-05-16 CN CN02801641A patent/CN1462481A/zh active Pending
- 2002-05-16 EP EP02771711A patent/EP1388897A1/en not_active Withdrawn
- 2002-05-16 JP JP2002592199A patent/JPWO2002095834A1/ja active Pending
- 2002-05-16 KR KR10-2003-7000738A patent/KR100503581B1/ko not_active Expired - Fee Related
- 2002-05-17 TW TW096137208A patent/TWI297549B/zh not_active IP Right Cessation
- 2002-05-17 TW TW091110334A patent/TWI296134B/zh not_active IP Right Cessation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810474A (zh) * | 2011-05-31 | 2012-12-05 | 台湾积体电路制造股份有限公司 | 用于提高层间电介质中的金属图案的密度的器件制造方法 |
| CN102810474B (zh) * | 2011-05-31 | 2015-02-18 | 台湾积体电路制造股份有限公司 | 用于提高层间电介质中的金属图案的密度的器件制造方法 |
| CN103035653A (zh) * | 2012-10-10 | 2013-04-10 | 深圳市华星光电技术有限公司 | 薄膜晶体管像素结构及其制作方法 |
| CN103715200A (zh) * | 2013-12-19 | 2014-04-09 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示装置 |
| CN103972243A (zh) * | 2014-04-24 | 2014-08-06 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
| CN103972243B (zh) * | 2014-04-24 | 2017-03-29 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
| WO2017166398A1 (zh) * | 2016-03-31 | 2017-10-05 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| US10372000B2 (en) | 2016-03-31 | 2019-08-06 | Boe Technology Group Co., Ltd. | Array substrate and method of manufacturing the same, and display device |
| CN109659357A (zh) * | 2018-12-18 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | 薄膜晶体管和显示面板 |
| US11189731B2 (en) | 2018-12-18 | 2021-11-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Thin-film transistor and display panel |
| CN111554692A (zh) * | 2019-02-08 | 2020-08-18 | 株式会社日本显示器 | 半导体器件和半导体器件的制造方法 |
| CN109888021A (zh) * | 2019-02-27 | 2019-06-14 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030029108A (ko) | 2003-04-11 |
| TWI296134B (enExample) | 2008-04-21 |
| KR100503581B1 (ko) | 2005-07-25 |
| JPWO2002095834A1 (ja) | 2004-09-09 |
| TW200812090A (en) | 2008-03-01 |
| US20040087067A1 (en) | 2004-05-06 |
| US6995048B2 (en) | 2006-02-07 |
| TWI297549B (en) | 2008-06-01 |
| WO2002095834A1 (fr) | 2002-11-28 |
| EP1388897A1 (en) | 2004-02-11 |
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