CN1424771A - 具有存储多个字节的存储单元的半导体存储器及其制造方法 - Google Patents

具有存储多个字节的存储单元的半导体存储器及其制造方法 Download PDF

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Publication number
CN1424771A
CN1424771A CN02155823A CN02155823A CN1424771A CN 1424771 A CN1424771 A CN 1424771A CN 02155823 A CN02155823 A CN 02155823A CN 02155823 A CN02155823 A CN 02155823A CN 1424771 A CN1424771 A CN 1424771A
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CN
China
Prior art keywords
boss
insulating barrier
source
pair
floating boom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN02155823A
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English (en)
Chinese (zh)
Inventor
山井田高
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INNOTECH CORP
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INNOTECH CORP
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Filing date
Publication date
Application filed by INNOTECH CORP filed Critical INNOTECH CORP
Publication of CN1424771A publication Critical patent/CN1424771A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42—Simultaneous manufacture of periphery and memory cells
    • H10B41/43—Simultaneous manufacture of periphery and memory cells comprising only one type of peripheral transistor
    • H10B41/48—Simultaneous manufacture of periphery and memory cells comprising only one type of peripheral transistor with a tunnel dielectric layer also being used as part of the peripheral transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/687—Floating-gate IGFETs having more than two programming levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/031—Manufacture or treatment of data-storage electrodes
    • H10D64/035—Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
CN02155823A 2001-11-01 2002-11-01 具有存储多个字节的存储单元的半导体存储器及其制造方法 Pending CN1424771A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001336822 2001-11-01
JP336822/2001 2001-11-01
JP303845/2002 2002-10-18
JP2002303845A JP4191975B2 (ja) 2001-11-01 2002-10-18 トランジスタとそれを用いた半導体メモリ、およびトランジスタの製造方法

Publications (1)

Publication Number Publication Date
CN1424771A true CN1424771A (zh) 2003-06-18

Family

ID=26624293

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02155823A Pending CN1424771A (zh) 2001-11-01 2002-11-01 具有存储多个字节的存储单元的半导体存储器及其制造方法

Country Status (6)

Country Link
US (2) US6812518B2 (enExample)
EP (1) EP1311000A3 (enExample)
JP (1) JP4191975B2 (enExample)
KR (1) KR20030036080A (enExample)
CN (1) CN1424771A (enExample)
TW (1) TW561616B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730337A (zh) * 2012-10-11 2014-04-16 南亚科技股份有限公司 用于光刻工艺的掩膜及其制成的图形
CN105633021A (zh) * 2014-10-15 2016-06-01 力晶科技股份有限公司 半导体元件的制造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004072060A (ja) * 2001-11-22 2004-03-04 Innotech Corp トランジスタとそれを用いた半導体メモリ、およびトランジスタの駆動方法
JP4472934B2 (ja) * 2002-03-27 2010-06-02 イノテック株式会社 半導体装置および半導体メモリ
JP2004214495A (ja) * 2003-01-07 2004-07-29 Innotech Corp トランジスタとそれを用いた半導体メモリ、および半導体メモリの製造方法
JP4557678B2 (ja) * 2004-02-13 2010-10-06 イノテック株式会社 半導体記憶装置
JP4521253B2 (ja) * 2004-11-24 2010-08-11 イノテック株式会社 半導体記憶装置の製造方法
JP5025140B2 (ja) * 2005-03-23 2012-09-12 ルネサスエレクトロニクス株式会社 半導体記憶装置の製造方法
TWI270977B (en) * 2005-06-27 2007-01-11 Powerchip Semiconductor Corp Non-volatile memory and manufacturing method and operating method thereof
CN100461374C (zh) * 2005-08-19 2009-02-11 力晶半导体股份有限公司 非挥发性存储器及其制造方法与操作方法
US8946674B2 (en) * 2005-08-31 2015-02-03 University Of Florida Research Foundation, Inc. Group III-nitrides on Si substrates using a nanostructured interlayer
US9159568B2 (en) * 2006-02-04 2015-10-13 Cypress Semiconductor Corporation Method for fabricating memory cells having split charge storage nodes
US7859026B2 (en) * 2006-03-16 2010-12-28 Spansion Llc Vertical semiconductor device
US8222057B2 (en) * 2006-08-29 2012-07-17 University Of Florida Research Foundation, Inc. Crack free multilayered devices, methods of manufacture thereof and articles comprising the same
KR100871983B1 (ko) * 2007-07-24 2008-12-03 주식회사 동부하이텍 반도체 메모리 소자 및 그 제조 방법
KR100933835B1 (ko) * 2007-11-12 2009-12-24 주식회사 하이닉스반도체 플래시 메모리 소자의 제조 방법
JP5731858B2 (ja) * 2011-03-09 2015-06-10 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及び半導体装置の製造方法
CN111295756B (zh) 2020-01-28 2022-06-21 长江存储科技有限责任公司 垂直存储器件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US147666A (en) * 1874-02-17 Improvement
US5379255A (en) * 1992-12-14 1995-01-03 Texas Instruments Incorporated Three dimensional famos memory devices and methods of fabricating
JP2964993B2 (ja) * 1997-05-28 1999-10-18 日本電気株式会社 半導体記憶装置
JP3425853B2 (ja) * 1997-08-29 2003-07-14 Ｎｅｃエレクトロニクス株式会社 不揮発性半導体記憶装置
US6091101A (en) * 1998-03-30 2000-07-18 Worldwide Semiconductor Manufacturing Corporation Multi-level flash memory using triple well
JP3973819B2 (ja) * 1999-03-08 2007-09-12 株式会社東芝 半導体記憶装置およびその製造方法
US6133098A (en) * 1999-05-17 2000-10-17 Halo Lsi Design & Device Technology, Inc. Process for making and programming and operating a dual-bit multi-level ballistic flash memory
JP4397491B2 (ja) 1999-11-30 2010-01-13 財団法人国際科学振興財団 １１１面方位を表面に有するシリコンを用いた半導体装置およびその形成方法
JP3249811B1 (ja) 2000-11-09 2002-01-21 イノテック株式会社 半導体記憶装置、その製造方法及び半導体記憶装置の駆動方法
JP3283872B1 (ja) 2001-04-12 2002-05-20 イノテック株式会社 半導体記憶装置、その製造方法及び半導体記憶装置の駆動方法
US6538925B2 (en) * 2000-11-09 2003-03-25 Innotech Corporation Semiconductor memory device, method of manufacturing the same and method of driving the same
JP3249812B1 (ja) 2001-05-14 2002-01-21 イノテック株式会社 半導体記憶装置及びその製造方法
US6861315B1 (en) * 2003-08-14 2005-03-01 Silicon Storage Technology, Inc. Method of manufacturing an array of bi-directional nonvolatile memory cells

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730337A (zh) * 2012-10-11 2014-04-16 南亚科技股份有限公司 用于光刻工艺的掩膜及其制成的图形
CN103730337B (zh) * 2012-10-11 2016-08-17 南亚科技股份有限公司 用于光刻工艺的掩膜及其制成的图形
CN105633021A (zh) * 2014-10-15 2016-06-01 力晶科技股份有限公司 半导体元件的制造方法

Also Published As

Publication number Publication date
JP2003204002A (ja) 2003-07-18
KR20030036080A (ko) 2003-05-09
TW561616B (en) 2003-11-11
US20040256656A1 (en) 2004-12-23
US7037782B2 (en) 2006-05-02
EP1311000A2 (en) 2003-05-14
EP1311000A3 (en) 2004-08-04
JP4191975B2 (ja) 2008-12-03
US6812518B2 (en) 2004-11-02
US20030080356A1 (en) 2003-05-01

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CI01 Publication of corrected invention patent application

Correction item: Inventor

Correct: Miida Takashi

False: Yamai Takoo

Number: 25

Volume: 19

CI02 Correction of invention patent application

Correction item: Inventor

Correct: Miida Takashi

False: Yamai Takoo

Number: 25

Page: The title page

Volume: 19

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: TIANGAO SHANJING TO: MIIDA TAKASHI

ERR Gazette correction

Free format text: CORRECT: INVENTOR; FROM: TIANGAO SHANJING TO: MIIDA TAKASHI

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication