CN1407560A - 装有存储器和逻辑芯片的可测试存储器芯片的半导体器件 - Google Patents
装有存储器和逻辑芯片的可测试存储器芯片的半导体器件 Download PDFInfo
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- CN1407560A CN1407560A CN02122446A CN02122446A CN1407560A CN 1407560 A CN1407560 A CN 1407560A CN 02122446 A CN02122446 A CN 02122446A CN 02122446 A CN02122446 A CN 02122446A CN 1407560 A CN1407560 A CN 1407560A
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- circuit
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- memory chip
- signal
- chip
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- 238000012360 testing method Methods 0.000 title claims abstract description 261
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 230000006870 function Effects 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims description 37
- 238000003860 storage Methods 0.000 claims description 37
- 230000032683 aging Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 101100191136 Arabidopsis thaliana PCMP-A2 gene Proteins 0.000 description 3
- 101100422768 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SUL2 gene Proteins 0.000 description 3
- 101100048260 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) UBX2 gene Proteins 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000002939 deleterious effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 101100394003 Butyrivibrio fibrisolvens end1 gene Proteins 0.000 description 1
- 101100478715 Drosophila melanogaster Start1 gene Proteins 0.000 description 1
- 101100174722 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GAA1 gene Proteins 0.000 description 1
- 101100296979 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) PEP5 gene Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/1201—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising I/O circuitry
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0401—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals in embedded memories
Landscapes
- Tests Of Electronic Circuits (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP268918/01 | 2001-09-05 | ||
JP2001268918A JP4339534B2 (ja) | 2001-09-05 | 2001-09-05 | メモリチップとロジックチップとを搭載し,メモリチップの試験を可能にした半導体装置 |
JP268918/2001 | 2001-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1407560A true CN1407560A (zh) | 2003-04-02 |
CN100375198C CN100375198C (zh) | 2008-03-12 |
Family
ID=19094827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021224463A Expired - Fee Related CN100375198C (zh) | 2001-09-05 | 2002-06-05 | 装有存储器和逻辑芯片的可测试存储器芯片的半导体器件 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6711042B2 (zh) |
EP (1) | EP1291882A3 (zh) |
JP (1) | JP4339534B2 (zh) |
KR (2) | KR100890750B1 (zh) |
CN (1) | CN100375198C (zh) |
TW (1) | TWI259472B (zh) |
Cited By (14)
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CN1591697A (zh) * | 2003-09-05 | 2005-03-09 | 因芬尼昂技术股份公司 | 集成电路输出信号检查方法及装置 |
CN1312752C (zh) * | 2003-04-03 | 2007-04-25 | 索尼株式会社 | 半导体集成电路装置及其制造方法 |
US8120986B2 (en) | 2005-12-22 | 2012-02-21 | Samsung Electronics Co., Ltd. | Multi-port semiconductor memory device having variable access paths and method therefor |
CN102621478A (zh) * | 2012-03-29 | 2012-08-01 | 广州市广晟微电子有限公司 | 一种射频前端芯片的动态测试装置及系统 |
CN102855939A (zh) * | 2006-03-22 | 2013-01-02 | 瑞萨电子株式会社 | 半导体装置及其测试方法 |
CN102033796B (zh) * | 2009-09-25 | 2013-01-16 | 中国移动通信集团公司 | 测试系统和方法 |
CN102956273A (zh) * | 2011-08-17 | 2013-03-06 | 台湾积体电路制造股份有限公司 | 用于基于2.5d/3d系统芯片的宽i/o dram的dram测试架构 |
CN105319494A (zh) * | 2014-11-26 | 2016-02-10 | 北京同方微电子有限公司 | 一种集成电路芯片的自动老化测试装置 |
CN106324485A (zh) * | 2016-08-30 | 2017-01-11 | 福州瑞芯微电子股份有限公司 | 芯片的无线测试电路及无线测试方法 |
CN107039073A (zh) * | 2016-02-04 | 2017-08-11 | 新唐科技股份有限公司 | 非依电性存储器装置及其操作方法 |
CN107305789A (zh) * | 2016-04-21 | 2017-10-31 | 北京兆易创新科技股份有限公司 | 一种非挥发性存储器的自测试方法和装置 |
CN108735747A (zh) * | 2017-04-20 | 2018-11-02 | 台湾积体电路制造股份有限公司 | 半导体器件、集成电路芯片及其形成方法 |
CN109427411A (zh) * | 2017-08-30 | 2019-03-05 | 台湾积体电路制造股份有限公司 | 金属隔离测试电路、系统及其测试方法 |
CN116612804A (zh) * | 2023-07-19 | 2023-08-18 | 芯天下技术股份有限公司 | 一种芯片崩边检测电路及存储芯片 |
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US7006940B1 (en) * | 2002-11-27 | 2006-02-28 | Inapac Technology, Inc. | Set up for a first integrated circuit chip to allow for testing of a co-packaged second integrated circuit chip |
US7444575B2 (en) * | 2000-09-21 | 2008-10-28 | Inapac Technology, Inc. | Architecture and method for testing of an integrated circuit device |
US6961881B2 (en) * | 2001-09-14 | 2005-11-01 | Fujitsu Limited | Semiconductor device |
US8001439B2 (en) | 2001-09-28 | 2011-08-16 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
US7313740B2 (en) * | 2002-07-25 | 2007-12-25 | Inapac Technology, Inc. | Internally generating patterns for testing in an integrated circuit device |
US8166361B2 (en) * | 2001-09-28 | 2012-04-24 | Rambus Inc. | Integrated circuit testing module configured for set-up and hold time testing |
US7245141B2 (en) * | 2002-11-27 | 2007-07-17 | Inapac Technology, Inc. | Shared bond pad for testing a memory within a packaged semiconductor device |
US7404117B2 (en) * | 2005-10-24 | 2008-07-22 | Inapac Technology, Inc. | Component testing and recovery |
US8286046B2 (en) | 2001-09-28 | 2012-10-09 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
JP3751576B2 (ja) * | 2002-05-28 | 2006-03-01 | 沖電気工業株式会社 | 半導体装置及びそのテスト方法 |
JP2004118987A (ja) * | 2002-09-30 | 2004-04-15 | Fujitsu Ltd | 半導体集積回路装置 |
US7466160B2 (en) * | 2002-11-27 | 2008-12-16 | Inapac Technology, Inc. | Shared memory bus architecture for system with processor and memory units |
US7673193B1 (en) * | 2005-08-18 | 2010-03-02 | Rambus Inc. | Processor-memory unit for use in system-in-package and system-in-module devices |
US7309999B2 (en) * | 2002-11-27 | 2007-12-18 | Inapac Technology, Inc. | Electronic device having an interface supported testing mode |
US8063650B2 (en) | 2002-11-27 | 2011-11-22 | Rambus Inc. | Testing fuse configurations in semiconductor devices |
JP4248359B2 (ja) * | 2003-09-30 | 2009-04-02 | 三洋電機株式会社 | 半導体装置およびその試験方法 |
JP2005300485A (ja) * | 2004-04-16 | 2005-10-27 | Renesas Technology Corp | 半導体装置 |
JP2006038678A (ja) * | 2004-07-28 | 2006-02-09 | Seiko Epson Corp | バーインテストシステム、バーインテスト方法 |
US7779311B2 (en) * | 2005-10-24 | 2010-08-17 | Rambus Inc. | Testing and recovery in a multilayer device |
US7362632B2 (en) * | 2006-01-17 | 2008-04-22 | Infineon Technologies Ag | Test parallelism increase by tester controllable switching of chip select groups |
JP5000900B2 (ja) * | 2006-03-02 | 2012-08-15 | ルネサスエレクトロニクス株式会社 | マルチチップ装置 |
CA2541046A1 (en) * | 2006-03-27 | 2007-09-27 | Mosaid Technologies Incorporated | Power supply testing architecture |
US7936789B2 (en) * | 2006-03-31 | 2011-05-03 | Intel Corporation | Disparate clock domain synchronization |
JP2007287292A (ja) * | 2006-04-20 | 2007-11-01 | Renesas Technology Corp | 半導体集積回路装置 |
JP2007335809A (ja) * | 2006-06-19 | 2007-12-27 | Nec Electronics Corp | 半導体装置及び半導体装置の動作制御方法 |
US7466603B2 (en) | 2006-10-03 | 2008-12-16 | Inapac Technology, Inc. | Memory accessing circuit system |
KR100870037B1 (ko) * | 2006-10-26 | 2008-11-24 | 삼성전자주식회사 | 테스트가 용이한 반도체 장치, 반도체 장치 테스트 방법,반도체 장치 테스트를 위한 테스트 클럭 생성 방법 및 장치 |
US7561027B2 (en) * | 2006-10-26 | 2009-07-14 | Hewlett-Packard Development Company, L.P. | Sensing device |
KR100881622B1 (ko) * | 2006-11-14 | 2009-02-04 | 삼성전자주식회사 | 멀티칩 및 그것의 테스트 방법 |
JP5165404B2 (ja) * | 2007-06-06 | 2013-03-21 | ルネサスエレクトロニクス株式会社 | 半導体装置と半導体装置の製造方法及びテスト方法 |
JP4909192B2 (ja) * | 2007-06-27 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | コンデンサ容量測定装置 |
JP5006723B2 (ja) | 2007-07-09 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置とそのテスト方法 |
JP2009229135A (ja) * | 2008-03-19 | 2009-10-08 | Binteeshisu:Kk | テストチップを備えたモジュール |
JP2009266258A (ja) | 2008-04-22 | 2009-11-12 | Hitachi Ltd | 半導体装置 |
CN101458971B (zh) * | 2008-12-02 | 2013-01-09 | 炬力集成电路设计有限公司 | 一种嵌入式静态存储器的测试系统及测试方法 |
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JP5353542B2 (ja) * | 2009-08-06 | 2013-11-27 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の試験方法 |
JP2011181174A (ja) * | 2011-04-25 | 2011-09-15 | Renesas Electronics Corp | 半導体装置及びそのテスト方法 |
KR20130002672A (ko) | 2011-06-29 | 2013-01-08 | 에스케이하이닉스 주식회사 | 반도체 장치 |
JP6084535B2 (ja) * | 2013-07-30 | 2017-02-22 | 株式会社メガチップス | メモリチップ試験回路 |
JP2017162011A (ja) | 2016-03-07 | 2017-09-14 | 株式会社メガチップス | メモリデバイス用テスト回路及びこれを含む半導体集積装置 |
JP2018092690A (ja) | 2016-11-30 | 2018-06-14 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体集積システム |
CN108962301B (zh) * | 2018-05-24 | 2022-04-12 | 济南德欧雅安全技术有限公司 | 一种存储装置 |
KR102665982B1 (ko) * | 2018-11-15 | 2024-05-20 | 에스케이하이닉스 주식회사 | 테스트 장치 및 그의 동작 방법 |
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CN116863986A (zh) * | 2023-09-05 | 2023-10-10 | 合肥康芯威存储技术有限公司 | 一种用于对存储设备进行分类的数据检测方法、装置 |
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-
2001
- 2001-09-05 JP JP2001268918A patent/JP4339534B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-08 TW TW091104399A patent/TWI259472B/zh not_active IP Right Cessation
- 2002-03-14 US US10/096,937 patent/US6711042B2/en not_active Expired - Lifetime
- 2002-03-25 KR KR1020020016068A patent/KR100890750B1/ko not_active IP Right Cessation
- 2002-04-09 EP EP02252524A patent/EP1291882A3/en not_active Ceased
- 2002-06-05 CN CNB021224463A patent/CN100375198C/zh not_active Expired - Fee Related
-
2008
- 2008-06-09 KR KR1020080053603A patent/KR100890749B1/ko not_active IP Right Cessation
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1312752C (zh) * | 2003-04-03 | 2007-04-25 | 索尼株式会社 | 半导体集成电路装置及其制造方法 |
CN1591697B (zh) * | 2003-09-05 | 2013-03-13 | 奇梦达股份公司 | 用于检查集成电路的信号输出的方法和装置 |
CN1591697A (zh) * | 2003-09-05 | 2005-03-09 | 因芬尼昂技术股份公司 | 集成电路输出信号检查方法及装置 |
US8120986B2 (en) | 2005-12-22 | 2012-02-21 | Samsung Electronics Co., Ltd. | Multi-port semiconductor memory device having variable access paths and method therefor |
CN1988033B (zh) * | 2005-12-22 | 2012-05-30 | 三星电子株式会社 | 具有可变存取路径的多端口半导体存储器件及其方法 |
CN102855939A (zh) * | 2006-03-22 | 2013-01-02 | 瑞萨电子株式会社 | 半导体装置及其测试方法 |
CN102033796B (zh) * | 2009-09-25 | 2013-01-16 | 中国移动通信集团公司 | 测试系统和方法 |
CN102956273A (zh) * | 2011-08-17 | 2013-03-06 | 台湾积体电路制造股份有限公司 | 用于基于2.5d/3d系统芯片的宽i/o dram的dram测试架构 |
CN102621478A (zh) * | 2012-03-29 | 2012-08-01 | 广州市广晟微电子有限公司 | 一种射频前端芯片的动态测试装置及系统 |
CN105319494A (zh) * | 2014-11-26 | 2016-02-10 | 北京同方微电子有限公司 | 一种集成电路芯片的自动老化测试装置 |
CN107039073A (zh) * | 2016-02-04 | 2017-08-11 | 新唐科技股份有限公司 | 非依电性存储器装置及其操作方法 |
CN107305789A (zh) * | 2016-04-21 | 2017-10-31 | 北京兆易创新科技股份有限公司 | 一种非挥发性存储器的自测试方法和装置 |
CN107305789B (zh) * | 2016-04-21 | 2020-08-07 | 北京兆易创新科技股份有限公司 | 一种非挥发性存储器的自测试方法和装置 |
CN106324485A (zh) * | 2016-08-30 | 2017-01-11 | 福州瑞芯微电子股份有限公司 | 芯片的无线测试电路及无线测试方法 |
CN106324485B (zh) * | 2016-08-30 | 2019-04-02 | 福州瑞芯微电子股份有限公司 | 芯片的无线测试电路及无线测试方法 |
CN108735747A (zh) * | 2017-04-20 | 2018-11-02 | 台湾积体电路制造股份有限公司 | 半导体器件、集成电路芯片及其形成方法 |
CN109427411A (zh) * | 2017-08-30 | 2019-03-05 | 台湾积体电路制造股份有限公司 | 金属隔离测试电路、系统及其测试方法 |
CN116612804A (zh) * | 2023-07-19 | 2023-08-18 | 芯天下技术股份有限公司 | 一种芯片崩边检测电路及存储芯片 |
CN116612804B (zh) * | 2023-07-19 | 2023-10-10 | 芯天下技术股份有限公司 | 一种芯片崩边检测电路及存储芯片 |
Also Published As
Publication number | Publication date |
---|---|
KR100890750B1 (ko) | 2009-03-26 |
KR100890749B1 (ko) | 2009-03-26 |
US6711042B2 (en) | 2004-03-23 |
JP2003077296A (ja) | 2003-03-14 |
US20030043612A1 (en) | 2003-03-06 |
KR20030021113A (ko) | 2003-03-12 |
CN100375198C (zh) | 2008-03-12 |
TWI259472B (en) | 2006-08-01 |
JP4339534B2 (ja) | 2009-10-07 |
EP1291882A3 (en) | 2004-12-08 |
EP1291882A2 (en) | 2003-03-12 |
KR20080063452A (ko) | 2008-07-04 |
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