CN1328604C - 三维光学波导及其制造方法、光学模块和光学传输系统 - Google Patents
三维光学波导及其制造方法、光学模块和光学传输系统 Download PDFInfo
- Publication number
- CN1328604C CN1328604C CNB03107040XA CN03107040A CN1328604C CN 1328604 C CN1328604 C CN 1328604C CN B03107040X A CNB03107040X A CN B03107040XA CN 03107040 A CN03107040 A CN 03107040A CN 1328604 C CN1328604 C CN 1328604C
- Authority
- CN
- China
- Prior art keywords
- substrate
- waveguide
- optical
- lens
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12002—Three-dimensional structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S385/00—Optical waveguides
- Y10S385/901—Illuminating or display apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002054375A JP3768901B2 (ja) | 2002-02-28 | 2002-02-28 | 立体光導波路の製造方法 |
| JP2002054375 | 2002-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1441266A CN1441266A (zh) | 2003-09-10 |
| CN1328604C true CN1328604C (zh) | 2007-07-25 |
Family
ID=27678567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03107040XA Expired - Lifetime CN1328604C (zh) | 2002-02-28 | 2003-02-28 | 三维光学波导及其制造方法、光学模块和光学传输系统 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US20030161573A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1341019B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP3768901B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1328604C (cg-RX-API-DMAC7.html) |
Families Citing this family (73)
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| TWI511477B (zh) * | 2011-12-07 | 2015-12-01 | Hon Hai Prec Ind Co Ltd | 光收發裝置 |
| US20130188970A1 (en) * | 2012-01-19 | 2013-07-25 | Kalpendu Shastri | Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors |
| JP5877749B2 (ja) * | 2012-03-29 | 2016-03-08 | 日東電工株式会社 | 光電気混載基板の製法 |
| US9134494B2 (en) * | 2012-05-29 | 2015-09-15 | 3M Innovative Properties Company | Optical interconnect |
| KR102009979B1 (ko) * | 2012-06-07 | 2019-08-12 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 반도체 장치 |
| JP6081086B2 (ja) * | 2012-06-14 | 2017-02-15 | Tdk株式会社 | 光電素子用実装装置及び実装方法 |
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| KR20140064530A (ko) * | 2012-11-20 | 2014-05-28 | 삼성전자주식회사 | 광 연결을 포함하는 다중 칩 패키지 |
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| US9094135B2 (en) * | 2013-06-10 | 2015-07-28 | Freescale Semiconductor, Inc. | Die stack with optical TSVs |
| US9810843B2 (en) * | 2013-06-10 | 2017-11-07 | Nxp Usa, Inc. | Optical backplane mirror |
| US10230458B2 (en) | 2013-06-10 | 2019-03-12 | Nxp Usa, Inc. | Optical die test interface with separate voltages for adjacent electrodes |
| US9766409B2 (en) | 2013-06-10 | 2017-09-19 | Nxp Usa, Inc. | Optical redundancy |
| US9442254B2 (en) | 2013-06-10 | 2016-09-13 | Freescale Semiconductor, Inc. | Method and apparatus for beam control with optical MEMS beam waveguide |
| US9086551B2 (en) * | 2013-10-30 | 2015-07-21 | International Business Machines Corporation | Double mirror structure for wavelength division multiplexing with polymer waveguides |
| JP6863896B2 (ja) * | 2014-09-29 | 2021-04-21 | マジック リープ,インコーポレイティド | 導波路から異なる波長の光を出力する構造および方法 |
| KR102630754B1 (ko) | 2015-03-16 | 2024-01-26 | 매직 립, 인코포레이티드 | 증강 현실 펄스 옥시미트리 |
| CA2989414A1 (en) | 2015-06-15 | 2016-12-22 | Magic Leap, Inc. | Display system with optical elements for in-coupling multiplexed light streams |
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| US10739518B2 (en) * | 2015-12-21 | 2020-08-11 | International Business Machines Corporation | Optical components for wavelength division multiplexing with high-density optical interconnect modules |
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| KR102641964B1 (ko) | 2016-05-12 | 2024-02-27 | 매직 립, 인코포레이티드 | 이미징 도파관을 통해 분배된 광 조작 |
| CN106159565A (zh) * | 2016-08-22 | 2016-11-23 | 安费诺电子装配(厦门)有限公司 | 一种带拉带脱锁结构的高速连接器模组及组装方法 |
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| CN110178077B (zh) | 2016-11-18 | 2022-08-30 | 奇跃公司 | 用于重定向具有宽入射角范围的光的多层液晶衍射光栅 |
| IL303676B2 (en) | 2016-11-18 | 2024-06-01 | Magic Leap Inc | Spatially variable liquid crystal diffraction gratings |
| US11067860B2 (en) | 2016-11-18 | 2021-07-20 | Magic Leap, Inc. | Liquid crystal diffractive devices with nano-scale pattern and methods of manufacturing the same |
| KR102585679B1 (ko) | 2016-12-08 | 2023-10-05 | 매직 립, 인코포레이티드 | 콜레스테릭 액정에 기초한 회절 디바이스들 |
| CA3046328A1 (en) | 2016-12-14 | 2018-06-21 | Magic Leap, Inc. | Patterning of liquid crystals using soft-imprint replication of surface alignment patterns |
| US10371896B2 (en) * | 2016-12-22 | 2019-08-06 | Magic Leap, Inc. | Color separation in planar waveguides using dichroic filters |
| IL268135B2 (en) | 2017-01-23 | 2024-03-01 | Magic Leap Inc | Eyepiece for virtual, augmented, or mixed reality systems |
| US10359565B2 (en) | 2017-02-07 | 2019-07-23 | Nokia Of America Corporation | Optoelectronic circuit having one or more double-sided substrates |
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| KR20240064054A (ko) | 2017-03-21 | 2024-05-10 | 매직 립, 인코포레이티드 | 회절 광학 엘리먼트들을 이용한 눈-이미징 장치 |
| JP6842377B2 (ja) * | 2017-06-20 | 2021-03-17 | 日本電信電話株式会社 | 平面光回路積層デバイス |
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2002
- 2002-02-28 JP JP2002054375A patent/JP3768901B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-24 US US10/370,605 patent/US20030161573A1/en not_active Abandoned
- 2003-02-28 CN CNB03107040XA patent/CN1328604C/zh not_active Expired - Lifetime
- 2003-02-28 EP EP03004550.4A patent/EP1341019B1/en not_active Expired - Lifetime
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2006
- 2006-11-17 US US11/600,730 patent/US7580605B2/en not_active Expired - Fee Related
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2009
- 2009-07-15 US US12/503,521 patent/US7869671B2/en not_active Expired - Fee Related
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| JP2000222769A (ja) * | 1999-02-03 | 2000-08-11 | Pioneer Electronic Corp | 光導波路素子及び光ピックアップ |
| JP2001110188A (ja) * | 1999-10-13 | 2001-04-20 | Mitsubishi Chemicals Corp | 光メモリ素子の製造方法及び光メモリ素子用樹脂製コア/クラッド部材 |
| US20010053260A1 (en) * | 2000-03-13 | 2001-12-20 | Toshiyuki Takizawa | Optical module and method for producing the same, and optical circuit device |
| WO2002010814A1 (en) * | 2000-08-01 | 2002-02-07 | University Of Maryland, College Park | Method for fabrication of vertically coupled integrated optical structures |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030161573A1 (en) | 2003-08-28 |
| US20090277228A1 (en) | 2009-11-12 |
| EP1341019B1 (en) | 2017-12-13 |
| US20070062221A1 (en) | 2007-03-22 |
| EP1341019A2 (en) | 2003-09-03 |
| JP3768901B2 (ja) | 2006-04-19 |
| EP1341019A3 (en) | 2004-09-29 |
| US7580605B2 (en) | 2009-08-25 |
| US7869671B2 (en) | 2011-01-11 |
| CN1441266A (zh) | 2003-09-10 |
| JP2003255166A (ja) | 2003-09-10 |
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