CN1319824C - 净室用容器及其制造方法 - Google Patents

净室用容器及其制造方法 Download PDF

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Publication number
CN1319824C
CN1319824C CNB2003801027232A CN200380102723A CN1319824C CN 1319824 C CN1319824 C CN 1319824C CN B2003801027232 A CNB2003801027232 A CN B2003801027232A CN 200380102723 A CN200380102723 A CN 200380102723A CN 1319824 C CN1319824 C CN 1319824C
Authority
CN
China
Prior art keywords
container
clean room
monomer
resin
copolymerization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2003801027232A
Other languages
English (en)
Chinese (zh)
Other versions
CN1711199A (zh
Inventor
坂本贵树
近内则行
白发准
田伏浩一
高桥和则
荘司博敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon A&L Inc
Fuji Plastic Co Ltd
Original Assignee
Nippon A&L Inc
Fuji Plastic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon A&L Inc, Fuji Plastic Co Ltd filed Critical Nippon A&L Inc
Publication of CN1711199A publication Critical patent/CN1711199A/zh
Application granted granted Critical
Publication of CN1319824C publication Critical patent/CN1319824C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Packaging For Recording Disks (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
CNB2003801027232A 2002-11-06 2003-10-20 净室用容器及其制造方法 Expired - Fee Related CN1319824C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP323002/2002 2002-11-06
JP2002323002 2002-11-06

Publications (2)

Publication Number Publication Date
CN1711199A CN1711199A (zh) 2005-12-21
CN1319824C true CN1319824C (zh) 2007-06-06

Family

ID=32310407

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801027232A Expired - Fee Related CN1319824C (zh) 2002-11-06 2003-10-20 净室用容器及其制造方法

Country Status (5)

Country Link
JP (1) JPWO2004041678A1 (fr)
CN (1) CN1319824C (fr)
AU (1) AU2003273048A1 (fr)
TW (1) TWI293934B (fr)
WO (1) WO2004041678A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5681419B2 (ja) * 2010-09-14 2015-03-11 日本ポリプロ株式会社 電気電子機器部品搬送用ケース
JP5993560B2 (ja) * 2010-10-06 2016-09-14 ゴールド工業株式会社 樹脂成形品、及び樹脂成形品の製造方法
CN105264012B (zh) * 2013-05-28 2021-02-19 日本A&L株式会社 橡胶强化热塑性树脂组合物及树脂成型品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56166213A (en) * 1980-05-26 1981-12-21 Sumitomo Chem Co Ltd Aftertreatment of liquid conjugate diene polymerization product
JPS58147414A (ja) * 1982-02-26 1983-09-02 Mitsubishi Monsanto Chem Co 耐衝撃性樹脂の製造方法
JPH09132619A (ja) * 1995-11-08 1997-05-20 Japan Synthetic Rubber Co Ltd ゴム強化熱可塑性樹脂および熱可塑性樹脂組成物
US6355767B1 (en) * 1999-07-15 2002-03-12 Teijin Chemicals, Ltd Aromatic polycarbonate resin composition
US20020156183A1 (en) * 2000-07-11 2002-10-24 Norio Nagata Transparent impact-resistant thermoplastic resin composition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147417A (ja) * 1982-02-27 1983-09-02 Nitto Electric Ind Co Ltd エポキシ樹脂用アミン系硬化剤
JPS62197409A (ja) * 1986-02-24 1987-09-01 Asahi Chem Ind Co Ltd ブロック共重合体を含有する組成物
JPS6372747A (ja) * 1987-08-26 1988-04-02 Asahi Chem Ind Co Ltd スチレン系重合体組成物
JPH0768300B2 (ja) * 1988-05-24 1995-07-26 三菱化学株式会社 耐衝撃性樹脂の製造方法
JP2816864B2 (ja) * 1989-07-07 1998-10-27 大塚化学株式会社 搬送用ウエーハバスケット及び収納ケース
JP2835531B2 (ja) * 1989-08-09 1998-12-14 三菱化学株式会社 耐衝撃性熱可塑性樹脂組成物
JP3112519B2 (ja) * 1991-09-24 2000-11-27 旭化成工業株式会社 導電性の改良されたｉｃ耐熱トレー用樹脂組成物
JP3120314B2 (ja) * 1993-03-05 2000-12-25 日本エイアンドエル株式会社 熱可塑性樹脂組成物
JPH06299045A (ja) * 1993-04-16 1994-10-25 Kanegafuchi Chem Ind Co Ltd 艶消し性熱可塑性樹脂組成物
JP3277729B2 (ja) * 1994-11-04 2002-04-22 ジェイエスアール株式会社 難燃性樹脂組成物
JP3654757B2 (ja) * 1997-11-10 2005-06-02 旭化成ケミカルズ株式会社 新規なゴム変性スチレン系樹脂組成物、及びその成形品
JP4722237B2 (ja) * 1998-02-27 2011-07-13 ユーエムジー・エービーエス株式会社 熱可塑性樹脂組成物及びこれを用いた異型押出し成形品
JP2001131380A (ja) * 1999-10-29 2001-05-15 Nippon A & L Kk 透明難燃性熱可塑性樹脂組成物
JP2001151974A (ja) * 1999-11-29 2001-06-05 Denki Kagaku Kogyo Kk 難燃性樹脂組成物
WO2018115117A1 (fr) * 2016-12-20 2018-06-28 Basf Se Processus de préparation d'une composition extrudable comprenant une matière zéolitique contenant du titane ayant une structure de type mww

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56166213A (en) * 1980-05-26 1981-12-21 Sumitomo Chem Co Ltd Aftertreatment of liquid conjugate diene polymerization product
JPS58147414A (ja) * 1982-02-26 1983-09-02 Mitsubishi Monsanto Chem Co 耐衝撃性樹脂の製造方法
JPH09132619A (ja) * 1995-11-08 1997-05-20 Japan Synthetic Rubber Co Ltd ゴム強化熱可塑性樹脂および熱可塑性樹脂組成物
US6355767B1 (en) * 1999-07-15 2002-03-12 Teijin Chemicals, Ltd Aromatic polycarbonate resin composition
US20020156183A1 (en) * 2000-07-11 2002-10-24 Norio Nagata Transparent impact-resistant thermoplastic resin composition

Also Published As

Publication number Publication date
CN1711199A (zh) 2005-12-21
WO2004041678A1 (fr) 2004-05-21
AU2003273048A8 (en) 2004-06-07
AU2003273048A1 (en) 2004-06-07
JPWO2004041678A1 (ja) 2006-03-09
TW200415093A (en) 2004-08-16
TWI293934B (en) 2008-03-01

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070606

Termination date: 20161020