CN1318474C - 光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板 - Google Patents

光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板 Download PDF

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Publication number
CN1318474C
CN1318474C CNB2003801044685A CN200380104468A CN1318474C CN 1318474 C CN1318474 C CN 1318474C CN B2003801044685 A CNB2003801044685 A CN B2003801044685A CN 200380104468 A CN200380104468 A CN 200380104468A CN 1318474 C CN1318474 C CN 1318474C
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CN
China
Prior art keywords
group
photocurable
resin composition
thermosetting resin
carboxyl group
Prior art date
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Expired - Lifetime
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CNB2003801044685A
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English (en)
Chinese (zh)
Other versions
CN1717428A (zh
Inventor
小岛秀明
平井良学
米田直树
峰岸昌司
宫部英和
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Publication of CN1717428A publication Critical patent/CN1717428A/zh
Application granted granted Critical
Publication of CN1318474C publication Critical patent/CN1318474C/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB2003801044685A 2002-11-28 2003-11-27 光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板 Expired - Lifetime CN1318474C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP346254/2002 2002-11-28
JP2002346254 2002-11-28

Publications (2)

Publication Number Publication Date
CN1717428A CN1717428A (zh) 2006-01-04
CN1318474C true CN1318474C (zh) 2007-05-30

Family

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Family Applications (1)

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CNB2003801044685A Expired - Lifetime CN1318474C (zh) 2002-11-28 2003-11-27 光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板

Country Status (8)

Country Link
EP (1) EP1568723B1 (enExample)
JP (1) JP4203017B2 (enExample)
KR (1) KR101009081B1 (enExample)
CN (1) CN1318474C (enExample)
AT (1) ATE527297T1 (enExample)
AU (1) AU2003284475A1 (enExample)
TW (1) TW200417294A (enExample)
WO (1) WO2004048434A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
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KR20070065889A (ko) * 2004-10-20 2007-06-25 미쓰비시 가가꾸 가부시키가이샤 감광성 조성물, 화상 형성 재료, 화상 형성재, 및 화상형성 방법
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
TW200720845A (en) * 2005-07-13 2007-06-01 Taiyo Ink Mfg Co Ltd Black paste composition, method for black matrix pattern formation using the same, and its black matrix pattern
JP5384785B2 (ja) * 2005-09-06 2014-01-08 太陽ホールディングス株式会社 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same
KR101395375B1 (ko) * 2006-03-29 2014-05-14 다이요 홀딩스 가부시키가이샤 광경화성ㆍ열경화성 수지 조성물 및 그의 경화물 및 그것을이용하여 얻어지는 인쇄 배선판
WO2007119651A1 (ja) * 2006-04-13 2007-10-25 Taiyo Ink Mfg. Co., Ltd. アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
KR100951874B1 (ko) * 2006-04-24 2010-04-12 주식회사 코오롱 Ｌｄｉ용 드라이 필름 포토레지스트 수지 조성물
KR100883047B1 (ko) * 2006-07-10 2009-02-11 다이요 잉키 세이조 가부시키가이샤 광 경화성ㆍ열 경화성 수지 조성물, 그의 경화물 및 인쇄배선판
JP5276832B2 (ja) * 2006-11-15 2013-08-28 太陽ホールディングス株式会社 ソルダーレジスト膜形成方法および感光性組成物
JP5079310B2 (ja) * 2006-11-15 2012-11-21 太陽ホールディングス株式会社 ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法
JP4616863B2 (ja) * 2007-06-04 2011-01-19 太陽ホールディングス株式会社 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板
KR100910672B1 (ko) * 2007-08-03 2009-08-04 도레이새한 주식회사 내열성 점착시트
CN100554335C (zh) * 2007-10-17 2009-10-28 太阳油墨（苏州）有限公司 用于印刷电路板的外观检查的树脂组合物
TWI383251B (zh) 2008-01-16 2013-01-21 Eternal Chemical Co Ltd 感光型聚醯亞胺
JP5632146B2 (ja) * 2009-09-02 2014-11-26 太陽ホールディングス株式会社 硬化性樹脂組成物
CN102804066B (zh) * 2010-03-22 2015-04-01 株式会社Lg化学 光固化和热固化树脂组合物及防焊干膜
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
JP5789612B2 (ja) * 2010-09-29 2015-10-07 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP2012098470A (ja) * 2010-11-01 2012-05-24 Kaneka Corp 新規な感光性樹脂組成物及びその利用
CN102186309B (zh) * 2011-03-22 2013-03-20 鞍山市正发电路有限公司 激光直接成像全印刷电路
WO2013038624A1 (ja) * 2011-09-13 2013-03-21 凸版印刷株式会社 静電容量式タッチパネルセンサー基板の製造方法、静電容量式タッチパネルセンサー基板および表示装置
JP5858740B2 (ja) * 2011-11-15 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858739B2 (ja) * 2011-11-15 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858747B2 (ja) * 2011-11-21 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858746B2 (ja) * 2011-11-21 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP6130693B2 (ja) 2012-03-30 2017-05-17 太陽インキ製造株式会社 積層構造体、ドライフィルムおよび積層構造体の製造方法
CN107422604A (zh) * 2012-06-29 2017-12-01 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜、固化物以及印刷电路板
CN104704426A (zh) 2012-08-01 2015-06-10 株式会社Lg化学 具有光固化性能和热固化性能的树脂组合物及阻焊干膜
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
KR101629942B1 (ko) * 2013-06-12 2016-06-13 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물, 및 드라이 필름 솔더 레지스트
JPWO2015178462A1 (ja) * 2014-05-21 2017-04-20 旭化成株式会社 感光性樹脂組成物及び回路パターンの形成方法
JP6704224B2 (ja) * 2015-04-15 2020-06-03 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
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JP7330719B2 (ja) * 2019-03-01 2023-08-22 太陽ホールディングス株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物
JP6986534B2 (ja) * 2019-09-11 2021-12-22 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物を有するドライフィルム及び感光性樹脂組成物の光硬化物を有するプリント配線板
CN115989456A (zh) * 2020-09-04 2023-04-18 太阳油墨制造株式会社 光固化性热固化性树脂组合物、干膜、固化物和具有该固化物的电子部件
KR20220136130A (ko) 2021-03-31 2022-10-07 다이요 잉키 세이조 가부시키가이샤 2액형 경화성 수지 조성물, 제품, 드라이 필름, 경화물, 및 프린트 배선판
CN113099624A (zh) * 2021-04-06 2021-07-09 浙江欣旺达电子有限公司 一种线路板阻焊层的制作方法
CN113980510A (zh) * 2021-10-28 2022-01-28 江西超洋科技有限公司 一种ldi高感阻焊哑黑油墨及其制备方法
JPWO2024204644A1 (enExample) * 2023-03-31 2024-10-03
EP4588953A1 (en) * 2024-01-17 2025-07-23 Siemens Gamesa Renewable Energy A/S Method of producing a wind turbine blade, a respectively produced wind turbine blade and a resin composition suitable for use in the production

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Publication number Publication date
KR20050084003A (ko) 2005-08-26
ATE527297T1 (de) 2011-10-15
AU2003284475A1 (en) 2004-06-18
TWI303142B (enExample) 2008-11-11
EP1568723B1 (en) 2011-10-05
EP1568723A4 (en) 2008-05-21
JP4203017B2 (ja) 2008-12-24
WO2004048434A1 (ja) 2004-06-10
EP1568723A1 (en) 2005-08-31
KR101009081B1 (ko) 2011-01-18
JPWO2004048434A1 (ja) 2006-03-23
TW200417294A (en) 2004-09-01
CN1717428A (zh) 2006-01-04

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