ATE527297T1 - Foto- und thermo-einstellungs-harzzusammensetzung und gedruckte verdrahtungsplatten, hergestellt unter verwendung derselben - Google Patents

Foto- und thermo-einstellungs-harzzusammensetzung und gedruckte verdrahtungsplatten, hergestellt unter verwendung derselben

Info

Publication number
ATE527297T1
ATE527297T1 AT03775937T AT03775937T ATE527297T1 AT E527297 T1 ATE527297 T1 AT E527297T1 AT 03775937 T AT03775937 T AT 03775937T AT 03775937 T AT03775937 T AT 03775937T AT E527297 T1 ATE527297 T1 AT E527297T1
Authority
AT
Austria
Prior art keywords
photo
resin composition
same
printed wiring
wiring boards
Prior art date
Application number
AT03775937T
Other languages
English (en)
Inventor
Hideaki Kojima
Yoshitaka Hirai
Naoki Yoneda
Shoji Minegishi
Hidekazu Miyabe
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Application granted granted Critical
Publication of ATE527297T1 publication Critical patent/ATE527297T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT03775937T 2002-11-28 2003-11-27 Foto- und thermo-einstellungs-harzzusammensetzung und gedruckte verdrahtungsplatten, hergestellt unter verwendung derselben ATE527297T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002346254 2002-11-28
PCT/JP2003/015187 WO2004048434A1 (ja) 2002-11-28 2003-11-27 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板

Publications (1)

Publication Number Publication Date
ATE527297T1 true ATE527297T1 (de) 2011-10-15

Family

ID=32376051

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03775937T ATE527297T1 (de) 2002-11-28 2003-11-27 Foto- und thermo-einstellungs-harzzusammensetzung und gedruckte verdrahtungsplatten, hergestellt unter verwendung derselben

Country Status (8)

Country Link
EP (1) EP1568723B1 (de)
JP (1) JP4203017B2 (de)
KR (1) KR101009081B1 (de)
CN (1) CN1318474C (de)
AT (1) ATE527297T1 (de)
AU (1) AU2003284475A1 (de)
TW (1) TW200417294A (de)
WO (1) WO2004048434A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070065889A (ko) * 2004-10-20 2007-06-25 미쓰비시 가가꾸 가부시키가이샤 감광성 조성물, 화상 형성 재료, 화상 형성재, 및 화상형성 방법
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
CN101223478B (zh) * 2005-07-13 2011-10-12 太阳控股株式会社 黑色糊剂组合物及使用其的黑色矩阵图案的形成方法、以及该黑色矩阵图案
JP5384785B2 (ja) * 2005-09-06 2014-01-08 太陽ホールディングス株式会社 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
KR100787341B1 (ko) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판
WO2007111336A1 (ja) * 2006-03-29 2007-10-04 Taiyo Ink Mfg. Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
CN102445850B (zh) * 2006-04-13 2013-07-31 太阳控股株式会社 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板
KR100951874B1 (ko) * 2006-04-24 2010-04-12 주식회사 코오롱 Ｌｄｉ용 드라이 필름 포토레지스트 수지 조성물
KR100883047B1 (ko) * 2006-07-10 2009-02-11 다이요 잉키 세이조 가부시키가이샤 광 경화성ㆍ열 경화성 수지 조성물, 그의 경화물 및 인쇄배선판
JP5079310B2 (ja) * 2006-11-15 2012-11-21 太陽ホールディングス株式会社 ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法
JP5276832B2 (ja) * 2006-11-15 2013-08-28 太陽ホールディングス株式会社 ソルダーレジスト膜形成方法および感光性組成物
JP4616863B2 (ja) * 2007-06-04 2011-01-19 太陽ホールディングス株式会社 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板
KR100910672B1 (ko) * 2007-08-03 2009-08-04 도레이새한 주식회사 내열성 점착시트
CN100554335C (zh) * 2007-10-17 2009-10-28 太阳油墨（苏州）有限公司 用于印刷电路板的外观检查的树脂组合物
TWI383251B (zh) 2008-01-16 2013-01-21 Eternal Chemical Co Ltd 感光型聚醯亞胺
CN101315520B (zh) * 2008-07-25 2011-11-30 深圳市容大电子材料有限公司 一种pcb油墨组合物、其制法、应用和印制电路板
JP5632146B2 (ja) * 2009-09-02 2014-11-26 太陽ホールディングス株式会社 硬化性樹脂組成物
CN102804066B (zh) * 2010-03-22 2015-04-01 株式会社Lg化学 光固化和热固化树脂组合物及防焊干膜
CN103109234A (zh) * 2010-09-16 2013-05-15 株式会社Lg化学 光敏树脂组合物、干膜阻焊膜以及电路板
US9081276B2 (en) 2010-09-29 2015-07-14 Kaneka Corporation Photosensitive resin composition production kit, and use thereof
JP2012098470A (ja) * 2010-11-01 2012-05-24 Kaneka Corp 新規な感光性樹脂組成物及びその利用
CN102186309B (zh) * 2011-03-22 2013-03-20 鞍山市正发电路有限公司 激光直接成像全印刷电路
WO2013038624A1 (ja) * 2011-09-13 2013-03-21 凸版印刷株式会社 静電容量式タッチパネルセンサー基板の製造方法、静電容量式タッチパネルセンサー基板および表示装置
JP5858740B2 (ja) * 2011-11-15 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858739B2 (ja) * 2011-11-15 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858747B2 (ja) * 2011-11-21 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP5858746B2 (ja) * 2011-11-21 2016-02-10 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
JP6130693B2 (ja) * 2012-03-30 2017-05-17 太陽インキ製造株式会社 積層構造体、ドライフィルムおよび積層構造体の製造方法
CN107422604A (zh) * 2012-06-29 2017-12-01 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜、固化物以及印刷电路板
KR101545724B1 (ko) 2012-08-01 2015-08-19 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
KR101629942B1 (ko) * 2013-06-12 2016-06-13 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물, 및 드라이 필름 솔더 레지스트
CN111694218B (zh) * 2014-05-21 2023-09-08 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
JP6704224B2 (ja) * 2015-04-15 2020-06-03 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6416327B1 (ja) 2017-06-06 2018-10-31 太陽インキ製造株式会社 インクジェット用硬化性組成物セット、硬化物、その製造方法、プリント配線板およびファンアウト型のウェハレベルパッケージ
JP7330719B2 (ja) * 2019-03-01 2023-08-22 太陽ホールディングス株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物
JP6986534B2 (ja) * 2019-09-11 2021-12-22 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物を有するドライフィルム及び感光性樹脂組成物の光硬化物を有するプリント配線板
TW202219169A (zh) * 2020-09-04 2022-05-16 日商太陽油墨製造股份有限公司 光硬化性熱硬化性樹脂組成物、乾薄膜、硬化物及具有該硬化物之電子零件
KR20220136130A (ko) 2021-03-31 2022-10-07 다이요 잉키 세이조 가부시키가이샤 2액형 경화성 수지 조성물, 제품, 드라이 필름, 경화물, 및 프린트 배선판
CN113099624A (zh) * 2021-04-06 2021-07-09 浙江欣旺达电子有限公司 一种线路板阻焊层的制作方法
CN113980510A (zh) * 2021-10-28 2022-01-28 江西超洋科技有限公司 一种ldi高感阻焊哑黑油墨及其制备方法
WO2024204644A1 (ja) * 2023-03-31 2024-10-03 太陽ホールディングス株式会社 多液型硬化性樹脂組成物、ドライフィルム、硬化物、および電子部品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166306A (ja) * 1984-02-09 1985-08-29 Daicel Chem Ind Ltd 光重合開始剤
JP3953625B2 (ja) * 1998-03-02 2007-08-08 太陽インキ製造株式会社 感光性組成物
SG97168A1 (en) * 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
KR100634341B1 (ko) * 2000-02-14 2006-10-16 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 윤기를 없앤 피막 형성용 광경화성·열경화성 조성물
JP4469481B2 (ja) 2000-09-20 2010-05-26 昭和高分子株式会社 感光性樹脂組成物
JP4713753B2 (ja) 2001-03-29 2011-06-29 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びその硬化物
JP4573152B2 (ja) 2001-03-29 2010-11-04 株式会社タムラ製作所 プリント配線板製造用感光性樹脂組成物

Also Published As

Publication number Publication date
JPWO2004048434A1 (ja) 2006-03-23
EP1568723B1 (de) 2011-10-05
KR101009081B1 (ko) 2011-01-18
TWI303142B (de) 2008-11-11
AU2003284475A1 (en) 2004-06-18
CN1318474C (zh) 2007-05-30
TW200417294A (en) 2004-09-01
WO2004048434A1 (ja) 2004-06-10
EP1568723A1 (de) 2005-08-31
KR20050084003A (ko) 2005-08-26
JP4203017B2 (ja) 2008-12-24
CN1717428A (zh) 2006-01-04
EP1568723A4 (de) 2008-05-21

Similar Documents

Publication Publication Date Title
ATE527297T1 (de) Foto- und thermo-einstellungs-harzzusammensetzung und gedruckte verdrahtungsplatten, hergestellt unter verwendung derselben
WO2003076528A3 (en) Photocurable resin composition and optical component
DE602005027551D1 (de) Sowohl durch radikalische photohärtung als auch durch kationische photohärtung härtbare zusammensetzung
TW200710572A (en) Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
EP1630215A3 (de) Photovernetzbare Harzzusammensetzung und Harzzusammensetzungen für Kunstoffe, die solche enthalten
TW200617086A (en) Curable resin composition, curable film and cured film
DE602006006907D1 (de) Zweikomponentige epoxidklebstoffzusammensetzung
TW200708896A (en) Alkaline-developable photosensitive colored composition
WO2004081664A3 (en) Novel photosensitive resin compositions
TW200613356A (en) Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same
TW200635976A (en) Epoxy resin composition for photosemiconductor element encapsulation and photosemiconductor device using the same
DE602007011416D1 (de) Bodensubstrat mit einer beschichtung aus einer härtbaren zusammensetzung
KR940009753A (ko) 감광성 수지 조성물 또는 감광성 열경화성 수지 조성물 및 이를 사용한 광납땜 내식막 조성물
TW200942580A (en) Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition
EP1494073A3 (de) Lichtempfindliche Harzzusammensetzung und Leiterplatte
ATE315072T1 (de) Flammhemmende härtbare harzzusammensetzung und flammhemmender härtbarer klebstoff
WO2004088423A3 (en) Photoresist compositions
WO2005015309A3 (en) Alkali-developable radiation curable composition
WO2002048217A1 (fr) Polymere pour vernis photoresistant et compositions de resine l'utilisant
AU2001286239A1 (en) Ultraviolet-curable resin composition and photosolder resist ink containing the composition
EP1894972A3 (de) Lichtempfindliche Harzzusammensetzung für eine flexible Leiterplatte und flexible Leiterplatte damit
DE60314794D1 (de) IR-photoempfindliche Zusammensetzung
ATE272662T1 (de) Härtbare zusammensetzungen aus glycidylverbindungen, aminischen härtern und niedrigviskosen härtungsbeschleunigern
DE602004013766D1 (de) Härtbare polymerverbindung
EP1744212A3 (de) Lichtempfindliche Zusammensetzung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties