CN1310345C - 白光发光装置 - Google Patents

白光发光装置 Download PDF

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Publication number
CN1310345C
CN1310345C CNB2003101015379A CN200310101537A CN1310345C CN 1310345 C CN1310345 C CN 1310345C CN B2003101015379 A CNB2003101015379 A CN B2003101015379A CN 200310101537 A CN200310101537 A CN 200310101537A CN 1310345 C CN1310345 C CN 1310345C
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CN
China
Prior art keywords
light emitting
emitting device
white light
emitting element
protective member
Prior art date
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Expired - Fee Related
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CNB2003101015379A
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English (en)
Chinese (zh)
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CN1497747A (zh
Inventor
野口克彦
堀内惠
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Publication date
Application filed by Citizen Electronics Co Ltd filed Critical Citizen Electronics Co Ltd
Publication of CN1497747A publication Critical patent/CN1497747A/zh
Application granted granted Critical
Publication of CN1310345C publication Critical patent/CN1310345C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)
CNB2003101015379A 2002-10-07 2003-10-08 白光发光装置 Expired - Fee Related CN1310345C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002294326A JP4280050B2 (ja) 2002-10-07 2002-10-07 白色発光装置
JP2002294326 2002-10-07

Publications (2)

Publication Number Publication Date
CN1497747A CN1497747A (zh) 2004-05-19
CN1310345C true CN1310345C (zh) 2007-04-11

Family

ID=32025495

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101015379A Expired - Fee Related CN1310345C (zh) 2002-10-07 2003-10-08 白光发光装置

Country Status (6)

Country Link
US (1) US7180240B2 (https=)
EP (1) EP1408559A3 (https=)
JP (1) JP4280050B2 (https=)
KR (1) KR100655252B1 (https=)
CN (1) CN1310345C (https=)
TW (1) TWI236159B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403422A (zh) * 2011-11-17 2012-04-04 深圳市天电光电科技有限公司 一种led封装结构的加工方法及led封装结构

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910144B2 (ja) 2003-01-06 2007-04-25 シャープ株式会社 半導体発光装置およびその製造方法
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
JP4788109B2 (ja) * 2003-10-28 2011-10-05 パナソニック電工株式会社 半導体発光装置及びその製造方法
CN1860329A (zh) * 2004-01-29 2006-11-08 松下电器产业株式会社 Led照明光源
TWI244226B (en) * 2004-11-05 2005-11-21 Chen Jen Shian Manufacturing method of flip-chip light-emitting device
TWI241034B (en) 2004-05-20 2005-10-01 Lighthouse Technology Co Ltd Light emitting diode package
JP4485856B2 (ja) * 2004-06-10 2010-06-23 スタンレー電気株式会社 大電力用ｌｅｄランプ
USD512029S1 (en) * 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
WO2006005062A2 (en) * 2004-06-30 2006-01-12 Cree, Inc. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
JP2006049442A (ja) 2004-08-02 2006-02-16 Sharp Corp 半導体発光装置およびその製造方法
US7256057B2 (en) * 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
USD521463S1 (en) * 2004-10-19 2006-05-23 Rohm Co., Ltd. Light emitting diode
TWD110646S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
USD521950S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
USD544847S1 (en) * 2004-10-19 2007-06-19 Rohm Co., Ltd. Light emitting diode
USD536308S1 (en) 2004-10-19 2007-02-06 Rohm Co., Ltd. Light emitting diode
TWD110647S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
USD521946S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
USD521947S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
TWD110645S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
TWD110644S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
TWI245437B (en) * 2004-11-16 2005-12-11 Lighthouse Technology Co Ltd Package structure of a surface mount device light emitting diode
KR100867515B1 (ko) * 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
KR100580753B1 (ko) 2004-12-17 2006-05-15 엘지이노텍 주식회사 발광소자 패키지
JP4591071B2 (ja) * 2004-12-20 2010-12-01 日亜化学工業株式会社 半導体装置
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
USD535262S1 (en) * 2005-06-08 2007-01-16 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
TWD120846S1 (zh) * 2005-06-08 2008-01-01 松下電器產業股份有限公司 照明用發光元件模組
TWD120106S1 (zh) * 2005-06-08 2007-11-21 松下電器產業股份有限公司 照明用發光元件模組
TWD122880S1 (zh) * 2005-06-08 2008-05-11 松下電器產業股份有限公司 照明用發光元件模組
TWI422044B (zh) 2005-06-30 2014-01-01 克立公司 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置
US7294861B2 (en) * 2005-06-30 2007-11-13 3M Innovative Properties Company Phosphor tape article
US20070001182A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Structured phosphor tape article
KR101161383B1 (ko) * 2005-07-04 2012-07-02 서울반도체 주식회사 발광 다이오드 및 이를 제조하기 위한 방법
US20070007542A1 (en) * 2005-07-07 2007-01-11 Sumitomo Electric Industries,Ltd. White-Light Emitting Device
JP2007027278A (ja) * 2005-07-13 2007-02-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JP4640248B2 (ja) * 2005-07-25 2011-03-02 豊田合成株式会社 光源装置
KR100807015B1 (ko) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 발광 장치
JP2007073575A (ja) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd 半導体発光装置
DE102006004397A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
GB2432967A (en) * 2005-11-30 2007-06-06 Unity Opto Technology Co Ltd White light LED with fluorescent powder containing wavelength converting plate
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2007194525A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd 半導体発光装置
JP4749870B2 (ja) * 2006-01-24 2011-08-17 新光電気工業株式会社 発光装置の製造方法
JP4996101B2 (ja) * 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5956937B2 (ja) * 2006-02-03 2016-07-27 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法
JP4828248B2 (ja) * 2006-02-16 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
KR100746749B1 (ko) 2006-03-15 2007-08-09 (주)케이디티 광 여기 시트
US7683475B2 (en) * 2006-03-31 2010-03-23 Dicon Fiberoptics, Inc. LED chip array module
JP2007288050A (ja) * 2006-04-19 2007-11-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JP3914954B1 (ja) 2006-05-24 2007-05-16 株式会社エレメント電子 発光装置およびその製造方法
JP2007335462A (ja) * 2006-06-12 2007-12-27 Stanley Electric Co Ltd 半導体複合素子およびその製造方法
US8251538B2 (en) * 2006-06-14 2012-08-28 Koninklijke Philips Electronics N.V. Lighting device
TWM303493U (en) * 2006-07-21 2006-12-21 Lighthouse Technology Co Ltd Support rack structure and metal support rack of side light source SMD LED
WO2008013097A1 (en) * 2006-07-25 2008-01-31 Showa Denko K.K. Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus
US7663152B2 (en) * 2006-08-09 2010-02-16 Philips Lumileds Lighting Company, Llc Illumination device including wavelength converting element side holding heat sink
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
US7800304B2 (en) * 2007-01-12 2010-09-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged LED light source
DE102007015474A1 (de) 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR100869640B1 (ko) * 2007-04-20 2008-11-21 (주)원반도체 발광 다이오드
WO2009003176A1 (en) * 2007-06-27 2008-12-31 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
KR200451231Y1 (ko) 2007-09-27 2010-12-03 지잉 퉁 텍. 메탈 코., 엘티디. 복합식 방열 모듈
CN101868865B (zh) * 2007-11-20 2012-08-22 皇家飞利浦电子股份有限公司 具有波长转换的侧发射器件
USD605611S1 (en) * 2008-06-25 2009-12-08 Seoul Semiconductor Co., Ltd. Light emitting diode
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
DE102008045653B4 (de) * 2008-09-03 2020-03-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
JP5327601B2 (ja) 2008-12-12 2013-10-30 東芝ライテック株式会社 発光モジュールおよび照明装置
KR101064005B1 (ko) * 2009-03-02 2011-09-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법
JP5482378B2 (ja) * 2009-04-20 2014-05-07 日亜化学工業株式会社 発光装置
JP5367668B2 (ja) * 2009-11-17 2013-12-11 スタンレー電気株式会社 発光装置およびその製造方法
EP2546900A4 (en) * 2010-03-12 2016-02-17 Sharp Kk DEVICE FOR PRODUCING A LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, LIGHTING DEVICE, TAIL LIGHT, LIQUID CRYSTAL PANEL, DISPLAY DEVICE, METHOD FOR PRODUCING THE DISPLAY DEVICE, METHOD FOR CONTROLLING THE DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
KR101121745B1 (ko) 2010-03-31 2012-03-22 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
US8941135B2 (en) 2010-07-15 2015-01-27 Nitto Denko Corporation Light emissive ceramic laminate and method of making same
JP5595185B2 (ja) * 2010-08-27 2014-09-24 三菱電機株式会社 発光装置および照明器具
TWI446590B (zh) 2010-09-30 2014-07-21 億光電子工業股份有限公司 發光二極體封裝結構及其製作方法
KR101212654B1 (ko) * 2011-05-20 2012-12-14 (주)라이타이저코리아 발광 다이오드 패키지 및 그의 제조 방법
JP2011171769A (ja) * 2011-06-06 2011-09-01 Toshiba Corp Ｌｅｄパッケージの包装材
TW201306323A (zh) * 2011-07-31 2013-02-01 Walsin Lihwa Corp 發光二極體裝置
JP2013041950A (ja) 2011-08-12 2013-02-28 Sharp Corp 発光装置
KR101878270B1 (ko) * 2011-09-15 2018-07-13 엘지이노텍 주식회사 광여기 판을 포함하는 조명 장치 및 광여기 테이프
JP5848562B2 (ja) * 2011-09-21 2016-01-27 シチズン電子株式会社 半導体発光装置及びその製造方法。
CN102569600B (zh) * 2011-11-11 2014-12-10 深圳市瑞丰光电子股份有限公司 发光二极管封装结构及其反射杯
US9240524B2 (en) * 2012-03-05 2016-01-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
JP5153950B1 (ja) * 2012-04-18 2013-02-27 Ｅ＆Ｅ Ｊａｐａｎ株式会社 発光ダイオード
CN105493301A (zh) 2013-07-08 2016-04-13 皇家飞利浦有限公司 波长转换的半导体发光器件
WO2015036887A1 (en) * 2013-09-13 2015-03-19 Koninklijke Philips N.V. Frame based package for flip-chip led
JP2015164234A (ja) * 2015-06-17 2015-09-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
JP6632834B2 (ja) 2015-08-24 2020-01-22 スタンレー電気株式会社 発光装置
JP6928424B2 (ja) * 2016-02-24 2021-09-01 日亜化学工業株式会社 蛍光体及び発光装置
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DE102017117425A1 (de) * 2017-08-01 2019-02-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements
JP2019046989A (ja) 2017-09-04 2019-03-22 スタンレー電気株式会社 半導体発光装置及び半導体発光装置の製造方法
JP6675032B1 (ja) * 2019-07-08 2020-04-01 御田　護 半導体発光装置
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163417A (ja) * 1997-09-26 1999-06-18 Matsushita Electric Ind Co Ltd 発光ダイオード
JP2002043625A (ja) * 2000-07-19 2002-02-08 Koha Co Ltd Ｌｅｄ装置
JP2002289925A (ja) * 2001-03-23 2002-10-04 Citizen Electronics Co Ltd 発光ダイオード

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59713024D1 (de) * 1996-06-26 2010-01-28 Osram Opto Semiconductors Gmbh Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung
US6319425B1 (en) * 1997-07-07 2001-11-20 Asahi Rubber Inc. Transparent coating member for light-emitting diodes and a fluorescent color light source
US6184544B1 (en) * 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
KR100345283B1 (ko) 1998-05-15 2002-10-25 테스텍 주식회사 접촉발광소자와그의제조방법및이를이용한접촉입력장치
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6504301B1 (en) * 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
JP4066620B2 (ja) * 2000-07-21 2008-03-26 日亜化学工業株式会社 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
JP2002050797A (ja) * 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
EP1187226B1 (en) * 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
US6833566B2 (en) * 2001-03-28 2004-12-21 Toyoda Gosei Co., Ltd. Light emitting diode with heat sink
JP3891115B2 (ja) * 2001-04-17 2007-03-14 日亜化学工業株式会社 発光装置
JP4114331B2 (ja) * 2001-06-15 2008-07-09 豊田合成株式会社 発光装置
JP2003158301A (ja) * 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP2003163378A (ja) * 2001-11-26 2003-06-06 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3768864B2 (ja) * 2001-11-26 2006-04-19 シチズン電子株式会社 表面実装型発光ダイオード及びその製造方法
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
US6936857B2 (en) * 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
US6828590B2 (en) * 2003-05-07 2004-12-07 Bear Hsiung Light emitting diode module device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163417A (ja) * 1997-09-26 1999-06-18 Matsushita Electric Ind Co Ltd 発光ダイオード
JP2002043625A (ja) * 2000-07-19 2002-02-08 Koha Co Ltd Ｌｅｄ装置
JP2002289925A (ja) * 2001-03-23 2002-10-04 Citizen Electronics Co Ltd 発光ダイオード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403422A (zh) * 2011-11-17 2012-04-04 深圳市天电光电科技有限公司 一种led封装结构的加工方法及led封装结构

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KR100655252B1 (ko) 2006-12-08
JP2004128424A (ja) 2004-04-22
EP1408559A2 (en) 2004-04-14
KR20040031661A (ko) 2004-04-13
TW200414568A (en) 2004-08-01
CN1497747A (zh) 2004-05-19
JP4280050B2 (ja) 2009-06-17
TWI236159B (en) 2005-07-11
US7180240B2 (en) 2007-02-20
EP1408559A3 (en) 2006-07-05
US20040070338A1 (en) 2004-04-15

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