KR100655252B1 - 백색 발광 장치 - Google Patents
백색 발광 장치 Download PDFInfo
- Publication number
- KR100655252B1 KR100655252B1 KR1020030069507A KR20030069507A KR100655252B1 KR 100655252 B1 KR100655252 B1 KR 100655252B1 KR 1020030069507 A KR1020030069507 A KR 1020030069507A KR 20030069507 A KR20030069507 A KR 20030069507A KR 100655252 B1 KR100655252 B1 KR 100655252B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- white light
- recess
- cover member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002294326A JP4280050B2 (ja) | 2002-10-07 | 2002-10-07 | 白色発光装置 |
| JPJP-P-2002-00294326 | 2002-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040031661A KR20040031661A (ko) | 2004-04-13 |
| KR100655252B1 true KR100655252B1 (ko) | 2006-12-08 |
Family
ID=32025495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030069507A Expired - Fee Related KR100655252B1 (ko) | 2002-10-07 | 2003-10-07 | 백색 발광 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7180240B2 (https=) |
| EP (1) | EP1408559A3 (https=) |
| JP (1) | JP4280050B2 (https=) |
| KR (1) | KR100655252B1 (https=) |
| CN (1) | CN1310345C (https=) |
| TW (1) | TWI236159B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101121745B1 (ko) | 2010-03-31 | 2012-03-22 | (주)포인트엔지니어링 | 광소자 디바이스 및 그 제조 방법 |
| KR101878270B1 (ko) * | 2011-09-15 | 2018-07-13 | 엘지이노텍 주식회사 | 광여기 판을 포함하는 조명 장치 및 광여기 테이프 |
Families Citing this family (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3910144B2 (ja) | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
| USD520965S1 (en) * | 2003-01-10 | 2006-05-16 | Citizen Electronics Co., Ltd. | Light emitting diode for illuminating an object |
| JP4788109B2 (ja) * | 2003-10-28 | 2011-10-05 | パナソニック電工株式会社 | 半導体発光装置及びその製造方法 |
| CN1860329A (zh) * | 2004-01-29 | 2006-11-08 | 松下电器产业株式会社 | Led照明光源 |
| TWI244226B (en) * | 2004-11-05 | 2005-11-21 | Chen Jen Shian | Manufacturing method of flip-chip light-emitting device |
| TWI241034B (en) | 2004-05-20 | 2005-10-01 | Lighthouse Technology Co Ltd | Light emitting diode package |
| JP4485856B2 (ja) * | 2004-06-10 | 2010-06-23 | スタンレー電気株式会社 | 大電力用ledランプ |
| USD512029S1 (en) * | 2004-06-28 | 2005-11-29 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
| WO2006005062A2 (en) * | 2004-06-30 | 2006-01-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
| US20060006791A1 (en) * | 2004-07-06 | 2006-01-12 | Chia Chee W | Light emitting diode display that does not require epoxy encapsulation of the light emitting diode |
| JP2006049442A (ja) | 2004-08-02 | 2006-02-16 | Sharp Corp | 半導体発光装置およびその製造方法 |
| US7256057B2 (en) * | 2004-09-11 | 2007-08-14 | 3M Innovative Properties Company | Methods for producing phosphor based light sources |
| USD521463S1 (en) * | 2004-10-19 | 2006-05-23 | Rohm Co., Ltd. | Light emitting diode |
| TWD110646S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| USD521950S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| USD544847S1 (en) * | 2004-10-19 | 2007-06-19 | Rohm Co., Ltd. | Light emitting diode |
| USD536308S1 (en) | 2004-10-19 | 2007-02-06 | Rohm Co., Ltd. | Light emitting diode |
| TWD110647S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| USD521946S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| USD521947S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| TWD110645S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| TWD110644S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| TWI245437B (en) * | 2004-11-16 | 2005-12-11 | Lighthouse Technology Co Ltd | Package structure of a surface mount device light emitting diode |
| KR100867515B1 (ko) * | 2004-12-06 | 2008-11-07 | 삼성전기주식회사 | 발광소자 패키지 |
| KR100580753B1 (ko) | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| JP4591071B2 (ja) * | 2004-12-20 | 2010-12-01 | 日亜化学工業株式会社 | 半導体装置 |
| US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
| USD535262S1 (en) * | 2005-06-08 | 2007-01-16 | Matsushita Electric Industrial Co., Ltd. | Light emitting diode module |
| TWD120846S1 (zh) * | 2005-06-08 | 2008-01-01 | 松下電器產業股份有限公司 | 照明用發光元件模組 |
| TWD120106S1 (zh) * | 2005-06-08 | 2007-11-21 | 松下電器產業股份有限公司 | 照明用發光元件模組 |
| TWD122880S1 (zh) * | 2005-06-08 | 2008-05-11 | 松下電器產業股份有限公司 | 照明用發光元件模組 |
| TWI422044B (zh) | 2005-06-30 | 2014-01-01 | 克立公司 | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
| US7294861B2 (en) * | 2005-06-30 | 2007-11-13 | 3M Innovative Properties Company | Phosphor tape article |
| US20070001182A1 (en) * | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
| KR101161383B1 (ko) * | 2005-07-04 | 2012-07-02 | 서울반도체 주식회사 | 발광 다이오드 및 이를 제조하기 위한 방법 |
| US20070007542A1 (en) * | 2005-07-07 | 2007-01-11 | Sumitomo Electric Industries,Ltd. | White-Light Emitting Device |
| JP2007027278A (ja) * | 2005-07-13 | 2007-02-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| JP4640248B2 (ja) * | 2005-07-25 | 2011-03-02 | 豊田合成株式会社 | 光源装置 |
| KR100807015B1 (ko) * | 2005-08-16 | 2008-02-25 | 가부시끼가이샤 도시바 | 발광 장치 |
| JP2007073575A (ja) * | 2005-09-05 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| DE102006004397A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| GB2432967A (en) * | 2005-11-30 | 2007-06-06 | Unity Opto Technology Co Ltd | White light LED with fluorescent powder containing wavelength converting plate |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| JP2007194525A (ja) * | 2006-01-23 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| JP4749870B2 (ja) * | 2006-01-24 | 2011-08-17 | 新光電気工業株式会社 | 発光装置の製造方法 |
| JP4996101B2 (ja) * | 2006-02-02 | 2012-08-08 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP5956937B2 (ja) * | 2006-02-03 | 2016-07-27 | 日立化成株式会社 | 光半導体素子搭載用パッケージ基板の製造方法 |
| JP4828248B2 (ja) * | 2006-02-16 | 2011-11-30 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
| KR100746749B1 (ko) | 2006-03-15 | 2007-08-09 | (주)케이디티 | 광 여기 시트 |
| US7683475B2 (en) * | 2006-03-31 | 2010-03-23 | Dicon Fiberoptics, Inc. | LED chip array module |
| JP2007288050A (ja) * | 2006-04-19 | 2007-11-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| JP3914954B1 (ja) | 2006-05-24 | 2007-05-16 | 株式会社エレメント電子 | 発光装置およびその製造方法 |
| JP2007335462A (ja) * | 2006-06-12 | 2007-12-27 | Stanley Electric Co Ltd | 半導体複合素子およびその製造方法 |
| US8251538B2 (en) * | 2006-06-14 | 2012-08-28 | Koninklijke Philips Electronics N.V. | Lighting device |
| TWM303493U (en) * | 2006-07-21 | 2006-12-21 | Lighthouse Technology Co Ltd | Support rack structure and metal support rack of side light source SMD LED |
| WO2008013097A1 (en) * | 2006-07-25 | 2008-01-31 | Showa Denko K.K. | Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus |
| US7663152B2 (en) * | 2006-08-09 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | Illumination device including wavelength converting element side holding heat sink |
| US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| US7800304B2 (en) * | 2007-01-12 | 2010-09-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Multi-chip packaged LED light source |
| DE102007015474A1 (de) | 2007-03-30 | 2008-10-02 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| KR100869640B1 (ko) * | 2007-04-20 | 2008-11-21 | (주)원반도체 | 발광 다이오드 |
| WO2009003176A1 (en) * | 2007-06-27 | 2008-12-31 | The Regents Of The University Of California | Optical designs for high-efficacy white-light emitting diodes |
| KR200451231Y1 (ko) | 2007-09-27 | 2010-12-03 | 지잉 퉁 텍. 메탈 코., 엘티디. | 복합식 방열 모듈 |
| CN101868865B (zh) * | 2007-11-20 | 2012-08-22 | 皇家飞利浦电子股份有限公司 | 具有波长转换的侧发射器件 |
| USD605611S1 (en) * | 2008-06-25 | 2009-12-08 | Seoul Semiconductor Co., Ltd. | Light emitting diode |
| JP5217800B2 (ja) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
| DE102008045653B4 (de) * | 2008-09-03 | 2020-03-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
| JP5327601B2 (ja) | 2008-12-12 | 2013-10-30 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
| KR101064005B1 (ko) * | 2009-03-02 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 장치 및 그 제조방법 |
| JP5482378B2 (ja) * | 2009-04-20 | 2014-05-07 | 日亜化学工業株式会社 | 発光装置 |
| JP5367668B2 (ja) * | 2009-11-17 | 2013-12-11 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| EP2546900A4 (en) * | 2010-03-12 | 2016-02-17 | Sharp Kk | DEVICE FOR PRODUCING A LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, LIGHTING DEVICE, TAIL LIGHT, LIQUID CRYSTAL PANEL, DISPLAY DEVICE, METHOD FOR PRODUCING THE DISPLAY DEVICE, METHOD FOR CONTROLLING THE DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE |
| US8941135B2 (en) | 2010-07-15 | 2015-01-27 | Nitto Denko Corporation | Light emissive ceramic laminate and method of making same |
| JP5595185B2 (ja) * | 2010-08-27 | 2014-09-24 | 三菱電機株式会社 | 発光装置および照明器具 |
| TWI446590B (zh) | 2010-09-30 | 2014-07-21 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製作方法 |
| KR101212654B1 (ko) * | 2011-05-20 | 2012-12-14 | (주)라이타이저코리아 | 발광 다이오드 패키지 및 그의 제조 방법 |
| JP2011171769A (ja) * | 2011-06-06 | 2011-09-01 | Toshiba Corp | Ledパッケージの包装材 |
| TW201306323A (zh) * | 2011-07-31 | 2013-02-01 | Walsin Lihwa Corp | 發光二極體裝置 |
| JP2013041950A (ja) | 2011-08-12 | 2013-02-28 | Sharp Corp | 発光装置 |
| JP5848562B2 (ja) * | 2011-09-21 | 2016-01-27 | シチズン電子株式会社 | 半導体発光装置及びその製造方法。 |
| CN102569600B (zh) * | 2011-11-11 | 2014-12-10 | 深圳市瑞丰光电子股份有限公司 | 发光二极管封装结构及其反射杯 |
| CN102403422A (zh) * | 2011-11-17 | 2012-04-04 | 深圳市天电光电科技有限公司 | 一种led封装结构的加工方法及led封装结构 |
| US9240524B2 (en) * | 2012-03-05 | 2016-01-19 | Seoul Viosys Co., Ltd. | Light-emitting device and method of manufacturing the same |
| JP5153950B1 (ja) * | 2012-04-18 | 2013-02-27 | E&E Japan株式会社 | 発光ダイオード |
| CN105493301A (zh) | 2013-07-08 | 2016-04-13 | 皇家飞利浦有限公司 | 波长转换的半导体发光器件 |
| WO2015036887A1 (en) * | 2013-09-13 | 2015-03-19 | Koninklijke Philips N.V. | Frame based package for flip-chip led |
| JP2015164234A (ja) * | 2015-06-17 | 2015-09-10 | シチズン電子株式会社 | Led発光装置とその製造方法 |
| JP6632834B2 (ja) | 2015-08-24 | 2020-01-22 | スタンレー電気株式会社 | 発光装置 |
| JP6928424B2 (ja) * | 2016-02-24 | 2021-09-01 | 日亜化学工業株式会社 | 蛍光体及び発光装置 |
| KR101902371B1 (ko) | 2017-03-02 | 2018-09-28 | 주식회사 이츠웰 | 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이 |
| DE102017117425A1 (de) * | 2017-08-01 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
| JP2019046989A (ja) | 2017-09-04 | 2019-03-22 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
| JP6675032B1 (ja) * | 2019-07-08 | 2020-04-01 | 御田 護 | 半導体発光装置 |
| JP7704145B2 (ja) * | 2020-08-03 | 2025-07-08 | サンケン電気株式会社 | 減光剤及び減光剤を含む発光装置 |
| JP7701614B2 (ja) * | 2021-09-30 | 2025-07-02 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59713024D1 (de) * | 1996-06-26 | 2010-01-28 | Osram Opto Semiconductors Gmbh | Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US6319425B1 (en) * | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
| JP3109472B2 (ja) | 1997-09-26 | 2000-11-13 | 松下電器産業株式会社 | 発光ダイオード |
| US6184544B1 (en) * | 1998-01-29 | 2001-02-06 | Rohm Co., Ltd. | Semiconductor light emitting device with light reflective current diffusion layer |
| KR100345283B1 (ko) | 1998-05-15 | 2002-10-25 | 테스텍 주식회사 | 접촉발광소자와그의제조방법및이를이용한접촉입력장치 |
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
| JP2002043625A (ja) | 2000-07-19 | 2002-02-08 | Koha Co Ltd | Led装置 |
| JP4066620B2 (ja) * | 2000-07-21 | 2008-03-26 | 日亜化学工業株式会社 | 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法 |
| JP2002050797A (ja) * | 2000-07-31 | 2002-02-15 | Toshiba Corp | 半導体励起蛍光体発光装置およびその製造方法 |
| EP1187226B1 (en) * | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
| JP3900848B2 (ja) | 2001-03-23 | 2007-04-04 | シチズン電子株式会社 | 発光ダイオード |
| US6833566B2 (en) * | 2001-03-28 | 2004-12-21 | Toyoda Gosei Co., Ltd. | Light emitting diode with heat sink |
| JP3891115B2 (ja) * | 2001-04-17 | 2007-03-14 | 日亜化学工業株式会社 | 発光装置 |
| JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
| JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP2003163378A (ja) * | 2001-11-26 | 2003-06-06 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| JP3768864B2 (ja) * | 2001-11-26 | 2006-04-19 | シチズン電子株式会社 | 表面実装型発光ダイオード及びその製造方法 |
| US20030141563A1 (en) * | 2002-01-28 | 2003-07-31 | Bily Wang | Light emitting diode package with fluorescent cover |
| US6917057B2 (en) * | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
| US6936857B2 (en) * | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
| US6828590B2 (en) * | 2003-05-07 | 2004-12-07 | Bear Hsiung | Light emitting diode module device |
-
2002
- 2002-10-07 JP JP2002294326A patent/JP4280050B2/ja not_active Expired - Fee Related
-
2003
- 2003-10-03 EP EP03256244A patent/EP1408559A3/en not_active Withdrawn
- 2003-10-06 TW TW092127665A patent/TWI236159B/zh not_active IP Right Cessation
- 2003-10-07 US US10/679,490 patent/US7180240B2/en not_active Expired - Lifetime
- 2003-10-07 KR KR1020030069507A patent/KR100655252B1/ko not_active Expired - Fee Related
- 2003-10-08 CN CNB2003101015379A patent/CN1310345C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101121745B1 (ko) | 2010-03-31 | 2012-03-22 | (주)포인트엔지니어링 | 광소자 디바이스 및 그 제조 방법 |
| KR101878270B1 (ko) * | 2011-09-15 | 2018-07-13 | 엘지이노텍 주식회사 | 광여기 판을 포함하는 조명 장치 및 광여기 테이프 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1310345C (zh) | 2007-04-11 |
| JP2004128424A (ja) | 2004-04-22 |
| EP1408559A2 (en) | 2004-04-14 |
| KR20040031661A (ko) | 2004-04-13 |
| TW200414568A (en) | 2004-08-01 |
| CN1497747A (zh) | 2004-05-19 |
| JP4280050B2 (ja) | 2009-06-17 |
| TWI236159B (en) | 2005-07-11 |
| US7180240B2 (en) | 2007-02-20 |
| EP1408559A3 (en) | 2006-07-05 |
| US20040070338A1 (en) | 2004-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100655252B1 (ko) | 백색 발광 장치 | |
| KR100576571B1 (ko) | 발광 장치의 제조 방법 | |
| US7781783B2 (en) | White light LED device | |
| JP5813086B2 (ja) | Ledパッケージ及びその製造方法 | |
| US9786827B2 (en) | Light emitting diode package | |
| US7748873B2 (en) | Side illumination lens and luminescent device using the same | |
| US6914267B2 (en) | Light emitting diode | |
| TWI334231B (en) | Semiconductor light emitting device, light emitting module, and lighting apparatus | |
| US10236420B2 (en) | Color tunable LED assembly | |
| JP2004128424A5 (https=) | ||
| US7300326B2 (en) | LED device and method for manufacturing the same | |
| JP7179923B2 (ja) | 発光装置および調色装置 | |
| JP2002252376A (ja) | 表面実装型発光ダイオード及びその製造方法 | |
| JP2005012155A (ja) | 発光装置 | |
| JP2007067204A (ja) | 発光ダイオード装置 | |
| KR101271373B1 (ko) | 반도체 복합 소자 및 그 제조 방법 | |
| JP2007005722A (ja) | 光半導体素子用外囲器およびそれを用いた光半導体装置 | |
| JP2007043074A (ja) | 照明装置 | |
| JP2007288125A (ja) | 発光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
|
| B701 | Decision to grant | ||
| PB0701 | Decision of registration after re-examination before a trial |
St.27 status event code: A-3-4-F10-F13-rex-PB0701 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20121121 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20131118 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20141120 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20151118 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20161123 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20171202 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20171202 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |