CN1290389C - 有内构电子元件的电路板及其制造方法 - Google Patents

有内构电子元件的电路板及其制造方法 Download PDF

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Publication number
CN1290389C
CN1290389C CNB021518017A CN02151801A CN1290389C CN 1290389 C CN1290389 C CN 1290389C CN B021518017 A CNB021518017 A CN B021518017A CN 02151801 A CN02151801 A CN 02151801A CN 1290389 C CN1290389 C CN 1290389C
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Prior art keywords
electronic component
insulating barrier
wiring
circuit board
support plate
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Expired - Fee Related
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CNB021518017A
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Chinese (zh)
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CN1438833A (zh
Inventor
上野幸宏
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Sharp Corp
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Sharp Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CNB021518017A 2001-11-05 2002-11-05 有内构电子元件的电路板及其制造方法 Expired - Fee Related CN1290389C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP339837/01 2001-11-05
JP339837/2001 2001-11-05
JP2001339837A JP3910045B2 (ja) 2001-11-05 2001-11-05 電子部品内装配線板の製造方法

Publications (2)

Publication Number Publication Date
CN1438833A CN1438833A (zh) 2003-08-27
CN1290389C true CN1290389C (zh) 2006-12-13

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CNB021518017A Expired - Fee Related CN1290389C (zh) 2001-11-05 2002-11-05 有内构电子元件的电路板及其制造方法

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US (1) US6948944B2 (ja)
JP (1) JP3910045B2 (ja)
CN (1) CN1290389C (ja)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200464A (ja) * 2002-12-19 2004-07-15 Anden 金属配線板
US7208825B2 (en) * 2003-01-22 2007-04-24 Siliconware Precision Industries Co., Ltd. Stacked semiconductor packages
DE10343053A1 (de) * 2003-09-16 2005-04-07 Siemens Ag Elektronisches Bauelement und Anordnung mit einem elektronischen Bauelement
JP3979404B2 (ja) * 2004-06-30 2007-09-19 カシオ計算機株式会社 半導体装置
WO2005062318A1 (ja) * 2003-12-18 2005-07-07 Matsushita Electric Industrial Co., Ltd. 電子部品
JP4841806B2 (ja) * 2004-02-02 2011-12-21 新光電気工業株式会社 キャパシタ装置とそれを備えた半導体装置、及びキャパシタ装置の製造方法
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