CN1275764C - 多层金属层压复合板及其制造方法 - Google Patents
多层金属层压复合板及其制造方法 Download PDFInfo
- Publication number
- CN1275764C CN1275764C CNB018176410A CN01817641A CN1275764C CN 1275764 C CN1275764 C CN 1275764C CN B018176410 A CNB018176410 A CN B018176410A CN 01817641 A CN01817641 A CN 01817641A CN 1275764 C CN1275764 C CN 1275764C
- Authority
- CN
- China
- Prior art keywords
- metal
- mentioned
- activate
- metallic plate
- uncoiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 143
- 239000002184 metal Substances 0.000 title claims abstract description 143
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 15
- 238000003475 lamination Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 59
- 239000000463 material Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010849 ion bombardment Methods 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 238000003855 Adhesive Lamination Methods 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
- Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
- Y10T428/12979—Containing more than 10% nonferrous elements [e.g., high alloy, stainless]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
一种多层金属层压复合板及其连续化制造方法,不用粘合剂将表面形成金属薄膜的金属板与金属箔接合,形成具有所定厚度而又无粘合剂的多层金属层压复合板。层压复合板的制造方法包括在金属板开卷筒上设置金属板的工序;在金属箔开卷筒上设置金属箔的工序;从金属板开卷筒开卷上述金属板,使金属板表面活性化,在金属板表面形成第1金属薄膜的工序;从金属箔开卷筒开卷上述金属箔,使金属箔表面活性化,在金属板表面形成第2金属薄膜的工序;上述经过活性化的第1金属薄膜面与第2金属薄膜面压力接合,以使在金属板表面形成第1金属薄膜面与在金属箔表面形成的第2金属薄膜面接合在一起的工序。
Description
技术领域
本发明涉及一种不用粘合剂层压复合金属板和金属箔而形成的多层金属层压复合板及其制造方法。
背景技术
以前,提出了多种层压复合金属板而形成的金属板层压复合体。以往,金属板层压复合体的用途主要是用作结构材。
近年来,金属板层压复合体的用途也开始向多方面扩展,要求提供用于通过刻蚀形成微细形状的特种材料。
在刻蚀所用的材料中,为通过刻蚀形成微细形状,需要像刻蚀层/刻蚀中止层/刻蚀层那样的刻蚀层与刻蚀中止层相互层压复合。
以往,采用湿法电镀技术及热轧、冷轧后进行热扩散处理的包层技术等形成上述那样的刻蚀中止层。
但是,上述技术的工序烦杂,此外,还存在不适合生产微细、有精度要求的金属板层压复合体的问题。
本发明的第一课题是,采用预先真空蒸镀、溅射等薄膜生成方法,不用粘合剂将表面生成金属薄膜的金属板与具有规定厚度的金属箔压力接合,由此提供一种具有规定厚度而又无粘合剂的多层金属层压复合板。
此外,本发明的第二课题是,提供一种连续在金属板上生成金属薄膜并压力接合金属箔的多层金属层压复合板的制造方法。
发明内容
本发明的多层金属层压复合板,其特征在于,通过0.1~0.5%的压下率的冷压接合进行层压复合,以使在金属板表面上形成的第1金属薄膜面与在金属箔表面形成的第2金属薄膜面接合。
在上述多层金属层压复合板中,金属板最好用铜板,第1金属薄膜最好采用镍,金属箔最好是铜箔,第2金属薄膜也最好是镍。
在上述多层金属层压复合板中,在金属板表面上形成的第1金属薄膜面与金属箔表面压力接合,层压复合形成多层金属层压复合板。
在上述多层金属层压复合板中,金属板最好用铜板,第1金属薄膜最好采用铝,金属箔最好是铜箔。
在上述多层金属层压复合板中,金属板最好用不锈钢板,第1金属薄膜最好采用银,金属箔最好是不锈钢。
本发明的多层金属层压复合板的制造方法,其特征在于:具有以下工序:在金属板开卷筒上设置金属板的工序;在金属箔开卷筒上设置金属箔的工序;从金属板开卷筒开卷上述金属板,由活性化处理装置使金属板表面活性化,并由溅射装置在金属板表面形成第1金属薄膜的工序;从金属箔开卷筒开卷上述金属箔,由活性化处理装置使金属箔表面活性化,并由溅射装置在金属板表面形成第2金属薄膜的工序;使上述经过活性化的第1金属薄膜面与第2金属薄膜面以0.1~0.5%的压下率冷压接合的工序。
本发明的多层金属层压复合板的制造方法,其特征在于:具有以下工序:在金属板开卷筒上设置金属板的工序;在金属箔开卷筒上设置金属箔的工序;从金属板开卷筒开卷上述金属板,由活性化处理装置使金属板表面活性化,并由溅射装置在金属板表面形成第1金属薄膜的工序;从金属箔开卷筒开卷上述金属箔,由活性化处理装置使金属箔表面活性化的工序;使上述经过活性化的第1金属薄膜面与金属箔表面以0.1~0.5%的压下率冷压接合的工序。
附图说明
图1是多层金属层压复合板的截面图。
图2是金属薄膜层压复合板的截面图。
图3是表示制造工序的示意图。
图4是表示制造方法的示意图。
图5是表示制造方法的示意图。
具体实施方式
图1是表示本发明的多层金属层压复合板的截面结构的示意图。
在图1中,金属板22借助第1金属薄膜24层压复合在金属箔26上。作为金属板22的材质,只要是能在金属板上形成薄膜的材料,不特别限定其种类。可根据本发明的多层金属层压复合板的用途适当选择采用。
例如,本发明的多层金属层压复合板如果是用于安装用印刷电路板,作为金属板的原材料,最好采用铜板、钛板、不锈钢板、铝板等。
金属板22的厚度因用途而异,但是,如果是用作安装用印刷电路板,最好采用10~200μm的厚度。但最佳的厚度使用范围在25~150μm。
关于第1金属薄膜23或第2金属薄膜24的材质,只要是与衬底金属板密合性良好的材质,不特别限定其种类。
例如,在金属板22是铜板或不锈钢板的情况下,作为第1金属薄膜23或第2金属薄膜24,最好采用Fe、Ni、Cr、Pd、Zr、Co、Au、Ag、Sn、Cu、Al等。此外,也可以是多层层压复合上述金属的金属薄膜。另外,也可以采用上述金属的合金作为薄膜。
膜的厚度因用途而异,但是,如果是用作安装用印刷电路板,最好采用0.01~1μm的厚度,但最佳的厚度使用范围在0.1~0.5μm。
关于金属箔26的材质,例如,可使用铜箔、镍箔、铝箔、铁箔等单层箔,以及上述金属箔的层压复合箔(层压复合材)、合金箔、轧制薄板等。此外,也可以使用在上述各种箔表面实施镀层的镀层箔等。箔的厚度因用途而异,但是,如果是用作安装用印刷电路板,最好采用3~100μm的厚度,但最佳的厚度使用范围在10~35μm。
此外,在将本发明的多层金属层压复合板用作散热板时,为提高传热性,最好采用厚度在50~1000μm范围内的稍厚的多层金属层压复合板。
下面,说明本发明的多层金属层压复合板的制造方法。
首先说明第一制造方法,如图3所示,该方法是在开卷筒62中设置金属板22,利用多层金属层压复合板制造装置50中设置的活性化处理装置70活性化处理金属板22的表面。
此处所述的所谓活性化,是指为提高后续工序中与金属箔的密合性,去除在金属板上的金属膜表面上附着的金属氧化物、灰尘附着物及油等异物所进行的表面处理。同样,也用活性化装置80活性化处理金属箔26的表面。
活性化处理装置70、80最好采用能进行表面清洁的结构,但在本发明的实施例中,采用溅射刻蚀处理要压力接合材料各接合面的处理装置。
也就是说,如图3所示,采用溅射刻蚀处理的活性化处理方法,如本申请人先前在特开平1-224184号公报中公开的一样,是在(1)1×101~1×10-3Pa的极低压惰性气体保护中;(2)金属板22和金属箔26分别作为接地一方的电极A(72),在与绝缘支持的另一电极B(74)之间附加1~50MHz的交流电,产生辉光放电;(3)而且,在上述辉光放电产生的等离子体中露出的电极辊72、82的面积a分别不足电极74、84的面积b的1/3;(4)利用溅射刻蚀处理等条件下进行活性化处理。这样可有利于使表面高速活性化。通过设置上述那样的结构,优先在被刻蚀材电极A侧产生离子轰击,在电极B侧几乎不产生离子轰击。
此外,表面活性化处理也可以采用能使表面高速活性化的离子枪。
下面,说明在上述金属板22的表面上形成第1金属薄膜24,在金属箔26的表面上形成第2金属薄膜23的方法。
为此,将在金属板22上形成第1金属薄膜24的薄膜形成装置90设置在真空容器52中、活性化处理装置70后的工序中。
即,如图3所示,在上述接地一方的电极A(电极辊72)与绝缘支持的另一电极B(76)之间附加1~50MHz的交流电,产生辉光放电。
此种情况下,由于在辉光放电产生的等离子体中露出的电极辊72的面积a是电极76的面积b的3倍以上,所以可在不刻蚀处理金属板22表面的情况下,在表面形成第1金属薄膜24。
即,在进行薄膜形成的溅射装置中,电极a和电极b的对抗面积比与活性化处理时正相反。这样可离子轰击靶材一侧,在金属板上形成薄膜。
以本发明采用的薄膜形成装置90为例,根据图4说明溅射装置。
溅射装置90是由电悬浮的靶电极94和接地的水冷电极辊72组合构成的。在靶电极94中,设置了形成第1金属薄膜24的靶材92,此外还设置了磁铁98,利用磁场可以提高溅射效率。另外,为了防止靶材92的异常加热,可以水冷却靶电极94。
进行溅射处理时,在真空度保持在1×10-3Pa以下后,除向真空容器52内通入氩气、氖气、氙气、氪气等惰性气体外,也可通入氧等气体,达到1×101~1×10-3Pa左右的气体保护气氛。
然后,通过给靶电极94施加高频电源96,在靶电极94和电极辊72之间产生等离子体,离子轰击靶材92。
由此放出的靶原子沉积在金属板22上,形成第1金属薄膜24。
同样,关于要层压复合的金属箔26,采用活性化处理装置80,进行活性化处理,用与上述薄膜形成装置90同样的薄膜形成装置95,在金属箔26的表面上形成第2金属薄膜23。
此外,如图5所示,也可以通过设置多个电极76和并列多个薄膜形成装置91,使第2金属薄膜23多层化。这样的金属薄膜可以是相同种类的,也可以是不同种类的。另外,即使这样设置多个电极76,通过切断其电极电源,也完全不能形成金属膜。另外,通过切断几个电源,可以形成任意层数的薄膜。
作为第1金属薄膜及第2金属薄膜的形成方法,可以采用溅射法、离子镀法、真空蒸镀法等众所周知的方法(参照特开平8-231717号公报)。
此外,如使金属板22和金属箔26的表面粗糙化,有利于提高与金属薄膜的密合强度。
下面,相互重合经过上述活性化处理的表面,然后用压力接合装置60进行压力接合,在同一真空容器内一道工序制造多层金属层压复合板20。
为不损伤金属箔和金属薄膜,压力接合最好是低压下量接合。例如,如果将压下率数值化,最好将压下率定在0.1%~10%左右。
实施例
以下,根据附图说明实施例。
实施例1
采用100μm厚的铜板作为金属板。此外,采用18μm厚的铜箔作为金属箔。
①活性化处理
从金属板开卷筒62开卷的铜板22及从金属箔开卷筒64开卷的铜箔26分别卷绕在真空容器52内的水冷电极辊72、82上,在活性化处理装置70内,用溅射刻蚀法进行活性化处理。
②金属薄膜的形成
铜板22经活性化处理后,卷绕在水冷电极辊72上,然后原样送入溅射装置90,形成厚0.2μm的镍薄膜作为金属薄膜24。
此外,铜箔26经活性化处理后,卷绕在水冷电极辊82上,然后原样送入溅射装置95,形成厚0.2μm的镍薄膜作为金属薄膜23。
③压力接合
表面形成镍金属薄膜24的铜板22和表面形成镍金属薄膜23的铜箔26的接合面相互重合,按大约0.5%的低压下率冷压接合,制成由铜板、镍板、镍薄膜、铜箔4层组成的多层金属层压复合板。
实施例2
采用100μm厚的铜板作为金属板。此外,采用35μm厚的铜箔作为金属箔。
①活性化处理
从金属板开卷筒62开卷的铜板22及从金属箔开卷筒64开卷的铜箔26分别卷绕在真空容器52内的水冷电极辊72、82上,在活性化处理装置70内,用溅射刻蚀法进行活性化处理。
②金属薄膜的形成
铜板22经活性化处理后,卷绕在水冷电极辊72上,然后原样送入溅射装置90,形成厚0.5μm的铝薄膜作为金属薄膜24。
此外,铜箔26经活性化处理后,卷绕在水冷电极辊82上,然后原样通过溅射装置95,但切断电源,不形成金属薄膜。
③压力接合
表面形成铝薄膜(金属薄膜24)的铜板22和表面进行活性化处理的铜箔26的接合面相互重合,按大约0.5%的低压下率冷压接合,制成由铜板、铝薄膜、铜箔3层组成的多层金属层压复合板。
本发明的多层金属层压复合板由于不使用粘合剂,在真空容器中进行压力接合,可按均匀的厚度制造金属箔和金属板。
此外,由于在一个工序中内进行表面活性化处理、金属薄膜形成和压力接合,可易于制造多层金属层压复合板。此外,由于对同一电极辊进行表面活性化处理和金属薄膜形成,可使装置紧凑。
Claims (7)
1.一种多层金属层压复合板,其特征在于,通过0.1~0.5%的压下率的冷压接合进行层压复合,以使在金属板表面上形成的第1金属薄膜面与在金属箔表面形成的第2金属薄膜面接合。
2.如权利要求1所述的多层金属层压复合板,其特征在于,上述金属板为铜板,上述第1金属薄膜为镍,上述金属箔为铜箔,上述第2金属薄膜为镍。
3.一种多层金属层压复合板,其特征在于,通过0.1~0.5%的压下率的冷压接合进行层压复合,以使在金属板表面上形成的第1金属薄膜面与金属箔表面接合。
4.如权利要求3所述的多层金属层压复合板,其特征在于,上述金属板为铜板,上述第1金属薄膜为铝,上述金属箔为铜箔。
5.如权利要求3所述的多层金属层压复合板,其特征在于,上述金属板为不锈钢板,上述第1金属薄膜为银,上述金属箔为不锈钢。
6.一种多层金属层压复合板的制造方法,其特征在于:具有以下工序:
在金属板开卷筒上设置金属板的工序;
在金属箔开卷筒上设置金属箔的工序;
从金属板开卷筒开卷上述金属板,由活性化处理装置使金属板表面活性化,并由溅射装置在金属板表面形成第1金属薄膜的工序;
从金属箔开卷筒开卷上述金属箔,由活性化处理装置使金属箔表面活性化,并由溅射装置在金属板表面形成第2金属薄膜的工序;
使上述经过活性化的第1金属薄膜面与第2金属薄膜面以0.1~0.5%的压下率冷压接合的工序。
7.一种多层金属层压复合板的制造方法,其特征在于:具有以下工序:
在金属板开卷筒上设置金属板的工序;
在金属箔开卷筒上设置金属箔的工序;
从金属板开卷筒开卷上述金属板,由活性化处理装置使金属板表面活性化,并由溅射装置在金属板表面形成第1金属薄膜的工序;
从金属箔开卷筒开卷上述金属箔,由活性化处理装置使金属箔表面活性化的工序;
使上述经过活性化的第1金属薄膜面与金属箔表面以0.1~0.5%的压下率冷压接合的工序。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP318626/2000 | 2000-10-18 | ||
JP2000318626A JP4447762B2 (ja) | 2000-10-18 | 2000-10-18 | 多層金属積層板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1469805A CN1469805A (zh) | 2004-01-21 |
CN1275764C true CN1275764C (zh) | 2006-09-20 |
Family
ID=18797218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018176410A Expired - Lifetime CN1275764C (zh) | 2000-10-18 | 2001-10-04 | 多层金属层压复合板及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7175919B2 (zh) |
EP (1) | EP1342564A4 (zh) |
JP (1) | JP4447762B2 (zh) |
KR (1) | KR100537322B1 (zh) |
CN (1) | CN1275764C (zh) |
AU (1) | AU2001292353A1 (zh) |
WO (1) | WO2002032660A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102774071A (zh) * | 2012-08-10 | 2012-11-14 | 昆山乔锐金属制品有限公司 | 一种不锈钢为基材的复合涂层 |
CN104520232A (zh) * | 2012-07-11 | 2015-04-15 | 卡尔拜斯纳米技术股份有限公司 | 形成于多层衬底上的碳纳米管的垂直排列型阵列 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004073971A1 (en) * | 2003-02-20 | 2004-09-02 | N.V. Bekaert S.A. | A method of manufacturing a laminated structure |
CN100440585C (zh) * | 2005-01-14 | 2008-12-03 | 谢振华 | 电池内部的极耳或电池之间导电金属片的加工方法 |
JP4579705B2 (ja) * | 2005-02-02 | 2010-11-10 | 日本製箔株式会社 | クラッド材とその製造方法 |
JP4640802B2 (ja) | 2005-07-07 | 2011-03-02 | 日東電工株式会社 | 回路付サスペンション基板 |
KR100773391B1 (ko) | 2005-09-01 | 2007-11-05 | 한국전기연구원 | 박판 접합 장치 및 이를 이용한 박판 접합 방법 |
US20070243451A1 (en) * | 2006-04-14 | 2007-10-18 | Chao-Yi Yuh | Anode support member and bipolar separator for use in a fuel cell assembly and for preventing poisoning of reforming catalyst |
JP4865453B2 (ja) * | 2006-08-30 | 2012-02-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP2008282995A (ja) | 2007-05-10 | 2008-11-20 | Nitto Denko Corp | 配線回路基板 |
KR101306181B1 (ko) * | 2008-11-12 | 2013-09-09 | 도요 고한 가부시키가이샤 | 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판의 제조 방법 및 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판 |
JP5411573B2 (ja) * | 2009-05-20 | 2014-02-12 | 中部電力株式会社 | 表面活性化接合による金属クラッド帯の製造方法及びその装置 |
DE102010037005B3 (de) * | 2010-08-16 | 2011-11-03 | Alinox Ag | Metallplatte mit eingebettetem Heizelement und Verfahren zu ihrer Herstellung |
DE102010054016A1 (de) * | 2010-12-10 | 2012-06-14 | Ziemek Cable Technology Gmbh | Verfahren zum Verbinden eines Aluminiumbandes mit einem Kupferband |
KR20140103257A (ko) | 2011-10-24 | 2014-08-26 | 릴라이언스 인더스트리즈 리미티드 | 박막 및 박막 제조 방법 |
CN102489816A (zh) * | 2011-12-23 | 2012-06-13 | 山东大学 | 超级镍叠层复合材料与Cr18-Ni8不锈钢的非晶钎焊工艺 |
EP2608255A1 (en) * | 2011-12-23 | 2013-06-26 | Micronit Microfluidics B.V. | Method of bonding two substrates and device manufactured thereby |
JP6100605B2 (ja) * | 2013-05-17 | 2017-03-22 | 昭和電工株式会社 | 多層クラッド材の製造方法 |
KR101707042B1 (ko) * | 2013-06-19 | 2017-02-17 | 일진머티리얼즈 주식회사 | 도전성 방열(放熱)시트, 이를 포함하는 전기부품 및 전자제품 |
WO2015191897A1 (en) | 2014-06-11 | 2015-12-17 | Georgia Tech Research Corporation | Polymer-based nanostructured materials with tunable properties and methods of making thereof |
JP6570146B2 (ja) | 2014-10-09 | 2019-09-04 | マテリオン コーポレイション | 冶金学的ボンドおよび密度低減金属コア層を有する金属積層体ならびにその製造方法 |
CN106042583A (zh) * | 2015-08-13 | 2016-10-26 | 徐仕坚 | 一种复合材料生产线及工艺 |
CN105172308B (zh) * | 2015-09-28 | 2017-09-22 | 昆明理工大学 | 一种钛‑铝‑不锈钢复合板的制备方法 |
US10791651B2 (en) | 2016-05-31 | 2020-09-29 | Carbice Corporation | Carbon nanotube-based thermal interface materials and methods of making and using thereof |
CN106064516B (zh) * | 2016-06-01 | 2018-05-15 | 广东谷菱电气有限公司 | 一种将铜箔加工成铜板的压融工艺 |
CN106364956B (zh) * | 2016-10-25 | 2019-11-19 | 珠海亚泰电子科技有限公司 | 卷覆装置 |
CN110234443B (zh) * | 2017-02-07 | 2024-01-26 | 东洋钢钣株式会社 | 轧制接合体及其制造方法 |
TWI755492B (zh) | 2017-03-06 | 2022-02-21 | 美商卡爾拜斯有限公司 | 基於碳納米管的熱界面材料及其製造和使用方法 |
CN108287093B (zh) * | 2018-01-19 | 2021-01-01 | 李佳若 | 一种铜镍复合工艺 |
WO2019176937A1 (ja) * | 2018-03-14 | 2019-09-19 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
JP7085419B2 (ja) * | 2018-03-14 | 2022-06-16 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
US10707596B2 (en) | 2018-09-21 | 2020-07-07 | Carbice Corporation | Coated electrical connectors and methods of making and using thereof |
CN110113880A (zh) * | 2018-12-29 | 2019-08-09 | 广东生益科技股份有限公司 | 金属基覆铜箔层压板及其制备方法 |
USD906269S1 (en) | 2019-08-28 | 2020-12-29 | Carbice Corporation | Flexible heat sink |
US20210063099A1 (en) | 2019-08-28 | 2021-03-04 | Carbice Corporation | Flexible and conformable polymer-based heat sinks and methods of making and using thereof |
USD903610S1 (en) | 2019-08-28 | 2020-12-01 | Carbice Corporation | Flexible heat sink |
USD904322S1 (en) | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
BR202020011262U2 (pt) * | 2020-06-04 | 2021-12-14 | Diego Wesley Mazali | Disposição construtiva aplicada em pelicula adesiva de cobre |
CN114980582B (zh) * | 2022-07-13 | 2023-10-27 | 常州澳弘电子股份有限公司 | 一种多层薄介质厚铜板的压合方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE401931C (de) * | 1923-05-13 | 1924-09-11 | Hugo Lohmann | Plattieren von Blechen |
US2484118A (en) * | 1944-09-22 | 1949-10-11 | Reynolds Metals Co | Method of bonding aluminum to steel |
US3251128A (en) * | 1963-06-18 | 1966-05-17 | Allis Chalmers Mfg Co | Method of applying a low resistance contact to a bus |
GB1046798A (en) * | 1963-08-23 | 1966-10-26 | S W Farber Inc | A method of bonding together pieces of preformed metal |
US3970237A (en) * | 1972-11-07 | 1976-07-20 | Borg-Warner Corporation | Method of brazing aluminum parts |
JPS6024750B2 (ja) * | 1977-09-05 | 1985-06-14 | 三菱重工業株式会社 | 銅とステンレス鋼の拡散溶接法 |
JPH07115213B2 (ja) | 1984-06-22 | 1995-12-13 | 株式会社化繊ノズル製作所 | 金属複合材の製造方法 |
US4705207A (en) * | 1986-10-16 | 1987-11-10 | Rohr Industries, Inc. | Method of brazing columbium to itself using low bonding pressures and temperatures |
JPH01127184A (ja) | 1987-11-10 | 1989-05-19 | Kawasaki Steel Corp | 溶射複合型制振鋼板の製造方法 |
US4896813A (en) * | 1989-04-03 | 1990-01-30 | Toyo Kohan Co., Ltd. | Method and apparatus for cold rolling clad sheet |
DE3927762A1 (de) * | 1989-08-23 | 1991-02-28 | Risse Gmbh Geb | Verfahren zur herstellung von aluminium-edelstahl-plattierten baendern |
JP2543429B2 (ja) | 1990-06-04 | 1996-10-16 | 東洋鋼鈑株式会社 | アルミニウム箔積層鋼板の製造法 |
JPH0491872A (ja) | 1990-08-07 | 1992-03-25 | Nisshin Steel Co Ltd | 加工性に優れたアルミニウムクラッド鋼板の製造方法 |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
JPH10296080A (ja) * | 1997-04-30 | 1998-11-10 | Hino Motors Ltd | 排ガス浄化触媒及びその組合せ触媒系 |
TW585813B (en) * | 1998-07-23 | 2004-05-01 | Toyo Kohan Co Ltd | Clad board for printed-circuit board, multi-layered printed-circuit board, and the fabrication method |
IT1305116B1 (it) * | 1998-09-14 | 2001-04-10 | Zincocelere Spa | Componente per circuito stampato multistrato, metodo per la suafabbricazione e relativo circuito stampato multiuso. |
TW446627B (en) * | 1998-09-30 | 2001-07-21 | Toyo Kohan Co Ltd | A clad sheet for lead frame, a lead frame using thereof and a manufacturing method thereof |
KR20000071383A (ko) * | 1999-02-26 | 2000-11-25 | 마쯔노고오지 | 배선층 전사용 복합재와 그 제조방법 및 장치 |
AU5246600A (en) * | 1999-06-10 | 2001-01-02 | Toyo Kohan Co. Ltd. | Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
EP1086776B1 (en) * | 1999-09-22 | 2006-05-17 | Hitachi Metals, Ltd. | Laminated ribbon and method and apparatus for producing same |
US6454878B1 (en) * | 2000-11-01 | 2002-09-24 | Visteon Global Technologies, Inc. | Cladded material construction for etched-tri-metal circuits |
-
2000
- 2000-10-18 JP JP2000318626A patent/JP4447762B2/ja not_active Expired - Lifetime
-
2001
- 2001-10-04 CN CNB018176410A patent/CN1275764C/zh not_active Expired - Lifetime
- 2001-10-04 EP EP01972690A patent/EP1342564A4/en not_active Withdrawn
- 2001-10-04 AU AU2001292353A patent/AU2001292353A1/en not_active Abandoned
- 2001-10-04 WO PCT/JP2001/008756 patent/WO2002032660A1/ja not_active Application Discontinuation
- 2001-10-04 KR KR10-2003-7005397A patent/KR100537322B1/ko active IP Right Grant
- 2001-10-04 US US10/399,530 patent/US7175919B2/en not_active Expired - Fee Related
-
2006
- 2006-03-24 US US11/387,949 patent/US20060163329A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104520232A (zh) * | 2012-07-11 | 2015-04-15 | 卡尔拜斯纳米技术股份有限公司 | 形成于多层衬底上的碳纳米管的垂直排列型阵列 |
CN102774071A (zh) * | 2012-08-10 | 2012-11-14 | 昆山乔锐金属制品有限公司 | 一种不锈钢为基材的复合涂层 |
Also Published As
Publication number | Publication date |
---|---|
JP4447762B2 (ja) | 2010-04-07 |
AU2001292353A1 (en) | 2002-04-29 |
WO2002032660A1 (fr) | 2002-04-25 |
US20060163329A1 (en) | 2006-07-27 |
JP2002127298A (ja) | 2002-05-08 |
KR100537322B1 (ko) | 2005-12-16 |
US20040065717A1 (en) | 2004-04-08 |
CN1469805A (zh) | 2004-01-21 |
US7175919B2 (en) | 2007-02-13 |
EP1342564A1 (en) | 2003-09-10 |
EP1342564A4 (en) | 2010-03-03 |
KR20030044011A (ko) | 2003-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1275764C (zh) | 多层金属层压复合板及其制造方法 | |
CN1239318C (zh) | 多层金属复合薄膜及其制造方法 | |
JP4726855B2 (ja) | キャリアシート付銅箔、キャリアシート付銅箔の製造方法、キャリアシート付表面処理銅箔及びそのキャリアシート付表面処理銅箔を用いた銅張積層板 | |
JP3641632B1 (ja) | 導電性シート、それを用いた製品およびその製造方法 | |
CN101299910A (zh) | 用于在塑料基材上进行沉积的装置和方法 | |
CN1311977A (zh) | 用于印刷电路板的包层板、使用该包层板的多层印刷电路板及其制造方法 | |
JP6836689B2 (ja) | ガラスキャリア付銅箔及びその製造方法 | |
TW201936386A (zh) | 附玻璃載體銅箔及其製造方法 | |
EP2879467A1 (en) | Electrode foil and organic light-emitting device | |
CN110392746B (zh) | 金属化膜及其制造方法 | |
CN112969581A (zh) | 层叠体 | |
JP7355648B2 (ja) | 積層体および積層体の製造方法 | |
JP2005317888A (ja) | 電磁波遮蔽用フィルターの製造方法 | |
JP2003094589A (ja) | 積層材の製造方法及び積層材の製造装置 | |
JP7427846B1 (ja) | キャリア付金属箔 | |
JP2014053368A (ja) | 耐加水分解性導電フィルムおよびそれを用いたバックシート | |
JP2010238926A (ja) | プリント配線板用銅箔及びその製造方法 | |
JP4190955B2 (ja) | 選択エッチング加工用導電板積層材の製造方法 | |
KR20230124543A (ko) | 금속 부재 | |
JP2001323363A (ja) | 板材および印刷配線板用金属箔およびそれらの製造方法 | |
KR20210093847A (ko) | 적층체 | |
JP2002178165A (ja) | プリント配線基板用積層金属箔の製造方法及びプリント配線基板用積層金属箔 | |
JPH05136548A (ja) | フレキシブル印刷配線用基板の製造方法 | |
JP2003080622A (ja) | 導電板積層体および導電板積層体を用いた部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20060920 |