WO2002032660A1 - Lamine metallique multicouche et procede d'elaboration - Google Patents

Lamine metallique multicouche et procede d'elaboration Download PDF

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Publication number
WO2002032660A1
WO2002032660A1 PCT/JP2001/008756 JP0108756W WO0232660A1 WO 2002032660 A1 WO2002032660 A1 WO 2002032660A1 JP 0108756 W JP0108756 W JP 0108756W WO 0232660 A1 WO0232660 A1 WO 0232660A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
thin film
foil
plate
metal foil
Prior art date
Application number
PCT/JP2001/008756
Other languages
English (en)
Japanese (ja)
Inventor
Kinji Saijo
Kazuo Yoshida
Hiroaki Okamoto
Shinji Ohsawa
Original Assignee
Toyo Kohan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co., Ltd. filed Critical Toyo Kohan Co., Ltd.
Priority to KR10-2003-7005397A priority Critical patent/KR100537322B1/ko
Priority to US10/399,530 priority patent/US7175919B2/en
Priority to AU2001292353A priority patent/AU2001292353A1/en
Priority to EP01972690A priority patent/EP1342564A4/fr
Publication of WO2002032660A1 publication Critical patent/WO2002032660A1/fr
Priority to US11/387,949 priority patent/US20060163329A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
    • Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
    • Y10T428/12979—Containing more than 10% nonferrous elements [e.g., high alloy, stainless]

Definitions

  • the present invention relates to a multilayer metal laminate in which a metal plate and a metal foil are laminated by a method without using an adhesive, and a method for producing the same.
  • such an etching stop layer has been formed by a wet plating technique, a cladding technique of performing a thermal diffusion treatment after hot rolling and cold rolling, or the like.
  • a first object of the present invention is to provide a method for forming a thin metal film on a surface of a metal plate and a metal foil having a predetermined thickness by using a thin film forming method such as vacuum evaporation and sputtering in advance without using an adhesive.
  • An adhesive-less multilayer metal laminate having a predetermined thickness is provided.
  • a second object of the present invention is to provide a method for continuously manufacturing a multi-layer metal laminate in which a thin film and a metal foil are bonded to a metal plate.
  • the multilayer metal laminate of the present invention is characterized in that the first metal thin film surface formed on the metal plate surface is laminated so as to be in contact with the second metal thin film surface formed on the metal foil surface.
  • the metal plate be a copper plate
  • the first metal thin film be nickel
  • the metal foil be copper foil
  • the second metal thin film be nickel
  • the first metal thin film formed on the surface of the metal plate be laminated so as to be in contact with the surface of the metal foil.
  • the metal plate is a copper plate
  • the first metal thin film is aluminum
  • the metal foil is a copper foil
  • the metal plate is a stainless steel plate
  • the first metal thin film is silver
  • the metal foil is stainless steel
  • the method for producing a multilayer metal laminate according to the present invention includes the steps of: placing a metal plate on a metal plate rewind reel; placing metal foil on a metal foil rewind reel; Activating the surface of the unwound metal plate to form a first metal thin film on the surface of the metal plate; and activating the surface of the unwound metal foil from the metal foil unwinding reel to activate the unwound metal foil.
  • the method for producing a multilayer metal laminate comprises the steps of: placing a metal plate on a metal plate rewind reel; placing a metal foil on a metal foil rewind reel; Activating the surface of the rewinding metal plate to form a first metal thin film on the surface of the metal plate; activating the surface of the metal foil by rewinding the metal foil from the metal foil rewinding reel; It is characterized in that the method includes a step of pressing the metal thin film surface and the metal foil surface in 1).
  • FIG. 1 is a cross-sectional view of a multilayer metal laminate.
  • FIG. 2 is a cross-sectional view of the metal thin-film laminate.
  • FIG. 3 is a schematic diagram showing the manufacturing method.
  • FIG. 4 is a schematic diagram showing the manufacturing method.
  • FIG. 5 is a schematic diagram illustrating the production method of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a schematic view showing a cross-sectional structure of a multilayer metal laminate of the present invention.
  • a metal plate 22 is laminated on a metal foil 26 via a first metal thin film 24.
  • the material of the metal plate 22 is not particularly limited as long as the material can form a thin film on the metal plate. It is appropriately selected and used depending on the use of the multilayer metal laminate of the present invention.
  • the multilayer metal laminate of the present invention when used for a printed circuit board for mounting, as a material of the metal plate, a copper plate, a titanium plate, a stainless steel plate, an aluminum plate, or the like is preferably applied.
  • the thickness of the metal plate 22 varies depending on the application, it is preferably 1.0 to 200 ⁇ for a printed circuit board for mounting. Further, those having a range of 25 to 150 ⁇ are preferably applied.
  • the type of the material of the first or second metal thin film 23, 24 is not particularly limited as long as it is a material having good adhesion to the underlying metal plate.
  • the first and second metal thin films 23 and 24 may be Fe, Ni, Cr, Pd, Zr, Co, Au , Ag, Sn, Cu, A1, etc. are preferably applied. Further, a metal thin film having a plurality of layers of these metals may be used. Also, alloys of these metals are applied as thin films.
  • the thickness varies depending on the application, but for a printed circuit board for mounting, 0.01 to 1 / im is preferably applied. More preferably, it is in the range of 0.1 to 0.5 ⁇ . Applied.
  • a single-layer foil such as a copper foil, a nickel foil, an aluminum foil, and an iron foil, a laminated foil (cladding material) thereof, an alloy foil, and a rolled thin plate can be applied. Further, it is also possible to apply a plating foil or the like having these surfaces plated.
  • the thickness varies depending on the application. For example, for a printed circuit board for mounting, a thickness of 3 to 100 ⁇ m is preferably applied. Further, the range of 10 to 35 ⁇ m is preferably applied.
  • a slightly thicker one having a thickness of 50 to 100 ⁇ m is preferably applied in order to improve heat transfer.
  • a metal plate 22 is set on a rewind reel 62, and the surface of the metal plate 22 is placed on a multilayer metal laminate manufacturing apparatus 50. Activation is performed using the activation treatment device 70 installed therein.
  • Activation here refers to the removal of foreign substances such as metal oxide ⁇ adsorbed garbage and oil adhering to the surface of the metal thin film on the metal plate, and to improve the adhesion with the metal foil in the later process. Surface treatment. Similarly, the surface of the metal foil 26 is also activated using the activation processing device 80.
  • the activation treatment device 70, 80 can be suitably used as long as it has a mechanism capable of cleaning the surface.
  • the method of performing the activation treatment by the sputter etching treatment is as follows: (1) 1 X 10 i X l In an extremely low pressure inert gas atmosphere of O— 3 Pa, (2) the metal plate 22 and the metal foil 26 are each used as one electrode A (72) grounded to ground, and An AC of 1 to 50 MHz is applied between the electrode B and the electrode B to cause a glow discharge, and (3) an electrode roll exposed in the plasma generated by the glow discharge. (A) Force to be performed by sputter etching treatment, which is 1/3 or less of the area b of the electrodes 74, 84, respectively.
  • ion bombardment occurs preferentially on the electrode A side, which is the material to be etched, and hardly occurs on the electrode B side.
  • the surface activation treatment can also be performed using an ion gun or the like that can achieve surface activation at high speed.
  • a thin film forming unit 90 for forming the first metal thin film 24 on the metal plate 22 is installed in the vacuum vessel 52 in a subsequent step of the activation processing device 70.
  • an AC of l to 50 MHz is applied between the one electrode A (electrode roll 72) grounded and the other electrode B (76) supported insulated. To cause a glow discharge.
  • the surface of the metal plate 22 is not etched.
  • a first metal thin film 24 is formed on the surface.
  • the opposing area ratio of the electrode a and the electrode b is reversed from that in the case of the activation process.
  • ion impact can be applied to the target side, and a thin film is formed on the metal plate.
  • a sputter tub used as an example of the thin film forming unit 90 used in the present invention will be described with reference to FIG.
  • the sputter unit 90 is composed of a target electrode 94 electrically floating and a water-cooled electrode roll 72 grounded to ground.
  • a target 92 for forming the first metal thin film 24 is provided on the target electrode 94, and a magnet 98 is provided to improve the efficiency of sputtering by a magnetic field.
  • the target electrode 94 Can be water-cooled.
  • a high-frequency power source 96 is applied to the target electrode 94 to generate plasma between the target electrode 94 and the electrode roll 72, and ion bombard the target 92.
  • the target atoms emitted thereby form a first metal thin film 24 on the metal plate 22.
  • the metal foil 26 to be laminated is also subjected to an activation treatment using the activation treatment device 80, and the metal foil 26 using the same thin film formation unit 95 as the thin film formation unit 90 described above.
  • a second metal thin film 23 is formed on the surface of the substrate.
  • a plurality of electrodes 76 are provided and a plurality of thin film forming units 91 are arranged so that the second metal thin film 23 can be multilayered.
  • Such metal thin films may be of the same type or of different types. Even if a large number of electrodes 76 are provided, it is possible to prevent the formation of a metal thin film at all by turning off the power to these electrodes. Also, by turning off some power supplies, thin films of any number of layers can be formed.
  • a method for forming the first and second metal thin films known methods such as a sputtering method, an ion plating method, and a vacuum evaporation method (see Japanese Patent Application Laid-Open No. 8-231717) can be used. .
  • the pressure welding is preferably light pressure welding that does not damage the metal foil / metal thin film.
  • the numerical value is expressed in terms of the reduction ratio, it is preferable to set it to about 0.1 to 10%.
  • a copper plate having a thickness of 100 m was used as the metal plate.
  • a copper foil with a thickness of 18 ⁇ m was used as the metal foil.
  • the copper plate 2 2 unwound from the metal plate rewind reel 6 2 and the copper foil 2 6 unwound from the metal foil rewind reel 6 4 are used for the water-cooled electrode roll 7 2 in the vacuum vessel 52. , And 82, respectively, and were subjected to an active treatment by a sputter etching method in the activation treatment unit 70. After activating the copper plate 22, it was sent to a sputter unit 90 while being wound on a water-cooled electrode roll 72, and a nickel thin film having a thickness of 0.2 ⁇ m was formed as a metal thin film 24.
  • the copper foil 26 was wound around a water-cooled electrode roll 82 and sent to a sputtering unit 95 to form a nickel thin film having a thickness of 0.2 ⁇ as the metal thin film 23.
  • the joining surface of the copper plate 22 with the nickel metal thin film 24 formed on the surface and the copper foil 26 with the nickel metal thin film 23 formed on the surface is superimposed on each other. Cold-welded at a specific rate to produce a multilayer metal laminate consisting of four layers: a copper plate, a Huckel thin film, a nickel thin film, and a copper foil.
  • Example 2 A copper plate having a thickness of 100; zm was used as the metal plate. A 35- ⁇ m thick copper foil was used as the metal foil.
  • the copper plate 2 2 unwound from the metal sheet rewind reel 6 2 and the copper foil 2 6 unwound from the metal foil unwind reel 6 4 are used for the water-cooled electrode roll 7 2 in the vacuum vessel 5 2.
  • And 82 respectively, and activated in the activation treatment unit 70 by a sputter etching method.
  • the copper foil 26 was activated, it was passed through the sputter unit 95 while being wound on the water-cooled electrode roll 82, but the power was turned off, and no metal thin film was formed.
  • a copper plate 22 having a metal thin film 24 of aluminum thin film formed on its surface and a copper foil 26 whose surface has been subjected to an activation treatment are overlapped with each other, and are cold-welded at a low reduction rate of about 0.5%. Then, a multilayer metal laminate consisting of three layers, a copper plate, an aluminum thin film, and a copper foil, was manufactured.
  • the multilayer metal laminate of the present invention is pressed in a vacuum vessel without using an adhesive, a metal foil and a metal plate can be manufactured with a uniform thickness.
  • the apparatus can be made compact.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un laminé métallique multicouche non adhésif à épaisseur donnée, qui résulte de la liaison entre une feuille métallique, dont une surface comporte un film métallique fin, et un ruban métallique, sans recourir à un adhésif. L'invention concerne également un procédé de fabrication en continu comprenant les étapes suivantes: pose d'une feuille métallique sur une bobine déroulant cette feuille, pose d'un ruban métallique sur une bobine déroulant ce ruban, déroulement de la feuille et activation d'une surface de la feuille pour former un premier film métallique fin sur la surface de la feuille; déroulement du ruban et activation d'une surface du ruban pour former un second film métallique sur la surface du ruban, et liaison sous presse de la surface activée du premier film sur la surface activée du second film pour que le premier film formé sur la feuille soit en contact avec le second film formé sur le ruban.
PCT/JP2001/008756 2000-10-18 2001-10-04 Lamine metallique multicouche et procede d'elaboration WO2002032660A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR10-2003-7005397A KR100537322B1 (ko) 2000-10-18 2001-10-04 다층 금속 적층판 및 그 제조 방법
US10/399,530 US7175919B2 (en) 2000-10-18 2001-10-04 Multilayered metal laminate and process for producing the same
AU2001292353A AU2001292353A1 (en) 2000-10-18 2001-10-04 Multilayered metal laminate and process for producing the same
EP01972690A EP1342564A4 (fr) 2000-10-18 2001-10-04 Lamine metallique multicouche et procede d'elaboration
US11/387,949 US20060163329A1 (en) 2000-10-18 2006-03-24 Multilayered metal laminate and process for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-318626 2000-10-18
JP2000318626A JP4447762B2 (ja) 2000-10-18 2000-10-18 多層金属積層板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/387,949 Continuation US20060163329A1 (en) 2000-10-18 2006-03-24 Multilayered metal laminate and process for producing the same

Publications (1)

Publication Number Publication Date
WO2002032660A1 true WO2002032660A1 (fr) 2002-04-25

Family

ID=18797218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/008756 WO2002032660A1 (fr) 2000-10-18 2001-10-04 Lamine metallique multicouche et procede d'elaboration

Country Status (7)

Country Link
US (2) US7175919B2 (fr)
EP (1) EP1342564A4 (fr)
JP (1) JP4447762B2 (fr)
KR (1) KR100537322B1 (fr)
CN (1) CN1275764C (fr)
AU (1) AU2001292353A1 (fr)
WO (1) WO2002032660A1 (fr)

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WO2018147297A1 (fr) * 2017-02-07 2018-08-16 東洋鋼鈑株式会社 Ensemble laminé et son procédé de fabrication
WO2020133965A1 (fr) * 2018-12-29 2020-07-02 广东生益科技股份有限公司 Stratifié revêtu d'une feuille de cuivre à base métallique et son procédé de préparation

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CN100440585C (zh) * 2005-01-14 2008-12-03 谢振华 电池内部的极耳或电池之间导电金属片的加工方法
JP4579705B2 (ja) * 2005-02-02 2010-11-10 日本製箔株式会社 クラッド材とその製造方法
JP4640802B2 (ja) 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
KR100773391B1 (ko) 2005-09-01 2007-11-05 한국전기연구원 박판 접합 장치 및 이를 이용한 박판 접합 방법
US20070243451A1 (en) * 2006-04-14 2007-10-18 Chao-Yi Yuh Anode support member and bipolar separator for use in a fuel cell assembly and for preventing poisoning of reforming catalyst
JP4865453B2 (ja) * 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
KR101306181B1 (ko) * 2008-11-12 2013-09-09 도요 고한 가부시키가이샤 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판의 제조 방법 및 반도체 소자 형성의 에피택셜 성장막 형성용 금속 적층 기판
JP5411573B2 (ja) * 2009-05-20 2014-02-12 中部電力株式会社 表面活性化接合による金属クラッド帯の製造方法及びその装置
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CN102489816A (zh) * 2011-12-23 2012-06-13 山东大学 超级镍叠层复合材料与Cr18-Ni8不锈钢的非晶钎焊工艺
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CN1275764C (zh) 2006-09-20
US20040065717A1 (en) 2004-04-08
CN1469805A (zh) 2004-01-21
US7175919B2 (en) 2007-02-13
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