WO2020133965A1 - Stratifié revêtu d'une feuille de cuivre à base métallique et son procédé de préparation - Google Patents

Stratifié revêtu d'une feuille de cuivre à base métallique et son procédé de préparation Download PDF

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Publication number
WO2020133965A1
WO2020133965A1 PCT/CN2019/092321 CN2019092321W WO2020133965A1 WO 2020133965 A1 WO2020133965 A1 WO 2020133965A1 CN 2019092321 W CN2019092321 W CN 2019092321W WO 2020133965 A1 WO2020133965 A1 WO 2020133965A1
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layer
thermally conductive
copper
conductive insulating
insulating layer
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PCT/CN2019/092321
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English (en)
Chinese (zh)
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佘乃东
叶晓敏
黄增彪
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广东生益科技股份有限公司
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Publication of WO2020133965A1 publication Critical patent/WO2020133965A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present disclosure relates to the field of printed circuit substrates, in particular to a metal-based copper-clad laminate and a preparation method thereof.
  • the metal-based copper-clad laminates are mainly aluminum-based copper-clad laminates and copper-based copper-clad laminates.
  • the aluminum-based copper-clad laminate uses an aluminum plate as a substrate, and the copper-based copper-clad laminate uses a copper plate as a substrate. Due to its cost advantages, aluminum-based copper clad laminates are still the mainstream products of metal-based copper clad laminates. However, when the printed circuit board needs to transmit a larger current and at the same time generate heat more concentratedly, the thermal conductivity of the aluminum-based copper-clad plate cannot meet the requirements. In addition, the aluminum-based copper-clad laminate cannot meet the direct electroplating process of drilling, that is, the process of directly electroplating the holes drilled in the aluminum substrate. The disadvantages of copper-based copper clad laminates include high density and high cost, so their use is also limited.
  • the present disclosure provides a laminate, the laminate comprising:
  • a metal substrate composed of a copper layer and an aluminum layer in close contact
  • a copper foil layer on the thermally conductive insulating layer is formed on the thermally conductive insulating layer.
  • the thickness ratio of the copper layer to the aluminum layer is 1:9 to 4:6.
  • the thickness of the metal substrate is 1.0-5.0 mm.
  • the bonding strength between the copper layer and the aluminum layer of the metal substrate is greater than 100 MPa.
  • the surface of the copper layer in contact with the thermally conductive insulating layer is subjected to chemical surface treatment or mechanical surface treatment.
  • the surface roughness Ra of the surface of the copper layer in contact with the thermally conductive insulating layer is 0.1 ⁇ m-0.6 ⁇ m.
  • the thermal conductivity of the thermally conductive insulating layer is 1W/m ⁇ k-10W/m ⁇ k.
  • the thermal conductivity of the thermally conductive insulating layer is 2W/m ⁇ k-4W/m ⁇ k.
  • the thermally conductive insulating layer is a thermally conductive insulating layer without reinforcing material.
  • the thermally conductive insulating layer is an insulating resin containing thermally conductive filler.
  • the insulating resin is any one or a combination of at least two of epoxy resin, polyphenylene ether resin, and polyimide resin.
  • the thickness of the heat conductive insulating layer is 0.03 mm-0.20 mm, and the thickness of the copper foil layer is 0.012 mm-0.210 mm.
  • the laminate has a blind hole, the blind hole opening is on the surface of the copper foil layer, passes through the copper foil layer and the thermally conductive insulating layer, and terminates in the copper layer, wherein the The surface of the blind hole is plated with a conductive film.
  • the present disclosure provides a method of preparing a laminate, the method comprising:
  • the metal substrate is pressed at high temperature with the thermally conductive insulating layer and the copper foil layer, wherein the copper layer of the metal substrate is opposite to the thermally conductive insulating layer.
  • the high-temperature pressing at the time of preparing the metal substrate is performed at a temperature above 600°C.
  • the high-temperature pressing of the metal substrate with the thermally conductive insulating layer and the copper foil layer includes:
  • the metal substrate and the copper foil layer on which the thermally conductive insulating layer is formed are pressed at high temperature.
  • the high-temperature pressing of the metal substrate with the thermally conductive insulating layer and the copper foil layer includes:
  • the metal substrate, the thermally conductive insulating film and the copper foil layer are pressed together at high temperature.
  • FIG. 1 is a schematic diagram of a laminate according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram of a laminate with blind holes according to one embodiment of the present disclosure.
  • the purpose of the present disclosure is to provide a laminate and a method of manufacturing the same to solve the above problems.
  • an embodiment of the present disclosure adopts the following technical solutions:
  • the laminate has a metal substrate composed of a copper layer and an aluminum layer in close contact, a thermally conductive insulating layer on the copper layer of the metal substrate, and a copper foil layer on the thermally conductive insulating layer.
  • the present disclosure provides a laminate including:
  • a metal substrate composed of a copper layer and an aluminum layer in close contact
  • a copper foil layer on the thermally conductive insulating layer is formed on the thermally conductive insulating layer.
  • the laminate of the present disclosure has a structure composed of a metal substrate 1, a thermally conductive insulating layer 2 and a copper foil layer 3.
  • the copper foil layer is used to form a circuit in the printed circuit board.
  • the thermally conductive insulating layer insulates the metal substrate and the copper foil layer from each other, and at the same time can conduct the heat on the copper foil layer to the metal substrate to prevent heat concentration in the copper foil layer.
  • the metal substrate provides support and mechanical strength to the laminate, while at the same time acting as a heat sink.
  • the metal substrate 1 of the present disclosure is composed of a copper layer 12 and an aluminum layer 11 in close contact, wherein one side of the copper layer 12 is in contact with the aluminum layer 11 and the other side is in contact with the thermally conductive insulating layer 2.
  • the metal substrate of the present disclosure has better heat dissipation.
  • the metal substrates of the present disclosure have lower density and much lower cost.
  • the side of the metal substrate of the present disclosure near the copper foil layer is a copper layer, which has a similar coefficient of thermal expansion to the copper foil layer.
  • the coefficient of thermal expansion between it and the copper foil layer is large, and damage is likely to occur.
  • a conductive film may be plated in the blind hole.
  • a pure aluminum substrate it will be difficult to plate a conductive film.
  • the copper layer in the metal substrate of the present disclosure may be prepared using copper, brass, bronze, and cupronickel.
  • copper is used to prepare the copper layer.
  • the thermal conductivity and electrical conductivity of red copper are more excellent, and the thermal expansion coefficient of the copper foil layer is more matched.
  • the copper layer and the aluminum layer are in close contact. In other words, there is no other medium such as an adhesive layer between the copper layer and the aluminum layer.
  • the metal substrate can be made by directly pressing the copper layer and the aluminum layer.
  • the bonding strength between the copper layer and the aluminum layer of the metal substrate is greater than 100 MPa. The advantage is that the metal substrate will not delaminate after being subjected to cold and hot cycles, and the heat dissipation is better.
  • the aluminum layer in the metal substrate of the present disclosure may use 1 series, 3 series, 4 series, 5 series, and 6 series aluminum plates. Preferably, it is preferred to use 1 series aluminum plates to prepare the aluminum layer.
  • 1 series aluminum plates Preferably, it is preferred to use 1 series aluminum plates to prepare the aluminum layer. The advantage is that the thermal conductivity of series 1 aluminum is better.
  • the thickness ratio of the copper layer to the aluminum layer is preferably 1:9 to 4:6. Within this range, the metal substrate also has excellent heat dissipation, suitable density and suitable cost.
  • the thickness of the metal substrate of the present disclosure is preferably 1.0-5.0 mm. Within this thickness, sufficient heat dissipation and suitable cost can be provided.
  • the copper layer in the metal substrate of the present disclosure is in contact with the thermally conductive insulating layer.
  • the thermally conductive insulating layer must have both excellent thermal conductivity and excellent insulation. Typically, the thermal conductivity thereof should not be less than 0.5W / m ⁇ k, which is not lower than the resistivity of 10 ohm-meters.
  • the surface of the copper layer in contact with the thermally conductive insulating layer may undergo surface treatment.
  • the surface treatment may be chemical surface treatment or mechanical surface treatment. Chemical surface treatments include micro-etching, browning, blackening, etc. Mechanical surface treatment includes grinding, sand blasting, and wire drawing.
  • the surface-treated copper layer is more firmly combined with the thermally conductive insulating layer.
  • the surface roughness Ra of the copper layer in contact with the thermally conductive insulating layer is 0.1 ⁇ m-0.6 ⁇ m.
  • the thermally conductive insulating layer in the laminate of the present disclosure may be formed of a composition containing an insulating resin, a thermally conductive filler, a curing agent, and an accelerator.
  • the insulating resin is any one or a combination of at least two of epoxy resin, polyphenylene ether resin, and polyimide resin.
  • the thermally conductive insulating layer may also contain reinforcement materials. However, it is preferable to use an insulating layer without reinforcing materials because the insulating layer without reinforcing materials can achieve better thermal conductivity.
  • the reinforcing material in the present disclosure refers to fibrous reinforcing materials, such as glass fiber cloth and non-woven cloth.
  • the thermally conductive insulating layer of the present disclosure is preferably not a material obtained by dip coating resin on fabrics such as glass fiber cloth, non-woven fabric, etc., but a glue film, resin coating, etc. that does not contain a reinforcing material.
  • the thickness of the thermally conductive insulating layer of the present disclosure is preferably 0.03-0.20 mm. Within this thickness range, the thermally conductive insulating layer has both excellent insulation and excellent thermal conductivity.
  • the thermal conductivity of the thermally conductive insulating layer of the present disclosure is preferably 1-10 W/m ⁇ k, and more preferably 2-4 W/m ⁇ k.
  • the thermal conductivity is preferably 1-10 W/m ⁇ k, and more preferably 2-4 W/m ⁇ k.
  • the thermal conductivity is too low, the heat cannot be transferred from the copper foil side to the metal substrate side in time.
  • the higher the thermal conductivity the better, because in order to achieve a higher thermal conductivity, a higher proportion of thermally conductive filler must be added, which will lead to a decrease in the density and mechanical properties of the thermally conductive insulating layer.
  • the inventor found that within the above range, the thermal conductivity and mechanical properties of the thermally conductive insulating layer reached an optimal balance.
  • the thermal expansion coefficient of the thermally conductive insulating layer within this range is similar to the copper foil layer and the metal substrate, and the matching between thermal conduction and heat dissipation is the best.
  • the heat on the copper foil layer can be quickly conducted to the metal substrate when subjected to cold and heat cycles, which avoids the breakage of the circuit or circuit pad of the copper foil layer and improves the reliability of the circuit.
  • the copper foil layer of the present disclosure may use a copper foil layer material conventional in the field of printed circuit boards, and preferably electrolytic copper or rolled copper is used.
  • the thickness of the copper foil layer may be a conventional thickness, preferably 0.012-0.210 mm.
  • the laminate of the present disclosure may have blind holes. As shown in FIG. 2, the blind hole 5 opens on the surface of the copper foil layer 3, passes through the copper foil layer 3 and the thermally conductive insulating layer 2, and terminates in the copper layer 12, wherein the A conductive film 4 is plated on the surface of the blind hole 5. After plating the blind hole 5, the metal substrate 1 can be used as a conductive layer.
  • each layer in the laminate of the present disclosure may be patterned. Therefore, for example, a laminate in which a patterned copper foil layer can be used as a printed circuit substrate, and such a printed circuit substrate also belongs to the laminate of the present disclosure. Moreover, the laminate of the present disclosure may also have a conventional configuration in printed circuit boards such as through holes, blind holes, and the like.
  • a method of preparing a laminate includes:
  • the metal substrate is pressed together with the thermally conductive insulating layer and the copper foil layer at high temperature.
  • a metal substrate is made by directly laminating a copper layer and an aluminum layer at high temperature.
  • the metal substrate, the thermally conductive insulating layer and the copper foil layer are pressed at high temperature to form a laminate.
  • Pressing pressure and temperature range can be 20-100kgf/cm 2 and 150-250°C
  • the pressing temperature of the copper layer and the aluminum layer when preparing the metal substrate is higher than 600°C.
  • the high-temperature pressing of the metal substrate with the thermally conductive insulating layer and the copper foil layer includes:
  • the metal substrate and the copper foil layer on which the thermally conductive insulating layer is formed are pressed at high temperature.
  • the high temperature lamination of the metal substrate with the thermally conductive insulating layer and the copper foil layer includes:
  • the metal substrate, the thermally conductive insulating film and the copper foil layer are pressed together at high temperature.
  • an insulating and thermally conductive composition containing an insulating resin, a thermally conductive filler, a curing agent, and an accelerator may be coated on the copper foil layer, and then pressed with a metal substrate at high temperature. It is also possible to first form a separate insulating and thermally conductive composition film, and then press-bond it with the copper foil layer and the metal substrate at high temperature.
  • the laminate of the present disclosure has excellent heat dissipation, cost and reliability, can be processed to form plated blind holes, and is suitable for use as a printed circuit board for electronic components requiring high current and high heat dissipation.
  • the copper foil layer is electrolytic copper with a thickness of 0.035mm.
  • the reinforced material of the insulating layer is fiberglass cloth.
  • the copper layer is red copper.
  • the surface roughness Ra of the copper layer and the thermally conductive insulating layer was 0.4 ⁇ m.
  • the aluminum layer is 1 series aluminum.
  • the thermal paste is Dow Corning SC102.
  • the size of the laminate that is, the length and width of the copper foil layer, the copper layer, and the aluminum layer are 500 mm ⁇ 600 mm, respectively.
  • the metal substrate is prepared into a sample of 25.4mm ⁇ 25.4mm, using ASTM D5470 test method.
  • the metal substrate is prepared as a sample of 100 mm ⁇ 100 mm, and the method is tested according to the surface roughness of the metal foil in IPC-TM-6502.2.17A.
  • Cost factor comprehensively consider the price and processing cost of copper and aluminum plates, and use pure aluminum plates as the coefficient 1 and pure copper plates as the coefficient 10 for calculation.
  • Drilling and electroplating blind holes are drilled first, and then electrochemical copper plating. Evaluate the efficiency and process feasibility of electroplating, and evaluate the combination of hole wall plating after electroplating.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and curing at a temperature of 160°C, the copper foil coated with a thermally conductive insulating layer is laminated on a 1.0mm copper-aluminum plate (copper layer thickness 0.3mm, aluminum layer thickness 0.7mm) treated by browning the surface Copper surface. After being pressed at a high temperature of 200°C and a pressure of 40kgf/cm 2 , a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and semi-curing, the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a 1.0 mm copper-aluminum plate (copper layer thickness 0.1 mm, aluminum layer thickness 0.9 mm) that has been surface-treated by browning. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and semi-curing, the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a surface-treated 1.0mm copper-aluminum plate (copper layer thickness 0.4mm, aluminum layer thickness 0.6mm), and pressed at high temperature After that, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the thermally conductive insulating layer containing the reinforcing material is sandwiched between the matte surface of the copper foil layer and the 1.0mm copper-aluminum plate (copper layer thickness 0.3mm, aluminum layer thickness 0.7mm) treated by browning the surface. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a reinforcing material, the thermal conductivity is 2 W/m ⁇ k, and the thickness is 0.100 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After being baked and semi-cured, the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a 1.0mm copper-aluminum plate (copper layer thickness 0.05mm, aluminum layer thickness 0.95mm) treated by browning surface treatment. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and semi-curing, the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a 1.0mm copper-aluminum plate (copper layer thickness 0.6mm, aluminum layer thickness 0.4mm) that has been treated with a browning surface. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer.
  • the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a 1.0 mm copper-aluminum plate (copper layer thickness 0.3 mm, aluminum layer thickness 0.7 mm) that has been surface-treated by browning. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermal conductivity of the thermally conductive insulating layer is 0.5 W/m ⁇ k.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer.
  • the thermal conductivity of the thermally conductive insulating layer is 12W/m ⁇ k.
  • the copper foil coated with a thermally conductive insulating layer is laminated on the copper surface of a 1.0 mm copper-aluminum plate (copper layer thickness 0.3 mm, aluminum layer thickness 0.7 mm) that has been surface-treated by browning. After high temperature lamination, a copper-aluminum-based copper-clad laminate can be produced.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and semi-curing, the copper foil coated with a thermally conductive insulating layer is laminated on a 1.0 mm aluminum plate treated with anodizing surface. After high-temperature pressing, an aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After baking and semi-curing, the copper foil coated with a thermally conductive insulating layer is laminated on a 1.0 mm copper plate treated with a browned surface. After high temperature lamination, a copper-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the resin of the thermally conductive insulating layer is coated on the rough surface of the copper foil layer. After being baked and semi-cured, the copper foil coated with a thermally conductive insulating layer is laminated on a 0.3 mm copper plate treated with a browning surface, and pressed at high temperature. Then, using Dow Corning SC102 thermal paste to adhere the copper plate to the 0.7mm aluminum plate, a copper-aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a thermally conductive filler, and has a thermal conductivity of 3 W/m ⁇ k and a thickness of 0.050 mm.
  • the thermally conductive insulating layer containing the reinforcing material is sandwiched between the matte surface of the copper foil layer and the 1.0 mm aluminum plate surface-treated by anodization. After high-temperature pressing, an aluminum-based copper-clad laminate can be produced.
  • the thermally conductive insulating layer is an insulating resin containing a reinforcing material, the thermal conductivity is 2 W/m ⁇ k, and the thickness is 0.100 mm.
  • the resin of the thermally conductive insulating layer is coated on a 0.05mm aluminum foil, and after baking and semi-curing, then it is pressed and clamped on a 1.0mm copper-aluminum plate (copper layer thickness 0.95mm, aluminum layer) On the copper surface with a thickness of 0.05mm), after high temperature pressing, a copper-aluminum-based aluminum foil-clad laminate can be prepared.
  • Examples 1-9 are all laminates of the embodiments of the present disclosure.
  • a pure aluminum substrate was used.
  • a pure copper substrate was used.
  • a copper plate and an aluminum plate were bonded using a thermal paste.
  • a pure aluminum substrate is used and the insulating and thermally conductive layer contains a reinforcing material.
  • a copper-aluminum composite board was used instead of copper foil.
  • aluminum foil was used instead of copper foil, and the aluminum layer in the metal substrate was very thin.
  • Comparative Example 1 a pure aluminum substrate was used, and there was no copper layer in the metal substrate.
  • the thermal conductivity of the obtained laminate is 40W/m ⁇ K, and the number of cold and heat cycles is less than 100, and the drilling and plating are difficult and the reliability is low.
  • Comparative Example 2 a pure copper substrate was used, and there was no aluminum layer in the metal substrate.
  • the metal base density of the resulting laminate is as high as 8.9 g/cm 3 and the cost factor is as high as 10.
  • Comparative Example 3 a copper-aluminum composite substrate was used, but the copper layer and the aluminum layer were bonded by a thermal paste.
  • the production process of the laminate is very complicated, withstands less than 100 heat and cold cycles, and can not be drilled and plated.
  • Comparative Example 4 a pure aluminum substrate was used, and an insulating layer with a reinforcing material was used. Such a laminate obtains excellent strength by sacrificing a certain thermal conductivity. However, as in Comparative Example 1, the number of cold and heat cycles is less than 100, and drilling and plating are difficult and the reliability is low.
  • Comparative Example 5 a metal substrate composed of a copper layer and an aluminum layer is used on both sides of the insulating layer, but the laminate cannot be used to design circuits on the aluminum layer.
  • Comparative Example 6 the thickness ratio of the aluminum layer is low, and aluminum foil is used instead of copper foil. Therefore, compared with Examples 1-4, the aluminum foil has a larger resistance, poor conductive layer effect, and difficult drilling and electroplating. 100 times.
  • Examples 1 to 9 a metal substrate composed of a copper layer and an aluminum layer in close contact was used. Compared with laminates using pure aluminum substrates under the same conditions, their thermal conductivity is increased, and the number of cycles of cooling and heating is also increased. Compared with laminates using pure copper substrates under the same conditions, their density and cost coefficient are reduced. In addition, the metal substrate composed of the copper layer and the aluminum layer in close contact is also conducive to drilling and plating.
  • Example 5 uses a thermally conductive insulating layer with a reinforcing material, the strength of which is greatly increased. Although the thermal conductivity of the whole board is relatively low, it is still higher than that of Comparative Example 4 which also uses a thermally conductive insulating layer with a reinforcing material.
  • the thickness ratio of the copper layer in Example 6 is low, so compared with Examples 1-4, the number of cycles of cooling and heating is lower, the thermal conductivity is reduced, and the drilling plating is relatively difficult, but compared with Comparative Example 1 It still has a high thermal conductivity and a high number of cooling and heating cycles, and the reliability of the drilled hole plating structure is still high.
  • the thickness ratio of the copper layer in Example 7 is high, so compared with Examples 1-4, the cost coefficient is higher and the density is higher, but compared with Comparative Example 2, it still has low cost and low density.
  • the thermally conductive insulating layer with a thermal conductivity of 0.5 W/m ⁇ k used in Example 8 has a low thermal conductivity, a large thermal expansion coefficient, and less than 300 heat and cold cycles.
  • the thermally conductive insulating layer with a thermal conductivity of 12 W/m ⁇ k used in Example 9 has more filler content in the thermally conductive insulating layer, the density of the adhesive layer is poor, the reliability of the drilling electroplating is poor, and the resistance to cold and heat cycles is reduced frequency.
  • the performance of the solutions of Examples 8 and 9 withstanding the number of cycles of heating and cooling is still better than that of Comparative Example 1, and the cost is much lower than that of Comparative Example 2.
  • Example 1 The laminates in Examples 1-4 have both high thermal conductivity sufficient for use as a printed circuit board, suitable density and cost, good resistance to cold and heat cycles, and can be used for drilling and plating.
  • Example 2 a laminate is prepared by first forming a separate insulating and thermally conductive film, and the results show that it also has good performance.
  • the laminate of the present disclosure has lower density and cost, and at the same time has high heat dissipation and can withstand cold and hot cycles.
  • the laminate of the present disclosure is also suitable for forming blind holes therein and performing electroplating.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un stratifié et son procédé de préparation. Le stratifié a une plaque de base métallique constituée d'une couche de cuivre et d'une couche d'aluminium en contact étroit, une couche d'isolation thermiquement conductrice sur la couche de cuivre de la plaque de base métallique, et une couche de feuille de cuivre sur la couche d'isolation thermiquement conductrice. Le stratifié peut être utilisé comme carte de circuit imprimé.
PCT/CN2019/092321 2018-12-29 2019-06-21 Stratifié revêtu d'une feuille de cuivre à base métallique et son procédé de préparation WO2020133965A1 (fr)

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CN210157469U (zh) * 2018-12-29 2020-03-17 广东生益科技股份有限公司 金属基覆铜箔层压板
CN112135441A (zh) * 2020-10-09 2020-12-25 景旺电子科技(龙川)有限公司 一种接地金属基线路板及其制备方法
CN112646508B (zh) * 2020-12-21 2023-10-13 深圳先进电子材料国际创新研究院 一种导热双面胶带及其制备方法
CN113635649B (zh) * 2021-08-17 2023-09-22 天长市京发铝业有限公司 一种覆铜板压制方法
TWI790103B (zh) * 2022-01-24 2023-01-11 健鼎科技股份有限公司 多層電路板及其製造方法
CN115384139B (zh) * 2022-09-20 2024-01-02 天长市京发铝业有限公司 一种电子电路用铝基覆铝镀金属板及其制备方法

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