JPH0316799B2 - - Google Patents
Info
- Publication number
- JPH0316799B2 JPH0316799B2 JP58056954A JP5695483A JPH0316799B2 JP H0316799 B2 JPH0316799 B2 JP H0316799B2 JP 58056954 A JP58056954 A JP 58056954A JP 5695483 A JP5695483 A JP 5695483A JP H0316799 B2 JPH0316799 B2 JP H0316799B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- insulating layer
- board according
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 50
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 20
- 239000010409 thin film Substances 0.000 claims description 19
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical group [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims 1
- 238000009725 powder blending Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910020938 Sn-Ni Inorganic materials 0.000 description 2
- 229910008937 Sn—Ni Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000796 S alloy Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58056954A JPS59182592A (ja) | 1983-03-31 | 1983-03-31 | 抵抗回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58056954A JPS59182592A (ja) | 1983-03-31 | 1983-03-31 | 抵抗回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59182592A JPS59182592A (ja) | 1984-10-17 |
| JPH0316799B2 true JPH0316799B2 (fr) | 1991-03-06 |
Family
ID=13041933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58056954A Granted JPS59182592A (ja) | 1983-03-31 | 1983-03-31 | 抵抗回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182592A (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61137391A (ja) * | 1984-12-10 | 1986-06-25 | 三菱瓦斯化学株式会社 | 印刷配線用成形体の製造法 |
| DE60115175T2 (de) * | 2000-09-22 | 2006-07-27 | Nikko Materials Usa Inc., Chandler | Widerstandselement aus mehreren resistiven Schichten |
| AU2003220797A1 (en) * | 2002-04-02 | 2003-10-27 | Toyo Kohan Co., Ltd. | Resistor film laminate, method for manufacturing resistor film laminate, component comprising resistor film laminate, and method for manufacturing component comprising resistor film laminate |
| KR101489347B1 (ko) * | 2009-08-11 | 2015-02-03 | 가마야 덴끼 가부시끼가이샤 | 저저항의 칩형 저항기와 그 제조 방법 |
| CN104952569A (zh) * | 2009-08-11 | 2015-09-30 | 釜屋电机株式会社 | 低电阻的片形电阻器及其制造方法 |
| JP2017152417A (ja) * | 2016-02-22 | 2017-08-31 | パナソニックＩｐマネジメント株式会社 | チップ抵抗器 |
-
1983
- 1983-03-31 JP JP58056954A patent/JPS59182592A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59182592A (ja) | 1984-10-17 |
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