CN115384139B - 一种电子电路用铝基覆铝镀金属板及其制备方法 - Google Patents
一种电子电路用铝基覆铝镀金属板及其制备方法 Download PDFInfo
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- 238000000576 coating method Methods 0.000 claims abstract description 9
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
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- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical group CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 4
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- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 2
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- 239000002245 particle Substances 0.000 claims 1
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- 230000009286 beneficial effect Effects 0.000 description 2
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 2
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- GBFVZTUQONJGSL-UHFFFAOYSA-N ethenyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](OC(C)=C)(OC(C)=C)C=C GBFVZTUQONJGSL-UHFFFAOYSA-N 0.000 description 1
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- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明涉及电路金属板材料技术领域,尤其涉及一种电子电路用铝基覆铝镀金属板及其制备方法。所述电子电路用铝基覆铝镀金属板由铝基板、绝缘层、金属箔层组成,所述金属箔层由铝箔层与铜箔层组成,所述铜箔层通过电镀的方法结合在铝箔层上并且厚度小于或等于铝箔层,所述绝缘层一面与铝基板连接,一面与铝箔层连接;所述电子电路用铝基覆铝镀金属板通过以下方法制备:将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,冷却后在铝箔表面电镀一层铜箔,烘干,即得。本发明通过限定金属箔中铜箔与铝箔厚度的比例,从而使铜箔与铝箔双层金属箔制备的电路板的性能要求满足普通电路板的使用要求。
Description
技术领域
本发明涉及电路金属板材料技术领域,尤其涉及一种电子电路用铝基覆铝镀金属板及其制备方法。
背景技术
目前用于LED线路板的材料均为铝基覆铜板,其中铜箔的成本高。因此,采用其他金属材料替代铜箔,成为降低生产成本的手段之一。目前国内市场上的铝箔的价格远远低于铜箔,若采用铝箔替代部分的铜箔,则能有效降低经济成本。但是铝箔的导热系数比铜箔低,导热性能较铜箔差,同时介电常数比铜箔高,介电损失较大。若直接采用铝箔替代铜箔,则制备的电路板将不符合使用要求。
基于上述情况,本发明提出了一种电子电路用铝基覆铝镀金属板及其制备方法。
发明内容
本发明的目的在于提供一种电子电路用铝基覆铝镀金属板及其制备方法。
为实现上述目的,本发明提供了一种电子电路用铝基覆铝镀金属板,所述电子电路用铝基覆铝镀金属板由铝基板、绝缘层、金属箔层组成,所述金属箔层由铝箔层与铜箔层组成,所述铜箔层通过电镀的方法结合在铝箔层上并且铜箔厚度3-5um,所述绝缘层一面与铝基板连接,一面与铝箔层连接;所述电子电路用铝基覆铝镀金属板通过以下方法制备:将铝箔拉毛处理,配制树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,冷却后在铝箔表面电镀一层铜箔,烘干,即得。
优选地,所述树脂胶由以下重量份的原料组成:1~2wt%硅烷偶联剂、28~32wt%双组份环氧树脂、1~2wt%助剂、1~2wt%固化剂、剩余为纳米硅粉。
优选地,所述纳米硅粉的粒径为30±10nm。
优选地,所述硅烷偶联剂为含有乙烯基的硅烷偶联剂。
优选地,所述含有乙烯基的硅烷偶联剂为含有乙烯基且同时含有三个硅氧基的硅烷偶联剂。
所述含有乙烯基且同时含有三个硅氧基的硅烷偶联剂包括乙烯基三乙酰氧硅烷、乙烯基三异丙烯氧基硅烷、乙烯基三异丙氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷的其中一种。
优选地,所述硅烷偶联剂为乙烯基三乙酰氧硅烷,CAS号为4130-08-9。
优选地,所述助剂包括二月桂酸二丁基锡、聚丙二醇、醋酸乙烯酯的组合。
优选地,所述固化剂为三甲基已二胺、二乙胺、二已基三胺的其中一种。
优选地,所述绝缘层厚度为100~150μm,所述金属箔层的厚度为10~35μm。
本发明还提供了一种电子电路用铝基覆铝镀金属板的制备方法,所述方法包括如下步骤:
(1)将双组份环氧树脂与硅烷偶联剂在50~55℃以100~150rpm搅拌混合20~30min,随后加入纳米硅粉,以200~250rpm搅拌混合50~60min,最后加入其它助剂、固化剂,继续搅拌10~15min,即得树脂胶;
(2)将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以5℃/min的升温速率升温至210~220℃,固化时间为50~60min;
(3)固化冷却至30~35℃时在铝箔表面电镀一层铜箔,烘干,即得。
与现有技术相比,本发明具有如下有益效果:
1.本发明通过限定金属箔中铜箔与铝箔厚度的比例,从而使铜箔与铝箔双层金属箔制备的电路板的性能要求满足普通电路板的使用要求。
2.本发明原材料在国内充足,价格适宜,使其规模化生产没有太高的成本限制;同时,制备方法简单,总体生产成本不高,有利于工业的大规模生产。
具体实施方式
实施例1
按表1称量具体原料,步骤制备步骤如下:
(1)将双组份环氧树脂与硅烷偶联剂在50℃以100rpm搅拌混合30min,随后加入纳米硅粉,以200rpm搅拌混合60min,最后加入其它助剂、固化剂,继续搅拌15min,即得树脂胶;
(2)将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以2.5℃/min的升温速率升温至210℃,固化时间为50min;
(3)固化冷却至30℃时在铝箔表面电镀一层铜箔,烘干,即得。
实施例2
按表1称量具体原料,步骤制备步骤如下:
(1)将双组份环氧树脂与硅烷偶联剂在55℃以100rpm搅拌混合20min,随后加入纳米硅粉,以250rpm搅拌混合50min,最后加入其它助剂、固化剂,继续搅拌15min,即得树脂胶;
(2)将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以2.5℃/min的升温速率升温至220℃,固化时间为50min;
(3)固化冷却至35℃时在铝箔表面电镀一层铜箔,烘干,即得。
实施例3
按表1称量具体原料,步骤制备步骤如下:
(1)将双组份环氧树脂与硅烷偶联剂在55℃以150rpm搅拌混合30min,随后加入纳米硅粉,以250rpm搅拌混合60min,最后加入其它助剂、固化剂,继续搅拌15min,即得树脂胶;
(2)将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以2.5℃/min的升温速率升温至220℃,固化时间为50min;
(3)固化冷却至35℃时在铝箔表面电镀一层铜箔,烘干,即得。
对比例1
按表1称量具体原料,与实施例3不同的是,未使用纳米硅粉以及硅烷偶联剂,金属箔层全部为铜层,其余步骤制备步骤如下:
(1)将双组份环氧树脂与硅烷偶联剂在55℃以150rpm搅拌混合30min,随后加入纳米硅粉,以250rpm搅拌混合60min,最后加入其它助剂、固化剂,继续搅拌15min,即得树脂胶;
(2)将铜箔拉毛处理,加热树脂胶成半固化状涂抹至铜箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以2.5℃/min的升温速率升温至220℃,固化时间为50min,烘干,即得。
对比例2
按表1称量具体原料,与实施例3不同的是,未使用纳米硅粉以及硅烷偶联剂,其余步骤制备同实施例3。
对比例3
按表1称量具体原料,与实施例3不同的是,未使用硅烷偶联剂,其余步骤制备同实施例3。
对比例4
按表1称量具体原料,与实施例3不同的是,硅烷偶联剂为乙烯基甲基二乙氧基硅烷(CAS号5507-44-8),其余步骤制备步骤同实施例3。
对比例5
按表1称量具体原料,与实施例3不同的是,硅烷偶联剂为乙烯基三乙氧基硅烷(CAS号78-08-0),其余步骤制备步骤同实施例3。
表1
性能测试评价
将制备好的实施例1~3以及对比例1~5制备的电路板分别进行介电常数、导热系数、剥离强度测试。测试结果参见表2。
表2
前述对本发明的具体示例性实施方案的描述是为了说明和例证的目的。这些描述并非想将本发明限定为所公开的精确形式,并且很显然,根据上述教导,可以进行很多改变和变化。对示例性实施例进行选择和描述的目的在于解释本发明的特定原理及其实际应用,从而使得本领域的技术人员能够实现并利用本发明的各种不同的示例性实施方案以及各种不同的选择和改变。本发明的范围意在由权利要求书及其等同形式所限定。
Claims (4)
1.一种电子电路用铝基覆铝镀金属板,其特征在于,所述电子电路用铝基覆铝镀金属板由铝基板、绝缘层、金属箔层组成,所述金属箔层由铝箔层与铜箔层组成,所述铜箔层通过电镀的方法结合在铝箔层上并且铜箔厚度3-5μm,金属箔层的厚度为10-35μm,所述绝缘层一面与铝基板连接,一面与铝箔层连接;所述电子电路用铝基覆铝镀金属板通过以下方法制备:将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,冷却后在铝箔表面电镀一层铜箔,烘干,即得;
所述树脂胶由以下重量份的原料组成:1~2wt%硅烷偶联剂、28~32 wt %双组份环氧树脂、1~2wt%助剂、1~2wt%固化剂、剩余为纳米硅粉;
所述硅烷偶联剂为乙烯基三乙酰氧硅烷;
所述助剂包括二月桂酸二丁基锡、聚丙二醇和醋酸乙烯酯。
2.根据权利要求1所述的电子电路用铝基覆铝镀金属板,其特征在于,所述纳米硅粉的粒径为30±10 nm。
3.根据权利要求1所述的电子电路用铝基覆铝镀金属板,其特征在于,所述绝缘层厚度为100~150μm。
4.一种制备权利要求1所述的电子电路用铝基覆铝镀金属板的方法,其特征在于,所述方法包括如下步骤:
(1)将双组份环氧树脂与硅烷偶联剂在50~55℃以100~150rpm搅拌混合20~30min,随后加入纳米硅粉,以200~250rpm搅拌混合50~60min,最后加入其它助剂、固化剂,继续搅拌10~15min,即得树脂胶;
(2)将铝箔拉毛处理,加热树脂胶成半固化状涂抹至铝箔表面,热压到铝基板上压合成型,以1.0MPa的压力,以2.5℃/min的升温速率升温至210~220℃,固化时间为50~60min;
(3)固化冷却至30~35℃时在铝箔表面电镀一层铜箔,烘干,即得。
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