CN1263899C - 制造电解铜箔的电解质溶液和使用该电解质溶液的电解铜箔制造方法 - Google Patents

制造电解铜箔的电解质溶液和使用该电解质溶液的电解铜箔制造方法 Download PDF

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Publication number
CN1263899C
CN1263899C CNB031565093A CN03156509A CN1263899C CN 1263899 C CN1263899 C CN 1263899C CN B031565093 A CNB031565093 A CN B031565093A CN 03156509 A CN03156509 A CN 03156509A CN 1263899 C CN1263899 C CN 1263899C
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China
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copper foil
electrolyte solution
electrolytic copper
sulfopropyl
sulfo
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Expired - Fee Related
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Chinese (zh)
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CN1500915A (zh
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梁点植
林承麟
金相范
金起中
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
CNB031565093A 2002-11-14 2003-09-03 制造电解铜箔的电解质溶液和使用该电解质溶液的电解铜箔制造方法 Expired - Fee Related CN1263899C (zh)

Applications Claiming Priority (2)

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KR1020020070802 2002-11-14
KR20020070802 2002-11-14

Publications (2)

Publication Number Publication Date
CN1500915A CN1500915A (zh) 2004-06-02
CN1263899C true CN1263899C (zh) 2006-07-12

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CNB031565093A Expired - Fee Related CN1263899C (zh) 2002-11-14 2003-09-03 制造电解铜箔的电解质溶液和使用该电解质溶液的电解铜箔制造方法

Country Status (6)

Country Link
US (1) US20040104117A1 (ko)
JP (1) JP2004162172A (ko)
KR (1) KR100389061B1 (ko)
CN (1) CN1263899C (ko)
CA (1) CA2448892A1 (ko)
TW (1) TWI245082B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN103348041A (zh) * 2011-07-29 2013-10-09 古河电气工业株式会社 电解铜合金箔、其制备方法、制备中所用的电解液、使用该电解铜合金箔的二次电池用负极集电体、二次电池及其电极
CN112030199A (zh) * 2020-08-27 2020-12-04 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液

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JP4954686B2 (ja) * 2006-11-29 2012-06-20 福田金属箔粉工業株式会社 電解銅箔とその製造方法
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KR20140041804A (ko) * 2011-06-30 2014-04-04 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지
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CN104812943B (zh) * 2013-01-29 2016-11-16 古河电气工业株式会社 电解铜箔、使用该电解铜箔的锂离子二次电池用电极及使用该电极的锂离子二次电池
CN103074657B (zh) * 2013-02-26 2015-07-29 灵宝华鑫铜箔有限责任公司 一种电解铜箔用添加剂及7μm双光锂离子电池用电解铜箔生产工艺
CN104805478A (zh) * 2014-01-29 2015-07-29 金居开发铜箔股份有限公司 负极集电体用电解铜箔及其制造方法
KR101897474B1 (ko) * 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6346244B2 (ja) * 2015-11-10 2018-06-20 Ｊｘ金属株式会社 電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
CN105543907A (zh) * 2015-12-09 2016-05-04 深圳市正天伟科技有限公司 一种耐高电流密度电镀铜添加剂及其制备方法
CN105887144B (zh) * 2016-06-21 2018-09-21 广东光华科技股份有限公司 电镀铜镀液及其电镀铜工艺
KR102669501B1 (ko) 2016-08-23 2024-05-24 에스케이넥실리스 주식회사 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
CN106350836B (zh) * 2016-08-29 2019-02-26 灵宝华鑫铜箔有限责任公司 一种电解铜箔用添加剂及制备双光电池用电解铜箔的生产工艺
KR20180040754A (ko) * 2016-10-12 2018-04-23 케이씨에프테크놀로지스 주식회사 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
CN106521564A (zh) * 2016-10-27 2017-03-22 建滔（连州）铜箔有限公司 一种用于生产低轮廓电解铜箔的复合添加剂及其沉积工艺
KR101733410B1 (ko) * 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 저온 물성이 우수한 이차전지용 전해동박 및 그의 제조방법
KR20180083515A (ko) * 2017-01-13 2018-07-23 케이씨에프테크놀로지스 주식회사 울음 불량이 실질적으로 없는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
WO2018207788A1 (ja) 2017-05-09 2018-11-15 Ｊｘ金属株式会社 電解銅箔及びその製造方法、銅張積層板、プリント配線板及びその製造方法、並びに電子機器及びその製造方法
CN111910223B (zh) * 2020-08-24 2022-04-22 九江德福科技股份有限公司 适用于hdi板的电解铜箔用添加剂及电解铜箔生产工艺
CN112111761B (zh) * 2020-09-07 2021-09-21 浙江大学 一种高延伸率电解铜箔的电解液及其应用
CN112839436B (zh) * 2020-12-30 2022-08-05 广东嘉元科技股份有限公司 一种高频高速印制电路板用电解铜箔及其制备方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103348041A (zh) * 2011-07-29 2013-10-09 古河电气工业株式会社 电解铜合金箔、其制备方法、制备中所用的电解液、使用该电解铜合金箔的二次电池用负极集电体、二次电池及其电极
CN112030199A (zh) * 2020-08-27 2020-12-04 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液

Also Published As

Publication number Publication date
CN1500915A (zh) 2004-06-02
CA2448892A1 (en) 2004-05-14
KR20030036415A (ko) 2003-05-09
JP2004162172A (ja) 2004-06-10
US20040104117A1 (en) 2004-06-03
TW200407465A (en) 2004-05-16
TWI245082B (en) 2005-12-11
KR100389061B1 (ko) 2003-06-25

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