CA2448892A1 - Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same - Google Patents
Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same Download PDFInfo
- Publication number
- CA2448892A1 CA2448892A1 CA002448892A CA2448892A CA2448892A1 CA 2448892 A1 CA2448892 A1 CA 2448892A1 CA 002448892 A CA002448892 A CA 002448892A CA 2448892 A CA2448892 A CA 2448892A CA 2448892 A1 CA2448892 A1 CA 2448892A1
- Authority
- CA
- Canada
- Prior art keywords
- copper foil
- electrolyte solution
- electrolytic copper
- thioalkan
- sulfonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 104
- 239000011889 copper foil Substances 0.000 title claims abstract description 97
- 239000008151 electrolyte solution Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- -1 disulfur compound Chemical class 0.000 claims abstract description 24
- 239000004094 surface-active agent Substances 0.000 claims abstract description 22
- 150000003464 sulfur compounds Chemical class 0.000 claims abstract description 20
- 108010010803 Gelatin Proteins 0.000 claims abstract description 12
- 229920000159 gelatin Polymers 0.000 claims abstract description 12
- 239000008273 gelatin Substances 0.000 claims abstract description 12
- 235000019322 gelatine Nutrition 0.000 claims abstract description 12
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 12
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 9
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 8
- 150000003460 sulfonic acids Chemical class 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 60
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- 239000000654 additive Substances 0.000 claims description 10
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 9
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 9
- LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 150000003585 thioureas Chemical class 0.000 claims description 7
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 8
- 238000005498 polishing Methods 0.000 abstract description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 17
- 238000004381 surface treatment Methods 0.000 description 13
- 230000003746 surface roughness Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000002202 Polyethylene glycol Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910001431 copper ion Inorganic materials 0.000 description 7
- 229920001281 polyalkylene Polymers 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 159000000000 sodium salts Chemical class 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 229910000457 iridium oxide Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 101150114843 Mgll gene Proteins 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- MZGNSEAPZQGJRB-UHFFFAOYSA-N dimethyldithiocarbamic acid Chemical compound CN(C)C(S)=S MZGNSEAPZQGJRB-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0635—In radial cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20020070802 | 2002-11-14 | ||
| KR2002-70802 | 2002-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2448892A1 true CA2448892A1 (en) | 2004-05-14 |
Family
ID=29578347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002448892A Abandoned CA2448892A1 (en) | 2002-11-14 | 2003-11-12 | Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20040104117A1 (ko) |
| JP (1) | JP2004162172A (ko) |
| KR (1) | KR100389061B1 (ko) |
| CN (1) | CN1263899C (ko) |
| CA (1) | CA2448892A1 (ko) |
| TW (1) | TWI245082B (ko) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100553840B1 (ko) * | 2003-05-29 | 2006-02-24 | 일진소재산업주식회사 | 인쇄회로기판용 동박의 제조 방법 |
| KR100729061B1 (ko) * | 2003-07-29 | 2007-06-14 | 닛코킨조쿠 가부시키가이샤 | 특정골격을 갖는 디알킬아미노기 함유 중합체 및 유기유황화합물을 첨가제로서 포함하는 구리전해액 및 이것에 의해제조되는 전해구리박 |
| JP4583149B2 (ja) * | 2004-12-01 | 2010-11-17 | 三井金属鉱業株式会社 | 電解銅箔及びその製造方法 |
| KR100704685B1 (ko) * | 2005-03-26 | 2007-04-06 | 한국기계연구원 | 메쉬형 회전 음극드럼 도금법에 의한 연속 금속메쉬 제조장치 |
| US8722199B2 (en) | 2005-03-31 | 2014-05-13 | Mitsui Mining & Smelting Co., Ltd. | Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil |
| TW200718347A (en) * | 2005-07-14 | 2007-05-01 | Mitsui Mining & Smelting Co | Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
| US7575666B2 (en) * | 2006-04-05 | 2009-08-18 | James Watkowski | Process for electrolytically plating copper |
| KR101086931B1 (ko) | 2006-10-03 | 2011-11-29 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 황산 산성 동전해액의 제조 방법 및 그 제조 방법을 이용하여 제조한 황산 산성 동전해액, 그리고 전해석출 동피막 |
| JP4954686B2 (ja) * | 2006-11-29 | 2012-06-20 | 福田金属箔粉工業株式会社 | 電解銅箔とその製造方法 |
| US20080142249A1 (en) * | 2006-12-13 | 2008-06-19 | International Business Machines Corporation | Selective surface roughness for high speed signaling |
| US20100084275A1 (en) * | 2007-03-15 | 2010-04-08 | Mikio Hanafusa | Copper electrolytic solution and two-layer flexible substrate obtained using the same |
| JP5752301B2 (ja) * | 2007-10-31 | 2015-07-22 | 三井金属鉱業株式会社 | 電解銅箔及びその電解銅箔の製造方法 |
| TWI410529B (zh) * | 2008-12-16 | 2013-10-01 | Ind Tech Res Inst | 電解液及利用此電解液製造銅箔之方法 |
| KR101298999B1 (ko) * | 2009-09-01 | 2013-08-23 | 일진머티리얼즈 주식회사 | 미세회로 형성을 위한 임베디드용 동박 |
| KR101386093B1 (ko) * | 2010-04-14 | 2014-04-24 | 일진머티리얼즈 주식회사 | 전해동박 제조용 구리전해액, 전해동박의 제조방법 및 전해동박 |
| JP5352542B2 (ja) | 2010-07-15 | 2013-11-27 | エル エス エムトロン リミテッド | リチウム二次電池の集電体用銅箔 |
| JP5771392B2 (ja) * | 2010-12-28 | 2015-08-26 | 日本電解株式会社 | 電解銅箔およびその製造方法 |
| JP5379928B2 (ja) * | 2011-06-30 | 2013-12-25 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池 |
| WO2013018773A1 (ja) | 2011-07-29 | 2013-02-07 | 古河電気工業株式会社 | 電解銅合金箔、その製造方法、それの製造に用いる電解液、それを用いた二次電池用負極集電体、二次電池及びその電極 |
| EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
| WO2014119582A1 (ja) * | 2013-01-29 | 2014-08-07 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を用いたリチウムイオン二次電池 |
| CN103074657B (zh) * | 2013-02-26 | 2015-07-29 | 灵宝华鑫铜箔有限责任公司 | 一种电解铜箔用添加剂及7μm双光锂离子电池用电解铜箔生产工艺 |
| CN104805478A (zh) * | 2014-01-29 | 2015-07-29 | 金居开发铜箔股份有限公司 | 负极集电体用电解铜箔及其制造方法 |
| KR101897474B1 (ko) | 2015-06-26 | 2018-09-12 | 케이씨에프테크놀로지스 주식회사 | 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지 |
| JP6346244B2 (ja) * | 2015-11-10 | 2018-06-20 | Ｊｘ金属株式会社 | 電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法 |
| CN105543907A (zh) * | 2015-12-09 | 2016-05-04 | 深圳市正天伟科技有限公司 | 一种耐高电流密度电镀铜添加剂及其制备方法 |
| CN105887144B (zh) * | 2016-06-21 | 2018-09-21 | 广东光华科技股份有限公司 | 电镀铜镀液及其电镀铜工艺 |
| US10644320B2 (en) | 2016-08-23 | 2020-05-05 | Kcf Technologies Co., Ltd. | Electrolytic copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same |
| CN106350836B (zh) * | 2016-08-29 | 2019-02-26 | 灵宝华鑫铜箔有限责任公司 | 一种电解铜箔用添加剂及制备双光电池用电解铜箔的生产工艺 |
| KR20180040754A (ko) * | 2016-10-12 | 2018-04-23 | 케이씨에프테크놀로지스 주식회사 | 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
| CN106521564A (zh) * | 2016-10-27 | 2017-03-22 | 建滔（连州）铜箔有限公司 | 一种用于生产低轮廓电解铜箔的复合添加剂及其沉积工艺 |
| KR101733410B1 (ko) * | 2016-11-11 | 2017-05-10 | 일진머티리얼즈 주식회사 | 저온 물성이 우수한 이차전지용 전해동박 및 그의 제조방법 |
| KR20180083515A (ko) * | 2017-01-13 | 2018-07-23 | 케이씨에프테크놀로지스 주식회사 | 울음 불량이 실질적으로 없는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
| JPWO2018207788A1 (ja) | 2017-05-09 | 2020-05-14 | Ｊｘ金属株式会社 | 電解銅箔及びその製造方法、銅張積層板、プリント配線板及びその製造方法、並びに電子機器及びその製造方法 |
| CN111910223B (zh) * | 2020-08-24 | 2022-04-22 | 九江德福科技股份有限公司 | 适用于hdi板的电解铜箔用添加剂及电解铜箔生产工艺 |
| CN112030199B (zh) * | 2020-08-27 | 2021-11-12 | 江苏艾森半导体材料股份有限公司 | 一种用于先进封装的高速电镀铜添加剂及电镀液 |
| CN112111761B (zh) * | 2020-09-07 | 2021-09-21 | 浙江大学 | 一种高延伸率电解铜箔的电解液及其应用 |
| CN112839436B (zh) * | 2020-12-30 | 2022-08-05 | 广东嘉元科技股份有限公司 | 一种高频高速印制电路板用电解铜箔及其制备方法 |
| CN112779569B (zh) * | 2020-12-30 | 2022-01-18 | 铜陵市华创新材料有限公司 | 一种改善锂离子电池用电解铜箔激光模切熔珠的方法 |
| KR102405236B1 (ko) | 2022-05-11 | 2022-06-07 | 고려아연 주식회사 | 전해 동박의 제조방법 |
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| JPS50104143A (ko) * | 1974-01-23 | 1975-08-16 | ||
| DE2746938A1 (de) * | 1977-10-17 | 1979-04-19 | Schering Ag | Saures galvanisches kupferbad |
| US4551212A (en) * | 1985-03-11 | 1985-11-05 | Rca Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| DE3836521C2 (de) * | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
| KR100275899B1 (ko) * | 1990-05-30 | 2000-12-15 | 마이클 에이. 센타니 | 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법 |
| US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
| JPH07316876A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
| JP3313277B2 (ja) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | ファインパターン用電解銅箔とその製造方法 |
| DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| JPH1036992A (ja) * | 1996-07-19 | 1998-02-10 | Japan Energy Corp | 電解銅箔及びその製造方法 |
| US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP3789107B2 (ja) * | 2002-07-23 | 2006-06-21 | 株式会社日鉱マテリアルズ | 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
| JP4115240B2 (ja) * | 2002-10-21 | 2008-07-09 | 日鉱金属株式会社 | 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
| US20060011488A1 (en) * | 2002-12-25 | 2006-01-19 | Masashi Kumagai | Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same |
-
2003
- 2003-03-31 KR KR10-2003-0020166A patent/KR100389061B1/ko not_active IP Right Cessation
- 2003-07-29 TW TW092120619A patent/TWI245082B/zh not_active IP Right Cessation
- 2003-08-08 JP JP2003206688A patent/JP2004162172A/ja active Pending
- 2003-09-03 CN CNB031565093A patent/CN1263899C/zh not_active Expired - Fee Related
- 2003-11-12 CA CA002448892A patent/CA2448892A1/en not_active Abandoned
- 2003-11-13 US US10/713,795 patent/US20040104117A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030036415A (ko) | 2003-05-09 |
| JP2004162172A (ja) | 2004-06-10 |
| CN1263899C (zh) | 2006-07-12 |
| KR100389061B1 (ko) | 2003-06-25 |
| TWI245082B (en) | 2005-12-11 |
| US20040104117A1 (en) | 2004-06-03 |
| TW200407465A (en) | 2004-05-16 |
| CN1500915A (zh) | 2004-06-02 |
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