CN1108910C - 热压缓冲垫橡胶及制造,热压缓冲垫和印刷电路板的制造 - Google Patents
热压缓冲垫橡胶及制造,热压缓冲垫和印刷电路板的制造 Download PDFInfo
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- CN1108910C CN1108910C CN99110779A CN99110779A CN1108910C CN 1108910 C CN1108910 C CN 1108910C CN 99110779 A CN99110779 A CN 99110779A CN 99110779 A CN99110779 A CN 99110779A CN 1108910 C CN1108910 C CN 1108910C
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- Prior art keywords
- rubber
- hot
- pressing buffer
- cushion pad
- pressing
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Abstract
当温度条件设定为热压的压制温度,和频率条件设定为相应于热压的一个压制周期的时间时,根据动态粘弹性测量橡胶的损耗角正切(tanδ)最大为0.04或更小.这样的橡胶可用作热压缓冲垫(3)。
Description
本发明涉及用于热压的缓冲垫、用于缓冲垫的橡胶及其制造方法。本发明还涉及使用缓冲垫的印刷电路板、IC卡、液晶显示板等,更好的挠性印刷电路板(FPC)、贴合多层线路板等的制造方法。
当印刷电路板通过热压成形时,使用的方法是,将需压制的部件放在加热的压板之间,在其上面施加预定的压力和热量。为使压力和热量能均匀地施加在压制部件的整个表面,可以将平的板型缓冲垫插在压制部件和加热平板之间来进行这样的压制。
一般使用硅橡胶或氟橡胶作为缓冲垫。
然而,硅橡胶存在的问题是橡胶所含硅氧烷产生低分子量气体和产生渗色,可能污染印刷电路板等压制部件。这样的污物在印刷电路板上使印刷特性变差,或印刷电路板与其它部件(如增强板)间的粘合力降低。随缓冲垫使用时间推移,会加剧这样的倾向。尤其当压制的部件是精密设备的部件时(例如,用于硬盘驱动器的挠性印刷电路板、或贴合多层线路板),这样的污染是明显的缺陷。而且硅橡胶的机械强度也不够。
日本专利公报7-12617(日本专利公开6-278153)公开了使用氟橡胶的缓冲垫例子。该公报公开的缓冲垫的组成示于表1的比较例1和2。
上述公报公开的缓冲垫使用氟橡胶时,改善了耐热性。另外,缓冲垫具有优良的缓冲性能、导热性、耐久性等。
当缓冲材料和表面不平整的压制部件(例如FPC)相互直接接触,或与插入的膜等接触时,存在的问题是不平整度会保留在缓冲垫表面.换句话说,缓冲垫的应变回复不够。
当热压涉及粘合剂的液态化-固化,尤其当上面所述缓冲垫在制造挠性印刷电路板(FPC)中用于以粘合剂连接基膜和表膜时,存在的问题是在作为压制部件的FPC中会保留空隙。
本发明解决了上述问题。本发明的目的是提供具有优良的应变回复、顺应性、压制部件中不产生任何空隙、不产生低分子量气体或渗色的热压缓冲垫,提供用于缓冲垫的橡胶及其制造方法,和使用缓冲垫制造印刷电路板的方法。
本发明人研究了用于热压缓冲垫的橡胶的应变回复,就热压的压制温度和压制周期间的关系、压制部件中粘合剂的流体性能等而论,发现当缓冲垫橡胶的tanδ在采用热压条件下为0.04或更小时,橡胶具有优良的应变回复。
根据本发明一个方面,当温度设定为热压的压制温度,频率设定为相应于一个热压压制周期的时间段时,由动态粘弹性测量橡胶的损耗角正切值(tanδ)为0.04或更小。上述热压的压制温度指一个压制周期中加热平板的最高温度。
当该橡胶用作热压的缓冲垫,热压表面不平整的压制部件(例如FPC)时,不平整性不会留在缓冲垫表面。因此,可以保持长时期的优良缓冲性能。
压制温度为150-300℃,相应于一个压制周期的时间段为1-2×104秒。
较好的温度条件为150-250℃,较好的频率条件为1-1×103秒。
这样条件下,在制造挠性印刷电路板中,可以较短的压制周期粘合基膜和表膜。因此,当使用其tanδ值最大为0.04的橡胶作为上述条件下的缓冲垫时,在制造挠性印刷电路板,粘合表膜步骤中显示缓冲材料优良的应变回复。
本发明第二方面的橡胶用于压制部件是通过热压用粘合剂液态化-固化来层压成整体时使用的缓冲垫,当频率条件设定为从粘合剂开始液态化至固化结束的时间周期时,通过动态粘弹性测量该橡胶的损耗角正切值(tanδ)为0.04或更小。
当使用此橡胶作为热压缓冲垫,热压通过粘合剂的液态化-固化来层压成整体的压制部件(例如FPC)时,粘合剂液态化时产生的不均匀压力会很快变得均匀。因此,可以有效地防止空隙的产生。
本文中粘合剂指通过液态化-固化的状态变化将两层连接在一起的粘合剂,以及通过其本身在液态化-固化后形成一层的粘合剂。这类粘合剂可以是热塑性材料或热固性材料。更具体而言,可以是热熔粘合剂或预浸渍料。
上述的压制温度一般为150-300℃,从粘合剂开始液态化至固化结束的时间周期一般为1-2×103秒。
根据JIS(日本工业标准)K6253,橡胶的肖氏硬度为A75或更低。
因此,由表2可知,可以使肖氏硬度小于现有技术的硬度,可改善顺应性。因此,由于和上述优良的应变回复一起的协同作用,当表面不平整或表面平面差的挠性印刷电路板与表膜粘合时,可有效地抑制表膜和基膜间空隙的产生。
本发明较好的橡胶主要由氟橡胶组成。
因此,可以提供具有优良耐热性、高机械强度和几乎没有混合物质渗出的缓冲垫。
较好的橡胶是含多醇硫化体系的氟橡胶组分、硫化剂、硫化促进剂和酸接受体的氟橡胶组合物。氟橡胶组分、硫化剂和硫化促进剂的总量至少为氟橡胶组合物总量的80%(体积)。
当使用多醇硫化体系的氟橡胶时,可以使缓冲垫的压缩永久变形更小,延长缓冲垫的寿命。当使用双酚AF作为多醇硫化剂时,能更有效地改善耐热性。
本发明第三方面的橡胶是含多醇硫化体系的氟橡胶组分、硫化剂、硫化促进剂和酸接受体的氟橡胶组合物。氟橡胶组分、硫化剂和硫化促进剂的总量至少为氟橡胶组合物总量的80%(体积)。
本发明人发现,这样的组合物可以提供tanδ值为0.04或更小的橡胶。当使用这类橡胶作为用于热压的缓冲垫时,可获得具有上述优良应变回复的缓冲垫。
根据本发明第四方面的热压缓冲垫包含当温度条件设定为热压的压制温度,频率条件设定为相应于一个热压压制周期的时间时,tanδ值为0.04或更小的橡胶。
因此,即使缓冲垫反复用于热压时,仍具有优良的应变回复,并能长期保持优良的缓冲性能。
根据本发明第五方面的热压缓冲材料可用于通过热压用粘合剂液态化-固化来压制的层压或整体的部件,这类材料包含当温度条件设定为热压的压制温度,频率条件设定为从粘合剂开始液态化至固化结束的时间时由动态粘弹性测量的损耗角正切值(tanδ)为0.04或更小的橡胶。
因此,通过粘合剂液态化-固化来层压成整体的压制部件(例如FPC)使用缓冲垫进行热压时,可以很快使粘合剂变成液体时产生的不均匀压力均匀化。因此,能有效抑制空隙的产生。
根据本发明的第六方面,热压缓冲垫是含多醇硫化体系的氟橡胶组分、硫化剂、硫化促进剂和酸接受体的氟橡胶组合物。氟橡胶组分、硫化剂和硫化促进剂的总量至少为氟橡胶组合物总量的80%(体积)。
当热压缓冲垫是上述组合物橡胶时,可改善应变回复。
较好的应使橡胶表面经防粘处理。
由上述橡胶成形的一层或多层,以及选自织物、无纺织物、纸、膜、箔、片或板的至少一层可以层压成整体。织物、元纺织物、纸、膜、箔、片和板较好的是单一材料或复合材料,选自合成树脂、天然橡胶、合成橡胶、金属和陶瓷。
缓冲垫的至少一表层由橡胶形成为宜,更好的应使橡胶表面经防粘处理。
用于本发明热压缓冲垫的橡胶的制造方法包括下列步骤。捏合原料橡胶、硫化剂、硫化促进剂、酸接受体和增塑剂,制得捏合的混炼胶。将捏合的混炼胶加工成片,形成未硫化的橡胶片。未硫化的橡胶片经第一次固化形成硫化的橡胶片。使硫化的橡胶片在不低于增塑剂沸点温度下第二次固化,以挥发增塑剂。
通过第二次固化完成硫化,过量的硫化剂被溶解,硫化期间产生的气体散逸,消除残余应变。另外,提高应变回复。而且,由于通过第二次固化挥发了增塑剂,可以防止使用缓冲垫期间增塑剂的渗出。
通过第二次固化,tanδ值宜设定为0.04或更小。
根据本发明第七方面的制造印刷电路板的方法可用于制造印刷电路板,通过将印刷电路板材料和缓冲垫叠加和放人加热平板之间加热和压制,缓冲垫含有当温度条件设定为热压压制温度,频率条件设定为相应于一个热压周期的时间时的tanδ值为0.04或更小的橡胶。
根据本发明第八方面的制造印刷电路板方法可用于制造印刷电路板,其中,层叠结构的印刷电路板材料和缓冲垫叠加并放人加热的平板之间,印刷电路板材料是通过热压用粘合剂的液态化-固化来层压成整体的,缓冲垫含有在温度条件设定为热压压制温度,频率条件设定为从粘合剂开始液态化至固化结束的时间下由动态粘弹性测量的tanδ值为0.04或更小的橡胶。
根据本发明第九方面的印刷电路板制造方法使用了下列组合物的缓冲垫。缓冲垫含有多醇硫化体系的氟橡胶组分、硫化剂、硫化促进剂和酸接受体的的氟橡胶组合物,氟橡胶组分、硫化剂、硫化促进剂的总量至少为氟橡胶组合物的总量80%(体积)。
通过这样的印刷电路板制造方法,可以生产没有空隙或缩皱,具有高光滑度,不易污染的高质量印刷电路板。
印刷电路板的表面上可以有不规则的图案。
例如,印刷电路板可以是挠性印刷电路板或贴合多层线路板。
包含本发明的橡胶的缓冲垫能有效用于热压印刷电路板。
由下面结合附图的详细描述,能更好地理解本发明的前述目的和其它目的、特征、方面和优点。
图1为表示本发明实施例和比较例1和2的tanδ值曲线图。
图2为表示本发明实施例的频率与tanδ的关系曲线图。
图3为表示比较例1的频率与tanδ的关系曲线图。
图4为表示比较例2的频率与tanδ的关系曲线图。
图5说明使用本发明缓冲垫的热压方法。
图6A-6L是表示缓冲垫结构的具体例子的横截面图。
下面将详细描述本发明的实施例。
表1列出了本发明实施例和比较例1和2(相应于日本专利公报7-12617的样品1和2)的混合比例。
表1
上面:重量份
下面:(硫化后%(体积))
组成 | 比重 | 实施例 | 比较例1 | 比较例2 | |
氟橡胶 | 有多醇硫化剂 (1) | 1.81 | 100(86.6%) | ||
有多醇硫化剂 (2) | 1.81 | 100(45.3%) | 100(67.9%) | ||
酸接受体 | 高活性MgO (3) | 3.5 | 7(3.1%) | ||
MgO (4) | 3.4 | 12.5(3.0%) | 15.0(5.4%) | ||
ZnO | 5.5 | 25.0(5.6%) | |||
填料 | 低活性MgO (5) | 3.5 | 15(6.7%) | ||
空心玻璃珠 (6) | 1.1 | 55.0(41.0%) | 15.0(16.8%) | ||
增塑剂 | 己二酸二辛酯 | 0.95 | 1(0%) | ||
丙烯酸酯 (7) | 1.12 | 6.8(5.0%) | |||
丙烯酸酯 (8) | 1.11 | 5.6(4.1%) | |||
偶合剂 | 钛酸乙烯酯类 (9) | 1 | 0.25(0.4%) | ||
硫化剂 | 有机过氧化物 (10) | 1 | 0.2(0.2%) | ||
硫化促进剂 | Ca(OH)2 | 2.2 | 4(2.9%) | 3.3(1.2%) | 5.0(2.8%) |
润滑剂 | 硬脂酸 | 0.84 | 0.8(1.2%) | ||
颜料 | 红色氧化物(11) | 4.6 | 1(0.3%) | ||
0.2(0.2%) | 0.3(0.4%) |
(1)DAI-EL G-716(有多醇硫化剂):Daikin Industries.Ltd.
(2)DAI-EL G-755C(有多醇硫化剂):Daikin Industries.Ltd.
(3)MICROMAG 3-150:协和化学工业有限公司
(4)MAGSARAT 30:协和化学工业有限公司
(5)PYROKISUMA 5301:协和化学工业有限公司
(6)HSC110A:东芝-Ballotini Co.Ltd.
(7)2,2’-二(4-甲基丙烯酰氧二乙氧基苯基)丙烷
(8)苯氧基二甘醇丙烯酸酯
(9)PLENACT KR-TTS:味素工业公司
(10)VUL-CUP 40KE:HERCULES
(11)epsilon红LB-ITO34:住化颜料有限公司
将各材料按表1的混合比例捏合,制得氟橡胶组合物,使用双辊制备本发明实施例和比较例1和2的未硫化氟橡胶片。之后,在模具中进行170℃30分钟的压制硫化(第一次固化),制得2毫米厚的硫化氟橡胶片。本发明实施例的硫化橡胶片在烘箱内进行230℃ 24小时的第二次固化。第二次固化应该在不低于增塑剂沸点的温度下进行。因此,可以挥发增塑剂,这样当本发明的橡胶片用作用于热压的缓冲垫时,可以防止增塑剂的渗出。
当要形成层叠结构的橡胶片时,将未硫化橡胶片叠放并通过第一次固化相互粘合。第一次固化的条件为160-200℃,固化5-120分钟,压力为1-20千克/厘米2。
第二次固化宜在不低于上述增塑剂沸点的温度下,并且不低于热压所采用的温度下进行。如果第二次固化温度太低,不能达到第二次固化的效果,如果温度过高,橡胶将老化变质。因此,第二次固化的温度优选在200-260℃。
第二次固化时间至少为1小时(4-30小时为宜)。如果时间太短,不能达到第二次固化的效果。如果时间过长,并不能期望达到更好的效果,同时有可能使橡胶老化变质,另外也浪费时间。
第二次固化时,不施加压力。而且,第二次固化较好的应该在至少一个橡胶表面保持渗透性状态下进行。这将有利于有效地挥发增塑剂。
渗透性状态指当橡胶表面没有任何叠层,或在其表面层压了可渗透材料,如织物、无纺织物或纸时的状态。
上述橡胶片根据动态粘弹性测量的损耗角正切(tanδ)值可通过下面方法和测量设备进行测量。使用粘弹谱仪(由岩本制作所制造,VES-FIII型),通过强制振动非共振法(相差法)测定该值。结果示于图1-图4。
图1显示tanδ总曲线(150℃)比较结果。该总曲线是根据已知的时间-温度转换规则,对1-1×105秒周期范围绘制成的。
如图1所示,本发明橡胶片的tanδ值为0.04或更小,而比较例1和2的tanδ值大于0.04。由于可以使tanδ值小于现有技术的值,应变回复可以比现有技术提高。具有这样性能的橡胶片作为热压不平整表面或异形表面产品的缓冲垫很有效。对tanδ值以接近0为佳。
参考图2-4,描述了本发明实施方案和比较例1和2,在150℃、200℃和250℃时tanδ与频率的关系。图2-4中,周期设定在1-2×103秒范围内。该周期是根据压制部件中的粘合剂从开始液态化至固化结束的时间。该周期范围中热压的典型例子包括在制造挠性印刷电路板中粘合表膜的步骤。
如图2所示,任何温度下,本发明实施方案橡胶片的tanδ值为0.04或更小。与之对照,如图3和4中所示,比较例的tanδ值,在任何温度下都大于0.04。
由这一结果可以理解本发明的橡胶片在相应于压制部件中的粘合剂开始液态化至固化结束时间周期(1-2×103秒)具有优良的弹性。因此,当本发明的橡胶片用于热压时的缓冲垫时,压制部件中粘合剂变成液态时产生的不均匀内应力可以很快变得均匀一致,由此可以有效地防止空隙的产生。
参考表2,根据JIS(日本工业标准)K6253比较了本发明实施方案和比较例的肖氏硬度。
表2
实施方案 | 比较例1 | 比较例2 | |
肖氏硬度(JISK6253) | A60 | A87 | A78 |
由表2可知,本发明实施方案橡胶片的肖氏硬度小于比较例1和2的硬度。由于使肖氏硬度较小,可以改善对异形的顺应性。另外,由于与优良的应变回复一起的协同作用,如图2-4所示,当热压不平整或起伏表面的产品时可以有效抑制空隙的产生。
由表2的结果,可以认为A75或更小的肖氏硬度能有效改善对异形或平面差的顺应性,至少与比较例相比。较好的肖氏硬度最大为A70,最大为A65更好。本文中,肖氏硬度必须至少为A10。
本发明橡胶的形状可以是实心或发泡的。
下面将详细描述图1所示的实施方案的组合物。对以氟橡胶作为主要组分,可以使用任何多胺硫化体系、多醇硫化体系和有机过氧化物硫化体系。使用氟橡胶作为主要组分提供了优良的耐热性、高强度,并抑制了混合物质的渗出。
具体而言,当使用多醇体系的氟橡胶时,降低了压缩永久变形,因此橡胶具有更长的寿命。对多醇硫化剂,可以使用下面化学通式1(a)-(d)表示的四种类型。其中,(a)所示的双酚AF具有最高的耐热性。
通式1
如表1所示,氟橡胶、硫化剂和硫化促进剂的总量较好的应该至少为氟橡胶组合物总量的80%(体积)。其总量宜至少为85%(体积)。可以获得能够降低tan(δ)值的这类组合物,和具有优良应变回复的橡胶。
下面描述硫化促进剂。较好的硫化促进剂包括由化学通式R4P+X-表示的有机磷鎓盐和由R4N+X-表示的季铵盐。
对增塑剂,较好的应该使用较低沸点的增塑剂,即沸点不高于在热压压制中所用的温度。增塑剂的用量对每100重量份橡胶而言,为0.5-5重量份(1-2重量份为宜)。如果该用量小于0.5重量份,改善加工性的作用降低,该用量过高时,增塑剂挥发后的尺寸稳定性降低。
增塑剂可包括邻苯二甲酸二正辛酯、邻苯二甲酸二异辛酯、邻苯二甲酸二异壬酯、间苯二甲酸二甲酯、己二酸二(2-乙基己基)酯、己二酸二异癸酯、己二酸二(正辛基,正癸基)酯、己二酸苄基辛酯、己二酸二丁基二甘醇酯、己二酸二正烷基酯、己二酸二正烷基(C6,8,10)酯、壬二酸二(2-乙基己基)酯、壬二酸二正己酯、十二烷双酸二2-乙基己酯、马来酸二甲酯、马来酸二乙酯、马来酸二(2-乙基己基)酯、富马酸二(2-乙基己基)酯、柠檬酸三乙酯、柠檬酸三正丁酯、柠檬酸乙酰基三乙酯、衣康酸单甲酯、衣康酸二甲酯、油酸丁酯、methyl acetyl recinoleate和硬脂酸正丁酯。
当上述本发明的橡胶用作热压时的缓冲垫时,较好的应使橡胶表面经防粘处理。优选不会降低橡胶性能的防粘处理。具体而言,在橡胶表面粘合合成树脂膜、橡胶表面的均匀粗糙化、紫外线辐照、电子射线辐照等都可以选择。
较好的合成树脂膜包括由氟树脂形成的膜,如聚四氟乙烯(PTFE)、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)或四氟乙烯-六氟丙烯共聚物(FEP)和聚酰亚胺。
较好的合成树脂膜厚度应最大为200微米。更好的为10-50微米。
合成树脂膜较好的应该将其表面粘合到事先经电晕放电、酸等处理的橡胶上。这样可以提高合成树脂膜与橡胶的粘合力,而不必使用专门的粘合剂,有可能在第一次固化期间将合成树脂膜与橡胶粘合在一起。未用粘合剂时,得到对异形或凹凸物有优良顺应性的缓冲垫,提高缓冲垫表面上的橡胶的弹性。
可以采用在将与橡胶粘合的表面事先施用了粘合剂的合成树脂膜。这种情况下,可以在第二次固化橡胶后粘合合成树脂膜。因此,橡胶的第二次固化时可以未粘合合成树脂膜,这样可以提高第二次固化的效率。
为能使橡胶表面均匀粗糙化,可以采用从转移材料,如模具、金属板、或有粗糙表面的织物等转移的方法。可以进行物理或化学的处理。当橡胶表面将被处理成粗糙时,表面粗糙度按照JISB0601定义的算术平均粗糙度(Ra),较好的应该在5-100微米范围。
作为用于热压的缓冲垫,由上述橡胶形成的一层或多层,以及由至少一种选自织物、无纺织物、纸、膜、箔、片或板形成的一层或多层可以组合、层压成整体。织物、元纺织物、纸、膜、箔、片和板较好的是由单一材料或复合材料形成,这些材料选自合成树脂、天然橡胶、合成橡胶、金属和陶瓷。
图6A-6L所示为缓冲垫3结构的具体例子。参考图6A,使用单一的氟橡胶7作为缓冲垫3,而图6B-6L所示,氟橡胶7与玻璃布8、氟树脂膜9、芳族聚酰胺无纺织物10、表层11(在涂布氟橡胶,再涂布聚酰亚胺树脂的背面有玻璃布)、芳族聚酰胺布12、有涂布了氟树脂的玻璃布层13、聚酰亚胺膜14或铝片15层压成整体。
上述氟橡胶7的厚度,例如可以是0.5毫米。氟树脂膜9的厚度,例如可以是25微米。
就表面有不规则图形的压制部件而言,层压体的至少一个表面宜由橡胶形成。表面橡胶层的厚度,例如可以是0.1-3.0毫米较好的为0.3-1.0毫米。如果表面橡胶层的厚度太小,很难形成均匀的片。当表面橡胶层厚度太大时,由压制压力引起的橡胶形变量增加,导致橡胶的断裂,由此降低耐久性。因此,通过将表面橡胶层厚度设定在上述范围内,可以获得易于形成均匀片并具有高的耐久性的表面橡胶层。
当提供了表面橡胶层时,较好的表面橡胶层的表面应经过上述防粘处理。图6所示的氟树脂膜9是防粘处理的一个例子。
下面将描述本发明的橡胶用作热压时使用的缓冲垫时的热压方法的一个例子。
如图5所示,由不锈钢制成的镜面板4,4’、缓冲垫3,3’、挠性印刷电路板1和覆盖层膜2排列在加热的平板6,6’之间,挠性印刷电路板1和覆盖层膜2(印刷电路板材料)被加热和压制。
本文中,当本发明的橡胶用作缓冲垫3,3’时,如上面所述,可以改善缓冲垫3,3’的应变回复,及其对异形或凹突物的顺应性。因此,缓冲垫3,3’能长时期保持优良的缓冲性能,有效地防止在挠性印刷电路板中产生空隙。还可以避免压制期间产生气体、分解分子的挥发和渗色。还可以防止在挠性印刷电路板和周围设备的应变。而且,当使用主要由氟橡胶组成的橡胶时,可获得具有优良耐热性和高强度的缓冲垫3,3’。因此,可以提高缓冲垫3,3’的耐久性。
使用本发明橡胶的缓冲垫3,3’,除了可用于上面所述的挠性印刷电路板外,可以广泛应用于热压贴合多层线路板、其它印刷电路板和其它任何热压法。
尽管已经详细描述和举例说明了本发明,应理解这些仅作为说明和举例,不构成限制,本发明的精神和范围仅受所附的权利要求书的限制。
Claims (8)
1.一种用于热压缓冲垫(3)的橡胶,所述橡胶是含多醇硫化体系的氟橡胶组分、硫化剂、硫化促进剂和酸接受体的氟橡胶组合物,所述氟橡胶组分、硫化剂和硫化促进剂的总量至少为所述氟橡胶组合物总量的85%体积,
当温度条件设定为150-250℃,和频率条件设定为1-1×103秒,根据动态粘弹性测量,该橡胶的损耗角正切值(tanδ)最大为0.04。
2.如权利要求1所述的用于热压缓冲垫(3)的橡胶,其特征在于,所述橡胶按照JISK6253的肖氏硬度最大为A75。
3.一种热压缓冲垫(3),它包含如权利要求1所述的用于热压缓冲垫(3)的橡胶。
4.如权利要求3所述的热压缓冲垫(3),其特征在于,所述橡胶表面经过防粘处理。
5.如权利要求3所述的热压缓冲垫(3),其特征在于,所述热压缓冲垫(3)具有至少一层由所述橡胶形成的层(7)和至少一层(8),(8)由至少一种选自织物、无纺织物、纸、膜、箔、片或板层压成整体而形成。
6.如权利要求5所述的热压缓冲垫(3),其特征在于,所述的织物、无纺织物、纸、膜、箔、片和板是单一材料或复合材料,这些材料选自合成树脂、天然橡胶、合成橡胶、金属或陶瓷。
7.如权利要求5所述的热压缓冲垫(3),其特征在于,所述热压缓冲垫(3)至少一个表层由所述橡胶形成。
8.如权利要求7所述的热压缓冲垫(3),其特征在于,所述橡胶的表面经过了防粘处理。
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KR101486830B1 (ko) * | 2013-12-26 | 2015-01-28 | (주)에이앤티 | 열 프레스용 쿠션재 및 그 제조방법 |
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JP6992330B2 (ja) * | 2017-08-30 | 2022-01-13 | 住友ベークライト株式会社 | マイクロ流路チップの製造方法 |
CN108215040A (zh) * | 2017-12-11 | 2018-06-29 | 安徽银龙泵阀股份有限公司 | 一种陶瓷阀芯及其制作工艺 |
FR3084280B1 (fr) | 2018-07-28 | 2021-03-05 | Kairos | Panneau composite bio-source presentant une surface de rugosite controlee et precedes de fabrication associes |
CN110370520A (zh) * | 2019-06-05 | 2019-10-25 | 江苏明珠硅橡胶材料有限公司 | 一种超高分子量聚乙烯板生产方法 |
US20230173795A1 (en) * | 2020-05-14 | 2023-06-08 | Nitto Denko Corporation | Heat-resistant cushioning sheet and thermocompression treatment method |
TWI761054B (zh) * | 2021-01-29 | 2022-04-11 | 厚生股份有限公司 | 緩衝墊的製造方法及緩衝墊 |
DE202021003665U1 (de) | 2021-12-02 | 2022-12-07 | Hueck Rheinische Gmbh | Druckausgleichskörper, insbesondere Presspolster zur Ausrüstung von hydraulischen Ein- und Mehretagenheiz- und Kühlpressen |
CN115819902B (zh) * | 2022-12-23 | 2023-08-29 | 广东硕成科技股份有限公司 | 一种高阻热氟橡胶材料及其应用 |
CN116120681B (zh) * | 2023-03-28 | 2023-12-15 | 广东硕成科技股份有限公司 | 一种用于热压缓冲领域的阻热氟橡胶材料 |
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1999
- 1999-08-02 TW TW088113144A patent/TW524739B/zh not_active IP Right Cessation
- 1999-08-04 KR KR10-1999-0031944A patent/KR100368189B1/ko not_active IP Right Cessation
- 1999-08-05 CN CNB031060382A patent/CN1277876C/zh not_active Expired - Fee Related
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US5755045A (en) * | 1994-07-29 | 1998-05-26 | Bridgestone Corporation | Footwear sole member |
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DE69917154D1 (de) | 2004-06-17 |
EP0978528B1 (en) | 2004-05-12 |
KR100355261B1 (ko) | 2002-10-11 |
CN1439672A (zh) | 2003-09-03 |
DE69917154T2 (de) | 2005-05-04 |
TW524739B (en) | 2003-03-21 |
KR20010100030A (ko) | 2001-11-09 |
US6391460B1 (en) | 2002-05-21 |
JP3461291B2 (ja) | 2003-10-27 |
KR100368189B1 (ko) | 2003-01-24 |
EP0978528A1 (en) | 2000-02-09 |
CN1277876C (zh) | 2006-10-04 |
JP2000052369A (ja) | 2000-02-22 |
KR20000017067A (ko) | 2000-03-25 |
CN1251801A (zh) | 2000-05-03 |
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