CN108695339B - 三维半导体装置及其制造方法 - Google Patents

三维半导体装置及其制造方法 Download PDF

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Publication number
CN108695339B
CN108695339B CN201810311074.5A CN201810311074A CN108695339B CN 108695339 B CN108695339 B CN 108695339B CN 201810311074 A CN201810311074 A CN 201810311074A CN 108695339 B CN108695339 B CN 108695339B
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semiconductor pattern
vertical
horizontal
sidewall
pattern
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CN108695339A (zh
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李昭贤
沈善一
李载德
张在薰
韩智勋
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0413—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having charge-trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/693—Vertical IGFETs having charge trapping gate insulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H10D84/0133—Manufacturing common source or drain regions between multiple IGFETs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
CN201810311074.5A 2017-04-10 2018-04-09 三维半导体装置及其制造方法 Active CN108695339B (zh)

Applications Claiming Priority (2)

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KR10-2017-0046229 2017-04-10
KR1020170046229A KR102332346B1 (ko) 2017-04-10 2017-04-10 3차원 반도체 메모리 장치 및 그의 제조 방법

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CN108695339A CN108695339A (zh) 2018-10-23
CN108695339B true CN108695339B (zh) 2023-09-05

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US (1) US10396088B2 (enExample)
JP (1) JP7207859B2 (enExample)
KR (1) KR102332346B1 (enExample)
CN (1) CN108695339B (enExample)

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CN110062958B (zh) 2019-03-04 2020-05-26 长江存储科技有限责任公司 用于形成三维存储器件的方法
WO2020177048A1 (en) 2019-03-04 2020-09-10 Yangtze Memory Technologies Co., Ltd. Three-dimensional memory devices
KR102778239B1 (ko) * 2019-04-25 2025-03-10 삼성전자주식회사 수직형 반도체 소자
EP4521880A3 (en) 2019-06-27 2025-05-14 Yangtze Memory Technologies Co., Ltd. Novel 3d nand memory device and method of forming the same
KR102728797B1 (ko) * 2019-07-31 2024-11-11 삼성전자주식회사 반도체 장치 및 이의 동작 방법
KR102801211B1 (ko) * 2019-10-29 2025-04-29 삼성전자주식회사 돌출한 비아 라이너 층을 갖는 관통 비아 구조를 포함하는 3차원 반도체 소자 및 그 형성 방법
CN111223872B (zh) * 2020-01-17 2023-04-07 长江存储科技有限责任公司 一种3d nand存储器及其制造方法
CN111771281B (zh) * 2020-01-17 2021-07-20 长江存储科技有限责任公司 三维存储器件及其制作方法
KR102815720B1 (ko) * 2020-01-23 2025-06-02 삼성전자주식회사 폴리 실리콘과 메탈을 포함하는 워드 라인을 갖는 3차원 메모리 소자 및 이의 제조 방법
TWI743836B (zh) * 2020-04-30 2021-10-21 大陸商長江存儲科技有限責任公司 立體記憶體元件及其製作方法
KR102752667B1 (ko) 2020-05-07 2025-01-10 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 제조 방법
KR20210155266A (ko) * 2020-06-15 2021-12-22 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 제조 방법
CN111785730B (zh) * 2020-06-18 2021-06-08 长江存储科技有限责任公司 三维存储器及制备方法、电子设备
KR20230123355A (ko) * 2022-02-16 2023-08-23 삼성전자주식회사 웨이퍼 구조체 및 반도체 소자

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Also Published As

Publication number Publication date
KR102332346B1 (ko) 2021-12-01
CN108695339A (zh) 2018-10-23
US10396088B2 (en) 2019-08-27
JP7207859B2 (ja) 2023-01-18
JP2018182320A (ja) 2018-11-15
KR20180114566A (ko) 2018-10-19
US20180294274A1 (en) 2018-10-11

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