CN106796399B - 正型感光性树脂组合物、图案固化膜的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件 - Google Patents
正型感光性树脂组合物、图案固化膜的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件 Download PDFInfo
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- CN106796399B CN106796399B CN201580053869.5A CN201580053869A CN106796399B CN 106796399 B CN106796399 B CN 106796399B CN 201580053869 A CN201580053869 A CN 201580053869A CN 106796399 B CN106796399 B CN 106796399B
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- resin composition
- photosensitive resin
- film
- positive photosensitive
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2014-204005 | 2014-10-02 | ||
JP2014204005 | 2014-10-02 | ||
JPPCT/JP2015/052382 | 2015-01-28 | ||
PCT/JP2015/052382 WO2016121035A1 (ja) | 2015-01-28 | 2015-01-28 | ポジ型感光性樹脂組成物、パターン硬化膜の製造方法、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
PCT/JP2015/005021 WO2016051809A1 (ja) | 2014-10-02 | 2015-10-01 | ポジ型感光性樹脂組成物、パターン硬化膜の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
Publications (2)
Publication Number | Publication Date |
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CN106796399A CN106796399A (zh) | 2017-05-31 |
CN106796399B true CN106796399B (zh) | 2021-01-22 |
Family
ID=55629871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580053869.5A Active CN106796399B (zh) | 2014-10-02 | 2015-10-01 | 正型感光性树脂组合物、图案固化膜的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件 |
Country Status (5)
Country | Link |
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JP (2) | JP6743701B2 (ja) |
KR (1) | KR102585279B1 (ja) |
CN (1) | CN106796399B (ja) |
TW (1) | TWI708994B (ja) |
WO (1) | WO2016051809A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6665646B2 (ja) * | 2016-04-08 | 2020-03-13 | 日立化成デュポンマイクロシステムズ株式会社 | パターン硬化膜の製造方法、電子部品の製造方法、及び当該パターン硬化膜の製造方法に用いるポジ型感光性樹脂組成物 |
KR102337564B1 (ko) * | 2018-09-28 | 2021-12-13 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007240555A (ja) * | 2006-03-03 | 2007-09-20 | Hitachi Chemical Dupont Microsystems Ltd | ポジ型感光性ポリアミドイミド樹脂組成物、パターンの製造方法及び電子部品 |
TW201321899A (zh) * | 2011-11-09 | 2013-06-01 | Jnc Corp | 正型感光性組成物 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2931297A1 (de) | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
US4927736A (en) | 1987-07-21 | 1990-05-22 | Hoechst Celanese Corporation | Hydroxy polyimides and high temperature positive photoresists therefrom |
JPH05181274A (ja) * | 1991-12-26 | 1993-07-23 | Nippon Steel Chem Co Ltd | ポリイミド系感光性樹脂 |
TWI255393B (en) * | 2000-03-21 | 2006-05-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern and process for producing printed wiring board |
US6969576B2 (en) * | 2001-11-30 | 2005-11-29 | Sandia National Laboratories | Photosensitive dissolution inhibitors and resists based on onium salt carboxylates |
JP3812654B2 (ja) * | 2002-01-23 | 2006-08-23 | Jsr株式会社 | ポジ型感光性絶縁樹脂組成物およびその硬化物 |
CN100457749C (zh) * | 2003-01-22 | 2009-02-04 | Jsr株式会社 | 锍盐化合物、辐射敏感性酸产生剂和正型辐射敏感性树脂组合物 |
KR100774672B1 (ko) * | 2004-05-07 | 2007-11-08 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및전자부품 |
JP4777644B2 (ja) * | 2004-12-24 | 2011-09-21 | Okiセミコンダクタ株式会社 | 半導体装置およびその製造方法 |
US7803510B2 (en) * | 2005-08-17 | 2010-09-28 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive polybenzoxazole precursor compositions |
JP2008015184A (ja) * | 2006-07-05 | 2008-01-24 | Sekisui Chem Co Ltd | ポジ型感光性組成物、パターン膜の製造方法及び半導体素子 |
US9519216B2 (en) * | 2008-02-04 | 2016-12-13 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive resin compositions |
JP5169446B2 (ja) | 2008-04-28 | 2013-03-27 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品 |
JP2010139931A (ja) * | 2008-12-15 | 2010-06-24 | Toyobo Co Ltd | ポジ型感光性樹脂組成物およびパターン形成方法 |
TWI397546B (zh) * | 2010-01-14 | 2013-06-01 | Chang Chun Plastics Co Ltd | 新穎水溶性聚醯亞胺樹脂、其製法及其用途 |
JP5806493B2 (ja) * | 2011-03-31 | 2015-11-10 | 太陽インキ製造株式会社 | ポジ型感光性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
JP2013256603A (ja) * | 2012-06-13 | 2013-12-26 | Hitachi Chemical Dupont Microsystems Ltd | 樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
JP2015022228A (ja) * | 2013-07-22 | 2015-02-02 | Jnc株式会社 | ポジ型感光性組成物 |
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2015
- 2015-10-01 WO PCT/JP2015/005021 patent/WO2016051809A1/ja active Application Filing
- 2015-10-01 CN CN201580053869.5A patent/CN106796399B/zh active Active
- 2015-10-01 JP JP2016551560A patent/JP6743701B2/ja active Active
- 2015-10-01 KR KR1020177008119A patent/KR102585279B1/ko active IP Right Grant
- 2015-10-02 TW TW104132468A patent/TWI708994B/zh active
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2020
- 2020-05-07 JP JP2020081736A patent/JP6919746B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007240555A (ja) * | 2006-03-03 | 2007-09-20 | Hitachi Chemical Dupont Microsystems Ltd | ポジ型感光性ポリアミドイミド樹脂組成物、パターンの製造方法及び電子部品 |
TW201321899A (zh) * | 2011-11-09 | 2013-06-01 | Jnc Corp | 正型感光性組成物 |
Also Published As
Publication number | Publication date |
---|---|
TWI708994B (zh) | 2020-11-01 |
JP2020126271A (ja) | 2020-08-20 |
KR20170063625A (ko) | 2017-06-08 |
WO2016051809A1 (ja) | 2016-04-07 |
JP6919746B2 (ja) | 2021-08-18 |
TW201619699A (zh) | 2016-06-01 |
JPWO2016051809A1 (ja) | 2017-08-10 |
CN106796399A (zh) | 2017-05-31 |
KR102585279B1 (ko) | 2023-10-05 |
JP6743701B2 (ja) | 2020-08-19 |
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