CN104578753B - 复合电子组件和其上安装有复合电子组件的板 - Google Patents

复合电子组件和其上安装有复合电子组件的板 Download PDF

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Publication number
CN104578753B
CN104578753B CN201410260716.5A CN201410260716A CN104578753B CN 104578753 B CN104578753 B CN 104578753B CN 201410260716 A CN201410260716 A CN 201410260716A CN 104578753 B CN104578753 B CN 104578753B
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CN
China
Prior art keywords
capacitor
electrode
inductor
combined electronical
electronical assembly
Prior art date
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CN201410260716.5A
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English (en)
Chinese (zh)
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CN104578753A (zh
Inventor
孙受焕
韩镇宇
郭埈焕
李京鲁
金明基
李焕秀
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication date
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Publication of CN104578753A publication Critical patent/CN104578753A/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Ceramic Capacitors (AREA)
CN201410260716.5A 2013-10-18 2014-06-12 复合电子组件和其上安装有复合电子组件的板 Active CN104578753B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130124710A KR101514554B1 (ko) 2013-10-18 2013-10-18 복합 전자부품 및 그 실장 기판
KR10-2013-0124710 2013-10-18

Publications (2)

Publication Number Publication Date
CN104578753A CN104578753A (zh) 2015-04-29
CN104578753B true CN104578753B (zh) 2018-11-02

Family

ID=52825664

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410260716.5A Active CN104578753B (zh) 2013-10-18 2014-06-12 复合电子组件和其上安装有复合电子组件的板

Country Status (4)

Country Link
US (1) US9654079B2 (ja)
JP (1) JP6844808B2 (ja)
KR (1) KR101514554B1 (ja)
CN (1) CN104578753B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102004770B1 (ko) * 2013-10-31 2019-07-29 삼성전기주식회사 복합 전자부품 및 그 실장 기판
KR20160136047A (ko) 2015-05-19 2016-11-29 삼성전기주식회사 복합 전자부품 및 그 실장 기판
JP6520888B2 (ja) 2016-10-31 2019-05-29 株式会社村田製作所 複合型電子部品
TWI630330B (zh) * 2016-11-15 2018-07-21 財團法人工業技術研究院 智慧機械元件
JP7075185B2 (ja) * 2017-04-27 2022-05-25 太陽誘電株式会社 コイル部品及び電子機器

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JPH04284610A (ja) * 1991-03-13 1992-10-09 Tdk Corp 複合積層部品
US5610565A (en) * 1994-02-02 1997-03-11 Murata Manufacturing Co., Ltd. Composite LC device with a ground electrode not formed on the inductor parts
JPH1140920A (ja) * 1997-07-22 1999-02-12 Taiyo Yuden Co Ltd 複合部品
JP2002151354A (ja) * 2000-11-10 2002-05-24 Tdk Corp 積層電子部品
JP2002222712A (ja) * 2001-01-26 2002-08-09 Kawasaki Steel Corp Ｌｃ複合素子
CN1402426A (zh) * 2001-08-09 2003-03-12 株式会社村田制作所 多层lc复合元件及其制造方法
CN1448968A (zh) * 2002-04-01 2003-10-15 株式会社村田制作所 陶瓷电子部件及其制造方法
CN1126245C (zh) * 1997-10-15 2003-10-29 阿维科斯公司 带有聚合物层的表面安装滤波器
CN101276660A (zh) * 2007-03-30 2008-10-01 Tdk株式会社 电介质陶瓷组合物、复合电子部件和叠层陶瓷电容器

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JPH01289307A (ja) * 1988-05-17 1989-11-21 Matsushita Electric Ind Co Ltd チップノイズフィルタ
JP2909122B2 (ja) * 1990-02-09 1999-06-23 東光株式会社 積層複合部品
JPH04117808A (ja) * 1990-09-07 1992-04-17 Murata Mfg Co Ltd Ｌｃフィルタ
JPH06325977A (ja) * 1993-05-14 1994-11-25 Mitsubishi Materials Corp π型ＬＣフィルタ及びπ型ＬＣフィルタアレイ
JPH0878991A (ja) * 1994-09-02 1996-03-22 Tokin Corp チップ型ｌｃフィルタ素子
JPH0922831A (ja) * 1995-07-05 1997-01-21 Tdk Corp 積層複合電子部品
JPH10190391A (ja) * 1996-12-27 1998-07-21 Murata Mfg Co Ltd 積層型ｌｃフィルタ
JPH1187793A (ja) 1997-09-02 1999-03-30 Taiyo Yuden Co Ltd 圧電トランス及び電源装置
JPH11317311A (ja) * 1998-03-03 1999-11-16 Matsushita Electric Ind Co Ltd 複合部品およびその製造方法
US6534842B2 (en) * 1998-03-03 2003-03-18 Matsushita Electric Industrial Co., Ltd. Composite components and the method of manufacturing the same
JP2000235921A (ja) * 1999-02-16 2000-08-29 Matsushita Electric Ind Co Ltd 複合部品およびその製造方法
JP3365622B2 (ja) 1999-12-17 2003-01-14 松下電器産業株式会社 Ｌｃ複合部品および電源素子
JP4784017B2 (ja) * 2001-08-10 2011-09-28 株式会社村田製作所 積層型ローパスフィルタ
JP2003100524A (ja) * 2001-09-27 2003-04-04 Murata Mfg Co Ltd 積層型ｌｃ部品
JP4765239B2 (ja) * 2002-03-26 2011-09-07 株式会社村田製作所 ノイズフィルタおよびその取り付け構造
JP4217438B2 (ja) * 2002-07-26 2009-02-04 Ｆｄｋ株式会社 マイクロコンバータ
JP2004152980A (ja) * 2002-10-30 2004-05-27 Fuji Electric Device Technology Co Ltd 薄膜磁気誘導素子とそれを用いた超小型電力変換装置
JP2005159514A (ja) * 2003-11-21 2005-06-16 Murata Mfg Co Ltd 積層型複合電子部品
JP2005340585A (ja) * 2004-05-28 2005-12-08 Murata Mfg Co Ltd 複合電子部品及びその製造方法
JP2009027033A (ja) * 2007-07-20 2009-02-05 Tdk Corp 積層型複合電子部品
WO2010016367A1 (ja) * 2008-08-06 2010-02-11 株式会社村田製作所 複合電子部品
GB2482646A (en) * 2009-05-29 2012-02-08 Harada Ind Co Ltd Vehicle-mounted noise filter
JP5305042B2 (ja) * 2010-07-22 2013-10-02 Ｔｄｋ株式会社 積層型電子部品の製造方法
JP2012146940A (ja) * 2010-12-22 2012-08-02 Kyocera Corp 電子部品および電子装置
KR101339553B1 (ko) * 2012-03-22 2013-12-10 삼성전기주식회사 세라믹 전자부품용 비자성체 조성물, 이를 이용한 세라믹 전자부품 및 이의 제조방법
US9018929B2 (en) * 2013-03-15 2015-04-28 Intersil Americas LLC Internal compensation for power management integrated circuits

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284610A (ja) * 1991-03-13 1992-10-09 Tdk Corp 複合積層部品
US5610565A (en) * 1994-02-02 1997-03-11 Murata Manufacturing Co., Ltd. Composite LC device with a ground electrode not formed on the inductor parts
JPH1140920A (ja) * 1997-07-22 1999-02-12 Taiyo Yuden Co Ltd 複合部品
CN1126245C (zh) * 1997-10-15 2003-10-29 阿维科斯公司 带有聚合物层的表面安装滤波器
JP2002151354A (ja) * 2000-11-10 2002-05-24 Tdk Corp 積層電子部品
JP2002222712A (ja) * 2001-01-26 2002-08-09 Kawasaki Steel Corp Ｌｃ複合素子
CN1402426A (zh) * 2001-08-09 2003-03-12 株式会社村田制作所 多层lc复合元件及其制造方法
CN1448968A (zh) * 2002-04-01 2003-10-15 株式会社村田制作所 陶瓷电子部件及其制造方法
CN101276660A (zh) * 2007-03-30 2008-10-01 Tdk株式会社 电介质陶瓷组合物、复合电子部件和叠层陶瓷电容器

Also Published As

Publication number Publication date
KR101514554B1 (ko) 2015-04-22
CN104578753A (zh) 2015-04-29
US20150109074A1 (en) 2015-04-23
JP2015079932A (ja) 2015-04-23
JP6844808B2 (ja) 2021-03-17
US9654079B2 (en) 2017-05-16

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