CN103791956B - 流量传感器及其制造方法以及流量传感器组件 - Google Patents
流量传感器及其制造方法以及流量传感器组件 Download PDFInfo
- Publication number
- CN103791956B CN103791956B CN201310729123.4A CN201310729123A CN103791956B CN 103791956 B CN103791956 B CN 103791956B CN 201310729123 A CN201310729123 A CN 201310729123A CN 103791956 B CN103791956 B CN 103791956B
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- Prior art keywords
- semiconductor element
- mold
- resin
- flow sensor
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/16—Diaphragms; Bellows; Mountings therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Measuring Volume Flow (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009282085A JP5208099B2 (ja) | 2009-12-11 | 2009-12-11 | 流量センサとその製造方法、及び流量センサモジュール |
| JP2009-282085 | 2009-12-11 | ||
| CN201010589428.6A CN102162744B (zh) | 2009-12-11 | 2010-12-09 | 流量传感器及其制造方法以及流量传感器组件 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010589428.6A Division CN102162744B (zh) | 2009-12-11 | 2010-12-09 | 流量传感器及其制造方法以及流量传感器组件 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103791956A CN103791956A (zh) | 2014-05-14 |
| CN103791956B true CN103791956B (zh) | 2017-04-12 |
Family
ID=43558160
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310729123.4A Active CN103791956B (zh) | 2009-12-11 | 2010-12-09 | 流量传感器及其制造方法以及流量传感器组件 |
| CN201010589428.6A Active CN102162744B (zh) | 2009-12-11 | 2010-12-09 | 流量传感器及其制造方法以及流量传感器组件 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010589428.6A Active CN102162744B (zh) | 2009-12-11 | 2010-12-09 | 流量传感器及其制造方法以及流量传感器组件 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US8969977B2 (enExample) |
| EP (2) | EP2339302A3 (enExample) |
| JP (1) | JP5208099B2 (enExample) |
| CN (2) | CN103791956B (enExample) |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013084259A1 (ja) | 2011-12-07 | 2013-06-13 | 日立オートモティブシステムズ株式会社 | 空気流量測定装置 |
| JP5743871B2 (ja) | 2011-12-07 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5883887B2 (ja) | 2012-01-10 | 2016-03-15 | 日立オートモティブシステムズ株式会社 | 流量計測装置 |
| JP5743922B2 (ja) * | 2012-02-21 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式空気流量測定装置 |
| JP5763575B2 (ja) * | 2012-03-19 | 2015-08-12 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法 |
| JP5710538B2 (ja) | 2012-04-06 | 2015-04-30 | 日立オートモティブシステムズ株式会社 | 流量センサ |
| JP5965706B2 (ja) * | 2012-04-12 | 2016-08-10 | 日立オートモティブシステムズ株式会社 | 流量センサの製造方法 |
| JP5932508B2 (ja) | 2012-06-15 | 2016-06-08 | 日立オートモティブシステムズ株式会社 | 熱式流量計およびその製造方法 |
| WO2013186910A1 (ja) | 2012-06-15 | 2013-12-19 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5666508B2 (ja) * | 2012-06-15 | 2015-02-12 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5662381B2 (ja) * | 2012-06-15 | 2015-01-28 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5759942B2 (ja) * | 2012-06-15 | 2015-08-05 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5662382B2 (ja) * | 2012-06-15 | 2015-01-28 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5675706B2 (ja) | 2012-06-15 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5645880B2 (ja) | 2012-06-15 | 2014-12-24 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| DE112012006391B4 (de) * | 2012-06-15 | 2022-04-28 | Hitachi Astemo, Ltd. | Durchflusssensoren und Verfahren zu ihrer Herstellung |
| JP5676527B2 (ja) * | 2012-06-15 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5632881B2 (ja) * | 2012-06-15 | 2014-11-26 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP5675716B2 (ja) * | 2012-06-29 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式空気流量センサ |
| JP5648021B2 (ja) | 2012-06-29 | 2015-01-07 | 日立オートモティブシステムズ株式会社 | 熱式空気流量センサ |
| JP5974774B2 (ja) * | 2012-09-25 | 2016-08-23 | 株式会社デンソー | センサ装置の製造方法 |
| JP6102263B2 (ja) * | 2013-01-08 | 2017-03-29 | 株式会社デンソー | 半導体装置の製造方法 |
| JP5916637B2 (ja) | 2013-01-11 | 2016-05-11 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法 |
| JP6011373B2 (ja) * | 2013-01-31 | 2016-10-19 | 株式会社デンソー | 半導体装置の製造方法 |
| JP5904959B2 (ja) * | 2013-03-08 | 2016-04-20 | 日立オートモティブシステムズ株式会社 | 熱式空気流量計 |
| JP6118150B2 (ja) * | 2013-03-21 | 2017-04-19 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
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| EP3064906A4 (en) * | 2013-10-31 | 2017-03-08 | Hitachi Automotive Systems, Ltd. | Airflow measurement device |
| CN103954306B (zh) * | 2014-04-15 | 2016-03-23 | 无锡市星翼仪表科技有限公司 | 小型化高精度微量程传感器及流量计 |
| JP6357535B2 (ja) * | 2014-07-30 | 2018-07-11 | 日立オートモティブシステムズ株式会社 | センサおよびその製造方法 |
| JP5770909B2 (ja) * | 2014-11-04 | 2015-08-26 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP2016090413A (ja) | 2014-11-06 | 2016-05-23 | 日立オートモティブシステムズ株式会社 | 熱式空気流量計 |
| JP6283427B2 (ja) * | 2014-11-28 | 2018-02-21 | 日立オートモティブシステムズ株式会社 | 熱式流量センサ |
| JP2016194465A (ja) * | 2015-04-01 | 2016-11-17 | 日立オートモティブシステムズ株式会社 | 物理量検出素子 |
| JP6043833B2 (ja) * | 2015-04-27 | 2016-12-14 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP6045644B2 (ja) * | 2015-06-11 | 2016-12-14 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法 |
| JP5868539B2 (ja) * | 2015-06-24 | 2016-02-24 | 日立オートモティブシステムズ株式会社 | 流量計 |
| US10217684B2 (en) * | 2015-09-30 | 2019-02-26 | Hitachi Automotive Systems, Ltd. | Resin molding and sensor device |
| DE102015225358B4 (de) | 2015-12-16 | 2020-04-02 | Continental Automotive Gmbh | Luftmassenmesser |
| JP6144859B2 (ja) * | 2017-03-14 | 2017-06-07 | 日立オートモティブシステムズ株式会社 | 流量センサとその製造方法、及び流量センサモジュール |
| JP6406396B2 (ja) * | 2017-06-07 | 2018-10-17 | 株式会社デンソー | 流量センサ |
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| WO2019021766A1 (ja) * | 2017-07-24 | 2019-01-31 | 株式会社デンソー | 半導体装置及び半導体装置の製造方法 |
| JP6458104B2 (ja) * | 2017-09-11 | 2019-01-23 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| DE102017218893A1 (de) * | 2017-10-23 | 2019-04-25 | Robert Bosch Gmbh | Sensoranordnung zur Bestimmung wenigstens eines Parameters eines durch einen Messkanal strömenden fluiden Mediums |
| JP6793107B2 (ja) * | 2017-11-27 | 2020-12-02 | 日立オートモティブシステムズ株式会社 | 流量計 |
| JP6838227B2 (ja) * | 2018-03-09 | 2021-03-03 | 日立Astemo株式会社 | 物理量測定装置 |
| JP6454809B2 (ja) * | 2018-05-09 | 2019-01-16 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP2020016465A (ja) * | 2018-07-23 | 2020-01-30 | ミネベアミツミ株式会社 | 流体センサ |
| DE112019004779B4 (de) | 2018-11-05 | 2025-10-09 | Hitachi Astemo, Ltd. | Positionierungs- und befestigungsaufbau für ein chipmodul |
| JP6561192B2 (ja) * | 2018-12-14 | 2019-08-14 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| DE112020000176T5 (de) * | 2019-03-04 | 2021-08-19 | Hitachi Astemo, Ltd. | Detektionsvorrichtung für eine physikalische Größe |
| JP7162961B2 (ja) * | 2019-03-04 | 2022-10-31 | 日立Astemo株式会社 | 流量測定装置 |
| JP7317103B2 (ja) * | 2019-03-29 | 2023-07-28 | 日立Astemo株式会社 | 物理量測定装置 |
| JP6775629B2 (ja) * | 2019-04-23 | 2020-10-28 | 日立オートモティブシステムズ株式会社 | 物理量検出素子 |
| JP6603003B2 (ja) * | 2019-07-19 | 2019-11-06 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP7112001B2 (ja) * | 2020-10-15 | 2022-08-03 | ダイキン工業株式会社 | 熱式流速・流量センサ、及び空気調和機 |
| US11879790B2 (en) | 2021-10-28 | 2024-01-23 | Texas Instruments Incorporated | Isolated temperature sensor package with embedded spacer in dielectric opening |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1437697A (zh) * | 2000-07-27 | 2003-08-20 | 株式会社日立制作所 | 热式空气流量计 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56159117A (en) * | 1980-05-12 | 1981-12-08 | Ricoh Co Ltd | Mold |
| JP2784286B2 (ja) | 1991-12-09 | 1998-08-06 | 三菱電機株式会社 | 半導体センサー装置の製造方法 |
| TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
| JPH09158739A (ja) | 1995-12-07 | 1997-06-17 | Eugene Aroisu Dekuraaku Paul | ロータリーエンジン、2−行程エンジン、及びバルブを有さない他の内燃エンジンのための、並進スロットルシャッタを有する吸気系統 |
| JP3427874B2 (ja) | 1996-05-16 | 2003-07-22 | 沖電気工業株式会社 | 樹脂封止型半導体装置とその製造方法 |
| JP3328547B2 (ja) * | 1997-06-16 | 2002-09-24 | 株式会社日立製作所 | 熱式空気流量センサ |
| JP3545637B2 (ja) | 1999-03-24 | 2004-07-21 | 三菱電機株式会社 | 感熱式流量センサ |
| JP3450223B2 (ja) * | 1999-05-27 | 2003-09-22 | Necエレクトロニクス株式会社 | 半導体装置封入用金型、及び、半導体装置封入方法 |
| JP3514666B2 (ja) * | 1999-06-30 | 2004-03-31 | 株式会社日立製作所 | 熱式空気流量センサ |
| JP3555017B2 (ja) * | 1999-09-22 | 2004-08-18 | 三菱電機株式会社 | 感熱式流量センサ |
| EP1128168A3 (en) * | 2000-02-23 | 2002-07-03 | Hitachi, Ltd. | Measurement apparatus for measuring physical quantity such as fluid flow |
| JP2004028631A (ja) * | 2002-06-21 | 2004-01-29 | Mitsubishi Electric Corp | 流量センサ |
| CA2737425C (en) * | 2002-12-25 | 2014-01-21 | Honda Motor Co., Ltd. | Method and device for injection molding |
| JP4349144B2 (ja) * | 2004-02-13 | 2009-10-21 | 株式会社デンソー | 熱式空気流量センサ、及び、熱式空気流量センサの製造方法 |
| JP4281630B2 (ja) * | 2004-06-18 | 2009-06-17 | 株式会社デンソー | センサ装置の製造方法 |
| JP4609019B2 (ja) * | 2004-09-24 | 2011-01-12 | 株式会社デンソー | 熱式流量センサ及びその製造方法 |
| JP4881554B2 (ja) | 2004-09-28 | 2012-02-22 | 日立オートモティブシステムズ株式会社 | 流量センサ |
| JP4049167B2 (ja) * | 2005-05-11 | 2008-02-20 | ヤマハ株式会社 | 蓋体フレーム、半導体装置、及びその製造方法 |
| JP2006293030A (ja) | 2005-04-11 | 2006-10-26 | Toshiba Matsushita Display Technology Co Ltd | 液晶表示装置、液晶表示装置の製造方法、および画像データの転送方法 |
| JP4830391B2 (ja) | 2005-07-29 | 2011-12-07 | 株式会社デンソー | センサ装置の製造方法及びセンサ装置 |
| JP2008020193A (ja) | 2006-07-10 | 2008-01-31 | Mitsubishi Electric Corp | 熱式流量センサ |
| JP2008058131A (ja) * | 2006-08-31 | 2008-03-13 | Hitachi Ltd | 熱式ガス流量計 |
| JP4893234B2 (ja) | 2006-10-27 | 2012-03-07 | 株式会社デンソー | 流量センサおよびその製造方法 |
| JP4882732B2 (ja) * | 2006-12-22 | 2012-02-22 | 株式会社デンソー | 半導体装置 |
| JP4894531B2 (ja) * | 2007-01-22 | 2012-03-14 | 株式会社デンソー | 熱式流量センサ |
| JP2009031067A (ja) | 2007-07-25 | 2009-02-12 | Denso Corp | センサ装置 |
| JP4952428B2 (ja) | 2007-08-01 | 2012-06-13 | 株式会社デンソー | センサ装置 |
| JP4894669B2 (ja) | 2007-08-01 | 2012-03-14 | 株式会社デンソー | センサ装置及びその製造方法 |
| JP5012330B2 (ja) * | 2007-08-29 | 2012-08-29 | 株式会社デンソー | センサ装置の製造方法及びセンサ装置 |
| JP2009162695A (ja) * | 2008-01-09 | 2009-07-23 | Denso Corp | 空気流量検出チップの実装構造 |
| JP4577370B2 (ja) * | 2008-02-12 | 2010-11-10 | 株式会社デンソー | センサ装置およびその製造方法 |
| DE102008011943B4 (de) * | 2008-02-29 | 2012-04-26 | Robert Bosch Gmbh | Sensoranordnung zur Differenzdruckmessung |
| JP2009264741A (ja) | 2008-04-21 | 2009-11-12 | Denso Corp | 熱式流量センサの製造方法 |
| JP4851555B2 (ja) * | 2008-05-13 | 2012-01-11 | 株式会社デンソー | 力学量センサおよびその製造方法 |
| JP5038273B2 (ja) | 2008-09-17 | 2012-10-03 | 三菱電機株式会社 | 樹脂モールド半導体センサ及び製造方法 |
-
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- 2009-12-11 JP JP2009282085A patent/JP5208099B2/ja active Active
-
2010
- 2010-12-09 CN CN201310729123.4A patent/CN103791956B/zh active Active
- 2010-12-09 CN CN201010589428.6A patent/CN102162744B/zh active Active
- 2010-12-10 EP EP10252092A patent/EP2339302A3/en not_active Withdrawn
- 2010-12-10 EP EP19209512.3A patent/EP3660470B1/en active Active
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1437697A (zh) * | 2000-07-27 | 2003-08-20 | 株式会社日立制作所 | 热式空气流量计 |
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| US11629988B2 (en) | 2023-04-18 |
| EP3660470B1 (en) | 2025-01-22 |
| JP2011122984A (ja) | 2011-06-23 |
| CN102162744A (zh) | 2011-08-24 |
| US9846067B2 (en) | 2017-12-19 |
| JP5208099B2 (ja) | 2013-06-12 |
| US10921169B2 (en) | 2021-02-16 |
| US20110140211A1 (en) | 2011-06-16 |
| EP2339302A2 (en) | 2011-06-29 |
| CN102162744B (zh) | 2014-01-15 |
| US20210108953A1 (en) | 2021-04-15 |
| EP3660470A1 (en) | 2020-06-03 |
| US20180073905A1 (en) | 2018-03-15 |
| CN103791956A (zh) | 2014-05-14 |
| EP2339302A3 (en) | 2011-07-06 |
| US8969977B2 (en) | 2015-03-03 |
| US20150137282A1 (en) | 2015-05-21 |
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