CN103262675B - 能散失热负荷的机顶盒 - Google Patents

能散失热负荷的机顶盒 Download PDF

Info

Publication number
CN103262675B
CN103262675B CN201180032238.7A CN201180032238A CN103262675B CN 103262675 B CN103262675 B CN 103262675B CN 201180032238 A CN201180032238 A CN 201180032238A CN 103262675 B CN103262675 B CN 103262675B
Authority
CN
China
Prior art keywords
heat sink
circuit board
top box
heat
source element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180032238.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103262675A (zh
Inventor
D.B.里特
M.J.亨特
M.W.吉辛
R.A.迪默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THOMSON LICENSING CORP
Original Assignee
THOMSON LICENSING CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THOMSON LICENSING CORP filed Critical THOMSON LICENSING CORP
Publication of CN103262675A publication Critical patent/CN103262675A/zh
Application granted granted Critical
Publication of CN103262675B publication Critical patent/CN103262675B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201180032238.7A 2010-05-19 2011-05-12 能散失热负荷的机顶盒 Expired - Fee Related CN103262675B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34607310P 2010-05-19 2010-05-19
US61/346,073 2010-05-19
US40076710P 2010-08-02 2010-08-02
US61/400,767 2010-08-02
PCT/US2011/036171 WO2011146302A1 (en) 2010-05-19 2011-05-12 Set-top box having dissipating thermal loads

Publications (2)

Publication Number Publication Date
CN103262675A CN103262675A (zh) 2013-08-21
CN103262675B true CN103262675B (zh) 2016-03-30

Family

ID=44484817

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180032238.7A Expired - Fee Related CN103262675B (zh) 2010-05-19 2011-05-12 能散失热负荷的机顶盒

Country Status (7)

Country Link
US (1) US9220185B2 (https=)
EP (1) EP2572562B1 (https=)
JP (1) JP2013527615A (https=)
KR (1) KR20130077841A (https=)
CN (1) CN103262675B (https=)
BR (1) BR112012029464A2 (https=)
WO (1) WO2011146302A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120129885A (ko) 2009-12-09 2012-11-28 톰슨 라이센싱 마이크로천공을 구비하는 셋탑 박스
WO2011106082A1 (en) 2010-02-25 2011-09-01 Thomson Licensing Miniature multilayer radiative cooling case with hidden quick release snaps
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
CN103858067A (zh) 2011-03-09 2014-06-11 汤姆逊许可公司 具有卡扣式热沉和智能卡读取器的机顶盒或服务器
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9317079B2 (en) 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8681495B2 (en) * 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
CN103703875B (zh) 2011-07-14 2016-10-12 汤姆逊许可公司 具有扣合式散热器和智能卡读卡器、带有用于保持散热器的固定部件的机顶盒
WO2013058748A1 (en) 2011-10-19 2013-04-25 Thomson Licensing Remote control with feedback for blind navigation
CN103547111B (zh) * 2012-07-09 2016-08-10 光宝电子(广州)有限公司 平面式散热结构及电子装置
WO2014209316A1 (en) * 2013-06-27 2014-12-31 Thomson Licensing Device cover for thermal management
WO2015023447A2 (en) * 2013-08-16 2015-02-19 Technicolor Usa, Inc. Multi-layer heat spreader assembly with isolated convective fins
CN103491748B (zh) * 2013-09-17 2016-06-08 深圳市九洲电器有限公司 散热装置和机顶盒
WO2015061396A1 (en) * 2013-10-24 2015-04-30 Technicolor Usa, Inc. Compact wireless antennae mounting with electrostatic discharge protection
US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
KR101491833B1 (ko) * 2014-11-16 2015-02-11 가온미디어 주식회사 포집 분산형 히트싱크
JP6601055B2 (ja) * 2015-08-20 2019-11-06 富士通株式会社 プリント配線板、電子機器及び実装方法
US10356948B2 (en) 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
KR101794007B1 (ko) 2016-04-06 2017-11-07 (주)휴맥스 방열모듈 조립체 및 이를 갖는 셋탑박스
CN106848539B (zh) * 2017-01-19 2019-10-25 努比亚技术有限公司 一种天线装置
US11425843B2 (en) * 2017-08-08 2022-08-23 Nec Platforms, Ltd. Heat radiation structure
JP2019057656A (ja) * 2017-09-22 2019-04-11 ダイヤモンド電機株式会社 空冷機構付き電子機器
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
US11122707B2 (en) * 2018-07-12 2021-09-14 Arris Enterprises Llc Raised pathway heat sink
US11013141B2 (en) * 2019-05-31 2021-05-18 Microsoft Technology Licensing, Llc Decoupled conduction/convection dual heat sink for on-board memory microcontrollers
KR102845808B1 (ko) 2020-09-24 2025-08-13 삼성디스플레이 주식회사 표시 장치 및 이를 구비한 전자 기기
WO2022132244A1 (en) * 2020-12-15 2022-06-23 Arris Enterprises Llc Multisided heat spreader
US11800687B2 (en) * 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly
US12349317B2 (en) * 2022-04-26 2025-07-01 Dish Network L.L.C. Electronic assembly having thermal pad with polymer layer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201571126U (zh) * 2009-12-14 2010-09-01 福建创频数码科技有限公司 一种新型机顶盒外壳

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887147A (en) 1987-07-01 1989-12-12 Digital Equipment Corporation Thermal package for electronic components
JPH02307182A (ja) 1989-05-23 1990-12-20 Hitachi Maxell Ltd Ｉｃカードリーダ・ライタ
JP2758283B2 (ja) 1991-06-17 1998-05-28 株式会社東芝 ハードディスクパックの脱着機構
US6850252B1 (en) 1999-10-05 2005-02-01 Steven M. Hoffberg Intelligent electronic appliance system and method
JPH06227553A (ja) 1993-01-28 1994-08-16 Yazaki Corp ロック構造
US5620242A (en) 1993-04-19 1997-04-15 Motorola, Inc. Portable radio battery latch
JP3251734B2 (ja) 1993-08-18 2002-01-28 株式会社日立テレコムテクノロジー 電子装置の筐体構造
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
US5667397A (en) 1994-12-01 1997-09-16 The Whitaker Corporation Smart card connector
US5917236A (en) 1995-12-08 1999-06-29 Hewlett-Packard Company Packaging system for field effects transistors
JP3776169B2 (ja) 1996-06-13 2006-05-17 任天堂株式会社 電子機器の放熱構造
JPH10154390A (ja) 1996-11-20 1998-06-09 Nippon Columbia Co Ltd ディスク再生装置
US6049469A (en) 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US7082033B1 (en) 1998-02-13 2006-07-25 Micron Technology, Inc. Removing heat from integrated circuit devices mounted on a support structure
JP3597368B2 (ja) * 1998-02-16 2004-12-08 アルプス電気株式会社 電子機器
US6021044A (en) 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
JP2000269671A (ja) * 1999-03-19 2000-09-29 Toshiba Corp 電子機器
JP2000269675A (ja) 1999-03-19 2000-09-29 Sony Corp 放熱装置およびセット・トップ・ボックス
US6411522B1 (en) 1999-04-01 2002-06-25 Western Digital Ventures, Inc. Integrated computer module with EMI shielding plate
JP3982941B2 (ja) 1999-04-12 2007-09-26 富士通株式会社 記憶装置
US6382995B1 (en) 1999-05-20 2002-05-07 Itt Manufacturing Enterprises, Inc Smart card connector with retain and eject means
DE69937103T2 (de) 1999-06-08 2008-06-12 Molex Inc., Lisle Tragbare Chipkarten-Leseanordnung
WO2001003052A1 (en) 1999-07-02 2001-01-11 3M Innovative Properties Company Smart card reader
JP2001147061A (ja) 1999-09-08 2001-05-29 Sega Corp 冷却装置を有する電子機器
GB2355017B (en) 1999-09-23 2001-09-12 Lorenzo Battisti Porous element
US6212074B1 (en) 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
JP3923703B2 (ja) * 2000-03-29 2007-06-06 ローム株式会社 放熱手段を有するプリント配線板
JP2001358482A (ja) 2000-04-14 2001-12-26 Matsushita Refrig Co Ltd 放熱モジュール
FR2809871B1 (fr) 2000-06-05 2002-07-19 Itt Mfg Entpr S Inc Connecteur electrique a lames de contact perfectionnees pour le raccordement d'une carte a circuit(s) integre(s)
US20020051338A1 (en) 2000-07-27 2002-05-02 Lixin Jiang Acoustic enclosure for an air cooled hard disk drive
DE10051159C2 (de) 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
JP2002134970A (ja) 2000-10-26 2002-05-10 Denso Corp 電子制御装置
US6524361B1 (en) 2000-10-26 2003-02-25 Hubbell Incorporated Micro-porous filter
EP1248507A1 (de) 2001-04-04 2002-10-09 Siemens Aktiengesellschaft Hochfrequenzmodul eines Audio-Gerätes mit optimierter Wärmeableitung
JP2002324989A (ja) * 2001-04-26 2002-11-08 Murata Mach Ltd 印刷回路基板の放熱構造
JP4057796B2 (ja) 2001-07-03 2008-03-05 株式会社東芝 非水電解質空気電池
US6735085B2 (en) 2002-08-15 2004-05-11 Hon Hai Precision Ind. Co., Ltd. Foldable retention device for land grid array connector assembly
JP2004186294A (ja) 2002-12-02 2004-07-02 Denso Corp 電子装置
JP4039316B2 (ja) * 2003-06-09 2008-01-30 株式会社明電舎 電子機器の冷却構造
EP1508916B1 (en) 2003-08-07 2008-03-05 Harman Becker Automotive Systems GmbH Apparatus for cooling semiconductor devices attached to a printed circuit board
US7203065B1 (en) * 2003-11-24 2007-04-10 Ciena Corporation Heatsink assembly
US20050128710A1 (en) * 2003-12-15 2005-06-16 Beiteimal Abdlmonem H. Cooling system for electronic components
TWI256192B (en) 2004-04-15 2006-06-01 Acbel Polytech Inc Power adapter with heat sink device
FR2871022B1 (fr) 2004-05-25 2006-11-03 Valeo Electronique Sys Liaison Boitier pour circuits electriques ou electroniques
GB0413340D0 (en) 2004-06-15 2004-07-21 Pace Micro Tech Plc Improvements to electrical apparatus
FR2875917B3 (fr) 2004-09-29 2007-01-05 Alvaro Lemos Dispositif d'aeration pliable pour la protection de micro-ordinateurs portables
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
TWI247574B (en) 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
US7791874B2 (en) 2004-12-30 2010-09-07 Microsoft Corporation Removable module for a console
JP2006229046A (ja) 2005-02-18 2006-08-31 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP4445409B2 (ja) 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
US7158380B2 (en) * 2005-03-25 2007-01-02 Scientific-Atlanta, Inc. Heatsink for digital video recorder
US7350705B1 (en) 2005-03-28 2008-04-01 International Technologies & Systems Corp. Compact robust smart card reader
DE202005013758U1 (de) 2005-08-31 2006-01-19 Sampo Corp., Kuei Shan Hsiang Kühlmechanismus für ein tragbares digitales Fernsehgerät
US7272001B2 (en) 2005-09-09 2007-09-18 King Young Technology Co., Ltd. External conductive heat dissipating device for microcomputers
WO2007089321A2 (en) 2005-11-23 2007-08-09 Comcast Cable Holdings, Llc Settop box (stb)
US20070177356A1 (en) 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
JP4742893B2 (ja) * 2006-02-03 2011-08-10 日本電気株式会社 発熱デバイスの実装装置およびその放熱装置
US7450387B2 (en) 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
GB2436170A (en) 2006-03-17 2007-09-19 Amstrad Plc Cooling or heating device in a chip card reader
US7664198B2 (en) 2006-03-21 2010-02-16 Kyocera Corporation System and method for broadcasting data over a wireless network using rateless codes
JP2008034474A (ja) 2006-07-26 2008-02-14 Sharp Corp 伝熱シート及び基板装置
US7518875B2 (en) 2006-12-14 2009-04-14 International Business Machines Corporation Securing heat sinks to a device under test
JP5227396B2 (ja) 2007-05-04 2013-07-03 トムソン ライセンシング スマートカードヒートシンク
DE202007006626U1 (de) 2007-05-09 2007-10-04 Hamburg Industries Co., Ltd., Shen Keng Verbindungseinrichtung
US8023260B2 (en) 2007-09-04 2011-09-20 Apple Inc. Assembly of an electronic device
WO2009057124A2 (en) 2007-11-01 2009-05-07 Innomedia Technologies Pvt. Ltd. A set-top-box cabinet for natural cooling of internal electronics
JP4857252B2 (ja) 2007-12-07 2012-01-18 株式会社日立製作所 電子機器
JP4473923B2 (ja) 2008-10-22 2010-06-02 株式会社東芝 電子機器
CN201352820Y (zh) 2009-02-10 2009-11-25 深圳创维数字技术股份有限公司 机顶盒机箱
FR2944408B1 (fr) 2009-04-14 2012-09-21 Eads Europ Aeronautic Defence Boitier pour carte electronique embarquee
KR101552357B1 (ko) 2009-05-29 2015-09-11 엘지이노텍 주식회사 튜너 모듈
CN201515429U (zh) 2009-09-22 2010-06-23 重庆迪特尔数字电视有限公司 数字电视机顶盒
KR20120129885A (ko) 2009-12-09 2012-11-28 톰슨 라이센싱 마이크로천공을 구비하는 셋탑 박스
WO2011106082A1 (en) 2010-02-25 2011-09-01 Thomson Licensing Miniature multilayer radiative cooling case with hidden quick release snaps
US8620162B2 (en) 2010-03-25 2013-12-31 Apple Inc. Handheld electronic device with integrated transmitters
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
USD631449S1 (en) 2010-08-02 2011-01-25 Thomson Licensing Set top box
GB201016047D0 (en) 2010-09-24 2010-11-10 Pace Plc Means for heating dissipation for electrical and/or electronic apparatus
CN103858067A (zh) 2011-03-09 2014-06-11 汤姆逊许可公司 具有卡扣式热沉和智能卡读取器的机顶盒或服务器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201571126U (zh) * 2009-12-14 2010-09-01 福建创频数码科技有限公司 一种新型机顶盒外壳

Also Published As

Publication number Publication date
BR112012029464A2 (pt) 2017-03-01
JP2013527615A (ja) 2013-06-27
WO2011146302A1 (en) 2011-11-24
CN103262675A (zh) 2013-08-21
EP2572562A1 (en) 2013-03-27
KR20130077841A (ko) 2013-07-09
US9220185B2 (en) 2015-12-22
EP2572562B1 (en) 2018-05-09
US20130063895A1 (en) 2013-03-14

Similar Documents

Publication Publication Date Title
CN103262675B (zh) 能散失热负荷的机顶盒
US7345885B2 (en) Heat spreader with multiple stacked printed circuit boards
TWI722195B (zh) 電子裝置及電子裝置之放熱構造
US7133288B2 (en) Processor heat sink retention module and assembly
JP2008288233A (ja) 熱移動部材、熱移動機構及び情報処理装置
JP2021039966A (ja) 電気機器、電子制御装置
US20180310395A1 (en) MULTl-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS
US7817424B2 (en) Heat sink assembly including a heat pipe and a duct
US7929293B2 (en) Heat dissipating assembly
US7323776B2 (en) Elevated heat dissipating device
CN111315182A (zh) 整合式电子装置
JP7776240B2 (ja) 基板を越えるフィンを有するヒート・シンク
CN102083295A (zh) 电子装置及其散热模组
TW201439734A (zh) 平板電子裝置、其輔助散熱構件以及具有上述兩者之組裝體
CN103037664A (zh) 散热装置及使用该散热装置的电子装置
CN100449741C (zh) 用于中央处理器的散热结构
US6399877B1 (en) Heat sink
TWI720382B (zh) 整合式電子裝置
TWM531125U (zh) 散熱板組合及電子裝置
US20250300034A1 (en) Hard drive device and the heat dissipation unit for a hard drive device
JP3104491U (ja) 放熱板を備えた配線基板および該配線基板を実装した電子機器
TW202207786A (zh) 電腦主機
JP2009076623A (ja) 電子機器
CN120690239A (zh) 硬盘装置及用于硬盘装置的散热单元
KR20250178409A (ko) 방열 장치 및 이를 포함하는 차량

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160330

Termination date: 20190512