CN111315182A - 整合式电子装置 - Google Patents

整合式电子装置 Download PDF

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CN111315182A
CN111315182A CN201811516525.5A CN201811516525A CN111315182A CN 111315182 A CN111315182 A CN 111315182A CN 201811516525 A CN201811516525 A CN 201811516525A CN 111315182 A CN111315182 A CN 111315182A
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electronic device
mounting plane
integrated electronic
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circuit board
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CN111315182B (zh
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高肇利
黄进忠
谢奕平
李昌晔
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Delta Electronics Inc
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Delta Electronics Inc
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    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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    • F28—HEAT EXCHANGE IN GENERAL
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    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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Abstract

本发明为一种整合式电子装置，包括散热体及电子装置。散热体包含基座及多个散热片，基座的一侧具有第一安置平面，基座的另一侧设
Figure DDA0001902107080000011
置有散热片并留有第二安置平面，且第二安置平面邻靠第一安置平面；电子装置包含电路板、功率模块及多个晶体管，功率模块包含功率本体及多个焊接脚，功率本体贴接第一安置平面；晶体管具有晶体管本体及多个插脚，晶体管本体贴接第二安置平面，其中，电路板设置在基座成型有第一安置平面的一侧边，功率模块的焊接脚及晶体管的插脚插接在电路板上；借此减少散热体的设置数量及电路板的占用空间，并提高散热体的功率密度。

Description

整合式电子装置
技术领域
本发明有关于电子装置结构，尤指一种具有散热器的电子装置。
背景技术
现今电子装置在大功率高密度趋势的开发需求下，其电子零件在运行下所产生的高热，大多需要通过散热器进行散热，以维持电子零件的正常运作及提高使用寿命。
如图1至图3所示，其显示一种具有散热器的不断电装置(UPS)，不断电装置1a至少包含一电路板10a及电性连接该电路板10a的一逆变器模块20a及多个开关组件30a。请参照图1及图2所示，该逆变器模块20a结合有一第一散热体40a；该些开关组件30a则另结合在一第二散热体50a上。再者，另参照图3，结合有该第一散热体40a的逆变器模块20a以及结合有该第二散热体50a的该些开关组件30a会分别设置在该电路板10a上，据以构成具有散热器的不断电装置1a。
然而，上述具有散热器的不断电装置1a的结构中，由于该逆变器模块20a及该些开关组件30a分别设置在独立的散热体上，其散热体会占用较大的电路板面积及空间，导致电子装置的整体体积增加。此外，为提高散热效率，风扇60a所产生的强制气流另需加设导风片来引导，造成设计上的不便性。
对此，如何设计散热体以增加产品空间利用率，并维持良好的导热效果及提升散热效率，即成为本发明人改良之目标。
发明内容
本发明之一目的，在于提供一种整合式电子装置，以减少散热体的设置数量及电路板的占用空间，并提高散热体的功率密度。
为了达成上述之目的，本发明为一种整合式电子装置，包括散热体及电子装置。散热体包含基座及多个散热片，基座的一侧具有第一安置平面，基座的另一侧设置有散热片并留有第二安置平面，且第二安置平面邻靠第一安置平面；电子装置包含电路板、功率模块及多个晶体管，功率模块包含功率本体及多个焊接脚，功率本体贴接第一安置平面；晶体管具有晶体管本体及多个插脚，晶体管本体贴接第二安置平面，其中，电路板设置在基座成型有第一安置平面的一侧边，功率模块的焊接脚及晶体管的插脚插接在电路板上。
相较于现有技术，本发明的整合式电子装置的结构中，功率模块及该些晶体管贴接在同一散热体的不同侧面上，借此，该散热体可同时对不同处的发热组件进行散热，故不需分别对功率模块及该些晶体管配置散热体，能减少散热体的设置数量，且能大幅减少该电路板的占用空间，进而提高该散热体的功率密度。相较于传统具有散热体的电子装置，本发明之电路板的面积大致可缩减30％。此外，本发明之风扇可直接吹向该散热体而不需再额外设置导风片，故能简化风道设计，增加本发明之实用性。
附图说明
图1至图3为现有具有散热器的不断电装置的设置示意图。
图4为本发明的整合式电子装置的部分立体爆炸示意图。
图5为本发明的整合式电子装置的部分组合示意图。
图6为本发明的整合式电子装置的立体外观示意图。
图7为本发明的整合式电子装置的组合剖视图。
图8为本发明的整合式电子装置的电路示意图。
图9为本发明的整合式电子装置另一实施态样的立体外观图。
图10为本发明的整合式电子装置另一实施态样的上视图。
其中附图标记为：
1a…不断电装置
10a…电路板
20a…逆变器模块
30a…开关组件
40a…第一散热体
50a…第二散热体
60a…风扇
1…整合式电子装置
10…散热体
11…基座
110…第一容置空间
111…第一安置平面
112…第二安置平面
113…肋板
114…支撑板
115…第二容置空间
116…第一螺孔
117…第二螺孔
12…散热片
121…第一散热片
122…第二散热片
20…电子装置
21…电路板
210…插接孔
22…功率模块
221…功率本体
222…焊接脚
23…晶体管
231…晶体管本体
232…插脚
30…螺件
40…风扇
50…电容元件
具体实施方式
有关本发明的详细说明及技术内容，配合图式说明如下，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制者。
请参照图4至图6，分别为本发明的整合式电子装置的部分立体爆炸示意图、部分组合示意图及立体外观示意图。本发明的整合式电子装置1包括一散热体10及一电子装置20。该电子装置20设置有该散热体10，以令该电子装置20运行时所产生的热可通过该散热体10而逸散。更详细描述该整合式电子装置1的结构如后。
本实施例中，该散热体10为一铝挤型散热片，惟实际实施时不以此为限。该散热体10包含一基座11及多个散热片12。该基座11的一侧具有一第一安置平面111，又，该基座11的另一侧设置有该些散热片12并留有至少一第二安置平面112，且该第二安置平面112邻靠该第一安置平面111。
再者，该电子装置20包含一电路板21、一功率模块22及多个晶体管23。该功率模块22包含一功率本体221及多个焊接脚222，且该功率本体221贴接该第一安置平面111。此外，各该晶体管23具有一晶体管本体231及多个插脚232，且该晶体管本体231贴接该第二安置平面112。
如图4及图5所示，该基座11在该第一安置平面111的二侧边成型有一对肋板113。该对肋板113及该第一安置平面111形成有一第一容置空间110，该功率本体221容置在该第一容置空间110中。
具体而言，该基座11在远离该第一安置平面111的一侧面成型有一对支撑板114。较佳地，该对支撑板114在该基座11上形成有一第二容置空间115，该第二容置空间115中设置有部分的散热片12。此外，该对支撑板114分别对应该对肋板113延伸，且该支撑板114在远离该第二容置空间115的一侧与该肋板113位于同一平面。
进一步地说，该些散热片12包含多个第一散热片121及多个第二散热片122。该些第一散热片121设置在该支撑板114上；又，该些第二散热片122设置在该第二容置空间115中。较佳地，该些第一散热片121及该些第二散热片122的延伸方向为垂直。
于本实施例中，该电子装置20设置为一不断电系统，另外，该功率模块22为一逆变器模块，该晶体管23为开关组件单元。再者，该第一安置平面111设有多个第一螺孔116，该功率模块22通过穿设一螺件30而锁固在该些第一螺孔116上。又，该第二安置平面112设有多个第二螺孔117，各该晶体管23通过穿设另一螺件30而锁固在各该第二螺孔117上。
要说明的是，本实施例中，该基座11在该第一安置平面111的二侧分别留有一第二安置平面112，且二第二安置平面112上分别设置有多个晶体管23及多个第一散热片121。另外，实际实施时，该基座11可仅在一侧的支撑板114上留有一第二安置平面112，该些晶体管23可只单独设在该基座11的一侧面；又，另一侧的支撑板114则可在其表面单独成型第一散热片121。
如图6所示，本实施例中，该电路板21设置在该基座11成型有该第一安置平面111的一侧边，且该功率模块22的焊接脚222及该晶体管23的插脚232插接在该电路板21上而作电性连接。
请另参照图7及图8，分别为本发明的整合式电子装置的组合剖视图及电路示意图。从图7可看出，该基座11的截面大致呈一H形，且该基座11成型有相对的第一容置空间110及第二容置空间115。该功率模块22贴接在该第一容置空间110的一侧面；又，该第二容置空间115中容置有该些第二散热片122。另外，该基座11在该第一容置空间110及第二容置空间115的二侧边分别保留有一第二安置平面112，多个晶体管23分别贴接在该二第二安置平面112上。
要说明的是，该电路板21设置在该第一容置空间110及该第二安置平面112的一侧面，且该电路板21设有多个插接孔210，该些插接孔210的位置对应该功率模块22的焊接脚222及该晶体管23的插脚232而设置，借以将该些焊接脚222及该些插脚232结合在该电路板21上。
最后，该整合式电子装置1可再利用波峰焊接(wave soldering)的焊接工艺作固定，借以完成该整合式电子装置1的组设。如图8所示，本发明的整合式电子装置1通过上述方式组设完成后，该功率模块22及该些晶体管23即连接至该电路板21，进而达到彼此电性连接的目的。
值得注意的是，该些第一散热片121位于该支撑板114上远离该第一安置平面112的一侧，以使第二安置平面112可邻靠该第一安置平面112。据此，当该整合式电子装置1通过锡炉作波峰焊接时可不致沾黏到该些第一散热片121，以保持该整合式电子装置1的外观。
请续参照图9及图10，分别为本发明的整合式电子装置另一实施态样的立体外观图及上视图。如图所示，整合式电子装置1更包括至少一风扇40及多个电容元件50。该风扇40位于该散热体10的一侧边；又，该些电容元件50设置在该电路板21上并位于该散热体10的一侧边。
具体而言，于本实施例中，该散热体10、该功率模块20及该风扇40的数量对应设置为多个。又，该些散热体10(包含功率模块22及晶体管23)间隔设置在该电路板10上，该些风扇40分别对应设置在各散热体10的一侧边。据此，风扇40所产生的气流可直接吹向该散热体10而不需再额外设置导风片，故能简化风道设计。又，间隔设置的该些散热体10之间分别设置有电容元件50。
要说明的是，本发明的整合式电子装置1中，该功率模块22及该些晶体管23贴接在同一散热体10的不同侧面上，故该散热体10可同时对不同处的发热组件进行散热。由于不需分别对功率模块22及该些晶体管23配置散热体，因此能减少散热体的设置数量及大幅减少该电路板21的占用空间，进而提高该散热体10的功率密度。
以上所述仅为本发明的较佳实施例，非用以定本发明的权利要求范围，其他运用本发明的专利精神的等效变化，均应俱属本发明的权利要求范围。

Claims (14)

1.一种整合式电子装置，其特征在于，包括:
一散热体，包含一基座及多个散热片，该基座的一侧具有一第一安置平面，该基座的另一侧设置有该些散热片并留有至少一第二安置平面，且该第二安置平面邻靠该第一安置平面；以及
一电子装置，包含一电路板、一功率模块及多个晶体管，该功率模块包含一功率本体及多个焊接脚，且该功率本体贴接该第一安置平面；各该晶体管具有一晶体管本体及多个插脚，且该晶体管本体贴接该第二安置平面；其中，该电路板设置在该基座成型有该第一安置平面的一侧边，该功率模块的焊接脚及该晶体管的插脚插接在该电路板上。
2.如权利要求1所述的整合式电子装置，其特征在于，该基座在该第一安置平面的二侧边成型有一对肋板，该对肋板及该第一安置平面形成有一第一容置空间，该功率本体容置在该第一容置空间中。
3.如权利要求2所述的整合式电子装置，其特征在于，该基座在远离该第一安置平面的一侧面成型有一对支撑板。
4.如权利要求3所述的整合式电子装置，其特征在于，该对支撑板在该基座上形成有一第二容置空间，该第二容置空间中设置有部分的散热片。
5.如权利要求4所述的整合式电子装置，其特征在于，该些散热片包含多个第一散热片及多个第二散热片，该些第一散热片设置在该支撑板上，该些第二散热片设置在该第二容置空间中。
6.如权利要求5所述的整合式电子装置，其特征在于，该些第一散热片及该些第二散热片的延伸方向为垂直。
7.如权利要求4所述的整合式电子装置，其特征在于，该对支撑板分别对应该对肋板延伸，且该支撑板在远离该第二容置空间的一侧与该肋板位于同一平面。
8.如权利要求1所述的整合式电子装置，其特征在于，该第二安置平面设有多个螺孔，各该晶体管通过穿设一螺件而锁固在各该螺孔上。
9.如权利要求5所述的整合式电子装置，其特征在于，该基座在该第一安置平面的二侧分别留有一第二安置平面，且该二第二安置平面分别设置有多个晶体管及多个第一散热片。
10.如权利要求9所述的整合式电子装置，其特征在于，该该些第一散热片位于该支撑板上远离该第一安置平面的一侧。
11.如权利要求1所述的整合式电子装置，其特征在于，该电子装置为一不断电系统，该功率模块为一逆变器模块，该晶体管为开关组件单元。
12.如权利要求1所述的整合式电子装置，其特征在于，其更包括至少一风扇，该风扇位于该散热体的一侧边。
13.如权利要求1所述的整合式电子装置，其特征在于，更包括多个电容元件，该些电容元件设置在该电路板上并位于该散热体的一侧边。
14.如权利要求1所述的整合式电子装置，其特征在于，该散热体及该功率模块的数量为多个，该些散热体及该些功率模块间隔设置在该电路板上。
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