.200847899 九、發明說明： 【發明所屬之技術領域】 本發明係一種電子設備中之散熱裝置，尤其是一種用 於不斷電系統之組裝簡單且具高散熱效率的散熱裝置。 【先前技術】 隨著科技曰新月異的發展，許多電子設備都朝向小型 化、高功率密度化進步中，因此不斷電系統（un— interruptible p〇wer supply，ups)亦有同樣的需求，而 高功率密度及小型化的結果’使得對發熱元件的散熱處理 能力更加棘手。 過去處理散熱的方法多為選用低發熱功率元件、加大 政熱裝置（Heat sink)或是增加風扇來將機箱内的熱帶走， 以避免電子設備内部電子元件過熱損壞而失去功能，但是 足些方法都有增加成本、擴大體積及影響性能規格要求的 缺點，也都與高功率密度、小型化的目的相違背。因此， 有效地提高散熱效率才是最佳的解決方法.。 電子設備中的散熱裝置（Heat sink)，其大多係由材 質較輕的鋁擠壓材製作而成，又由於熱傳效率之理論計算 式如下式： Q = UAt{Tave-T00) (其中Q為熱傳效率；U表示整體熱傳係數（〇verall heat transfer coefflclent) ; At 表示散熱裝置（“Μ。以） 的整體散熱面積）；Tave、τΜ分別表示散熱裝置（Heat sink) 表面平均溫度與流體溫度。） 4 200847899 則會盡量擴大 因此在製作散熱裝置（Heat sink)時 其表面積，以達到最佳的散熱效率。 請參看第五及六圖所示，-般的電子設備（1，）後 側設有風扇（2 〇 )，並於内部設有散熱裝置（3 〇 )， 而白用的散熱裝置（3〇)係包括二對稱的散熱座（3 "， 二散熱座（3 1 )係、分別字型及η字型且對向設置的 框體（3 2 ) ’該框體（3 2 )—側朝另一散熱座（3丄)BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device in an electronic device, and more particularly to a heat dissipating device which is simple in assembly and has high heat dissipation efficiency for an uninterruptible power system. [Prior Art] With the rapid development of technology, many electronic devices are moving toward miniaturization and high power density, so the same requirements are required for un-interruptible p〇wer supply (ups). The result of high power density and miniaturization 'makes the heat dissipation capability of the heating element more difficult. In the past, the method of handling heat dissipation mostly used low-heating power components, increased heat sinks, or added fans to move the tropics inside the chassis to avoid overheating and damage of electronic components inside the electronic device, but the method was lost. Both have the disadvantages of increasing cost, expanding the volume, and affecting performance specifications, and are also contrary to the purpose of high power density and miniaturization. Therefore, effectively improving the heat dissipation efficiency is the best solution. The heat sinks in electronic equipment are mostly made of light-weight aluminum extruded materials, and the theoretical calculation formula of heat transfer efficiency is as follows: Q = UAt{Tave-T00) (where Q For heat transfer efficiency; U means the overall heat transfer coefficient (〇verall heat transfer coefflclent); At represents the heat sink ("Μ."), the overall heat dissipation area); Tave, τΜ respectively represent the heat sink (Heat sink) surface average temperature and Fluid temperature.) 4 200847899 will maximize the surface area of the heat sink when it is made to achieve the best heat dissipation efficiency. Please refer to the fifth and sixth figures, the general electronic equipment (1,) The rear side is equipped with a fan (2 〇) and has a heat sink (3 〇) inside, while the white heat sink (3 〇) includes two symmetrical heat sinks (3 ", two heat sinks (3 1 ), respectively, the font and the y-shaped and oppositely disposed frame (3 2 ) 'the frame (3 2 ) - side facing the other heat sink (3 丄)
的方向平行設有複數片的散熱鰭# ( 3 3 )以增加散熱面 積’而該框體（3 2 )外側則設置有複數個在運作時會發 熱：電子元件（圖中未示），因此當電子元件散出熱量時： 熱量會從框體（3 2)傳導分布至散熱鰭片（3 3)上， 再藉由風扇（2 0 )的轉動使UPS (工，）内部氣體與外界 空氣產生對流，以帶走散熱座（3丄）上的熱量，而達到 散熱的效果。 。而，二散熱座（3 1)上所設置的電子元件並非同 時間作動時，由於設計上的限制常常僅有設置於其中一散 熱座（3 1 )上的電子元件會因作動而產生熱量，使該散 熱座（3 1)溫度升高，而另一散熱座（3 1 )則因附著 其上的電子元件不動作而相對處於低溫狀態，造成整體散 熱裝置（3 0)溫度不均，且另一散熱座（3 1)無法被 利用的缺點，故散熱效率也因此降低。 另外，將兩個散熱座（3 1 )設置在電子設備（1，） 内必須要分別螺固，因此增加組裝上的複雜性。 【發明内容】 5 200847899 座會產生前述的缺 終於研究開發出此 本發明人有鑒於習用的兩個散熱 點’因此經過各種熱流模擬及實驗後， 散熱裝置。 —本餐：之目的係在於提供-種用於電子設備中之組裝 簡皁且具高散熱效率的散熱裝置。 " 為達上述目的，本發明之散熱裝置係包括： 一框體；The direction of the parallel is provided with a plurality of heat sink fins # (3 3 ) to increase the heat dissipation area' and the outer side of the frame body (3 2 ) is provided with a plurality of heats during operation: electronic components (not shown), When the electronic components dissipate heat: The heat is distributed from the frame (32) to the heat sink fins (3 3), and the UPS (the internal gas) and the outside air are rotated by the rotation of the fan (20). Convection is generated to take away the heat from the heat sink (3丄) to achieve heat dissipation. . However, when the electronic components disposed on the two heat sinks (3 1) are not operated at the same time, due to design constraints, only the electronic components disposed on one of the heat sinks (3 1 ) generate heat due to actuation. The temperature of the heat sink (31) is raised, and the other heat sink (3 1 ) is relatively low temperature due to the inability of the electronic components attached thereto to cause the temperature of the heat sink (30) to be uneven. The other heat sink (31) cannot be used, so the heat dissipation efficiency is also reduced. In addition, the arrangement of the two heat sinks (3 1 ) in the electronic device (1,) must be separately screwed, thus increasing the complexity of assembly. SUMMARY OF THE INVENTION 5 200847899 The seat will produce the aforementioned shortcomings. Finally, the research and development of this inventor has given two heat-dissipating points in view of the heat-dissipation of various heat flow simulations and experiments. - This meal: The purpose is to provide a heat sink that is assembled in electronic equipment and has a high heat dissipation efficiency. " In order to achieve the above object, the heat dissipating device of the present invention comprises: a frame;
至少一散熱鰭片，其係設於該框體内部，鍵 之兩側係分別連接於框體内部之其中二側，各散熱續‘二 及散熱鰭片與框體間自然形成若干導流通道。 該散熱裝置外側設有複數個電子元件，因此任一側的 ，子元件作動所產生的熱量，皆會均句傳導至整個框體及 散熱鰭片±，再經由空氣的對流有效率地將熱量帶走，因 ,本發明之散熱裝置整體皆可有效被運用，故使散熱效率 提回，而且本發明並不需要改變原本電子設備中的内部設 十p可達成因此無須增加成本及可有效提升電子設備中 的散熱效果。 【實施方式】 明麥看第一至二圖所示，本發明實施例之散熱裝置（1 〇 )係設置在不斷電系統（un-interruptiMe 口⑽打suppb， ups) ( 1 )内部，其係包括： 一框體（1 1 )，其框體外側寬度為62mm，外側高度 為 58mm ί 至少一散熱鰭片（1 2 ) 本實施例中之散熱鰭片（1 6 200847899 2 )係具有六片，久 於框體（1 1 )内^沾…、韓片（1 2)之兩側係分別連接 及散熱缝片⑴;T對兩側’各散熱縫片（12)間 通道（1 3 )，其中 U成右干導流 而框體（1 1 ) ‘ —…12)的厚度為n Λ 4 1 …、鰭片（1 2 )垂直接觸的兩側厚度 為4.1随，平行的兩 予度 ia ^ ^ ^ ];度為2· 3_，而該平行之兩側盥 相鄰散熱續片⑴）之間以及各散 ：門 的間距皆為6mm。 、丄乙彡之間At least one heat dissipating fin is disposed inside the frame body, and two sides of the key are respectively connected to two sides of the inside of the frame body, and each of the heat dissipation continues to form a plurality of flow guiding channels between the heat dissipating fin and the frame body. . The heat dissipating device is provided with a plurality of electronic components on the outer side of the heat dissipating device. Therefore, the heat generated by the sub-components on either side of the heat dissipating device is transmitted to the entire frame body and the heat dissipating fins ±, and the heat is efficiently transferred through the convection of the air. Therefore, the heat dissipating device of the present invention can be effectively used as a whole, so that the heat dissipating efficiency is recovered, and the present invention does not need to change the internal design of the original electronic device, so that it is not necessary to increase the cost and can effectively improve Heat dissipation in electronic devices. [Embodiment] As shown in the first to second figures of the present invention, the heat dissipating device (1 〇) according to the embodiment of the present invention is disposed inside the uninterruptible power system (un-interruptiMe port (10) hits supb, ups) (1), The system includes: a frame body (1 1 ) having a width outside the frame of 62 mm and an outer height of 58 mm. ί At least one heat dissipation fin (1 2 ) The heat dissipation fin (1 6 200847899 2 ) in the embodiment has six The film is longer than the inside of the frame (1 1 ), the two sides of the Korean film (1 2) are respectively connected and the heat-dissipating slits (1); the opposite sides of the T-side heat-dissipating slits (12) (1 3 Wherein U is a right-handed diversion and the thickness of the frame (1 1 ) '-...12) is n Λ 4 1 ..., and the thickness of both sides of the fin (12) perpendicular contact is 4.1, parallel two Degree ia ^ ^ ^ ]; degree is 2·3_, and the distance between the two sides of the parallel 盥 adjacent heat sink (1)) and each of the scatter gates is 6 mm. Between 丄乙彡
該散熱裝置（；L 〇) # 叙 U J你用鋁擠壓材製成，且該框體 1 )與散熱鰭片（1 P> Z )係以板具直接擠壓一體成型。 請參看第三及四圖戶斤千 間所不，该UPS ( 1 )之後側具有一 風扇（2〇)，而該|劫#班, /政熱衣置（1 〇 ) —側從近UPS (工、 後側至近前側位置分別設有複數個電池供電工作模式 (Battery mode)下作動之 Dc/Dc 場效晶體（M〇sFET) ( 4 工： 及市電正常工作模式（Une m〇de)下作動之輸入整流器 (Rectif ier) ( 4 2 )，其中一位於輸入整流器（4 2 ) 一側的DC/DC場效晶體（4丄）為第一場效晶體（4丄a )， 該散熱It置（1 Q )另側從& ups ( i )後側位置至前側 分別設有市電供電工作模式（Line m〇de)下作動之第一功 率二極體（第一 PFC Diode) ( 4 3 )、第二功率二極體（第 二PFC Diode) ( 4 4 )，及兩種工作模式下皆作動之第一 包源轉換為'絕緣栅雙極晶體管（第一 inverter jGBT) ( 4 可將 5 )及第二電源轉換器絕緣柵雙極晶體管（第二inverter IGBT) (46)等，藉由本發明之散熱裝置（1 〇) 7 200847899 不Μ作動兩側之電子元件產生的熱量均勻地分佈其上， :精由風扇（2 0 )運作而讓空氣循環以帶走散熱 〇)上的熱量。 上述能導引流體流經該散熱裝置之導流通道（i 3) 的風扇（2 0 )，可直接設置在框體（工工）侧邊，並設 有一使風扇（20)與散熱裝置之導流通道（13)連通 的開口，以形成一散熱模組。 • 列： 千请芩看第四圖所示之配置，當該UPS ( 1 )在市電供 電工作模式（line mode)或電池供電工作模式（battery mode)下，對照習用散熱裝置與本發明之散熱裝置（1 〇 ) 的散熱效果。 測試1. φ 、田口亥UPS在市電供電工作模式（1 ine mode)，且施予1 7〇 伏特的AC輸入電壓，經過一定時間、溫度且系統穩定後， 則政熱裝置上各重要相關元件的溫度比較係表示於表一： 表一 設置於散熱裝置之電子元件 習用 本發明 (溫度/°c ) 溫度差 (°C ) 第一功率二極體（4 3 ) ___66. 7 49. 4 -17. 3 第二功率二極體（44) 67. 2 54. 3 -12. 9 第一 inverter IGBT ( 4 R ) ~——------- "-—---- 63 -12· 1 8 200847899 第二 inverter IGBT ( 4 6 ) ----------1— ---〜 ------- 73 66· 7 第一場效晶體（4 1 a ) 52· 1 50 3 - 6 · 3 輸入整流器（4 ? 1 64. 9 ___ 69. 4 __ -1.8 測試2. 當該UPS由測試1之實驗結束後切換工作禮 IF保式到電池 供電模式且外掛電池箱使能工作達30分鐘， 、、工過一定時 間溫度系統穩定後，則散熱裝置上各重要相關 I十的溫度 比較係表示於表二：The heat sink (L 〇) # U U J You are made of aluminum extrusion material, and the frame 1) and the heat dissipation fins (1 P> Z) are directly extruded and integrally formed with the plate. Please refer to the third and fourth maps of the households. The UPS (1) has a fan (2〇) on the back side, and the | robbed #班, / political hot clothes (1 〇) - side from near UPS (Dc/Dc field effect crystal (M〇sFET) operated by a plurality of battery-operated battery modes in the rear side to the front side (4 workers: and the normal working mode of the mains (Une m〇de) The input rectifier (Rectifier) (4 2 ), one of the DC/DC field effect crystals (4丄) on the side of the input rectifier (4 2 ) is the first field effect crystal (4丄a), the heat dissipation It sets (1 Q ) on the other side from the rear side of the & ups ( i ) to the front side respectively with the first power diode (first PFC Diode) operating under the mains supply mode (Line m〇de) ( 4 3), the second power diode (second PFC Diode) (4 4), and the first source of the two operating modes are converted to 'insulated gate bipolar transistor (first inverter jGBT) (4 can 5) and the second power converter insulated gate bipolar transistor (second inverter IGBT) (46), etc., by the heat sink of the present invention (1 〇) 7 200847899 does not work The heat generated by the electronic components on both sides is evenly distributed, and the heat is circulated by the fan (20) to circulate the air to carry away heat. The above-mentioned guiding fluid can guide the flow of the fluid through the heat sink. The fan (20) of the channel (i3) can be directly disposed at the side of the frame (worker), and has an opening for connecting the fan (20) with the flow guiding channel (13) of the heat sink to form a Cooling module. • Column: Please refer to the configuration shown in Figure 4. When the UPS (1) is in the line mode or battery mode, compare the conventional heat sink with The heat dissipation effect of the heat sink (1 〇) of the present invention. Test 1. φ, Taguchi UPS is in the 1 ine mode, and the AC input voltage of 1 7 volts is applied, after a certain time and temperature. After the system is stabilized, the temperature comparison of the important related components on the thermal heating device is shown in Table 1: Table 1 Electronic components disposed in the heat sink device The present invention (temperature / °c) Temperature difference (°C) First power two Polar body (4 3 ) ___66. 7 49. 4 -17 . 3 second power diode (44) 67. 2 54. 3 -12. 9 first inverter IGBT ( 4 R ) ~ --------- "------ 63 -12 · 1 8 200847899 Second inverter IGBT ( 4 6 ) ----------1— ---~ ------- 73 66· 7 First field effect crystal (4 1 a ) 52 · 1 50 3 - 6 · 3 input rectifier (4 ? 1 64. 9 ___ 69. 4 __ -1.8 test 2. When the UPS is finished by the test of test 1, switch the work IF mode to battery power mode and plug the battery After the box is enabled for 30 minutes, and after a certain period of time, the temperature system is stable, then the temperature comparison of the important related I on the heat sink is shown in Table 2:
測試3. 當該UPS由測試2之實驗結束後切換回市電供電工作 模式⑴ne ，且施予272伏特的κ輸入電壓，則散 熱裝置上各重要相關元件的溫度比較係表示於表三： 表 件 r-_— 習用 本發明 溫度差 」（溫度/°C ) (溫度/°C ) (°C ) 設置於散熱裝置之電子元 9 200847899Test 3. When the UPS is switched back to the mains supply mode (1)ne after the end of the test of test 2, and the κ input voltage of 272 volts is applied, the temperature comparison of the important related components on the heat sink is shown in Table 3: R-_- Conventional temperature difference" (temperature / °C) (temperature / °C) (°C) Electron element set in the heat sink 9 200847899
〇 ) 本 均 力σ ) 藉由上述實施例中可得知，本發明之散熱裝置（ 能有效地帶走作動電子元件產生的熱量，實驗結果顯; 發明之散熱裝f ( 1 〇 )不僅能有效將電子元件的熱4 勾傳導至整個《，並且能ϋ由成型的複數個導流通: 強空氣對流而達到快速散熱的效果，因此對於〕 的發展具有相當大的助益。 另外，本發明之散熱裝置（i 〇 )僅具有一框體（工 1 )，因此將其組裝於該UPS ( 1 )内可節省時間且相當 方便。 【圖式簡單說明】 第一圖係本發明之立體圖。 第二圖係本發明之前視圖。 第二圖係本發明裝設於不斷電系統内之立體圖。 第四圖係本發明裝設於不斷電系統内之使用狀態側視 圖。 第五圖係習用散熱裝置之立體圖。 第六圖係習用散熱裝置裝設於不斷電系統内之立體 10 200847899 圖。 【主要元件符號說明】 (1 ) ( 1 ’）不斷電系統（USP) (1 0 )散熱裝置 (1 1 )框體 (1 2 )散熱鰭片 (1 3 )導流通道 (2 0 )風扇 # ( 3 0 )散熱裝置 (3 1 )散熱座 (3 2 )框體 (3 3 )散熱鰭片 (4 1 ) DC/DC場效晶體 (4 1 a )第一場效晶體 (4 2 )輸入整流器 (4 3 )第一功率二極體（第一 PFC Diode) • ( 4 4 )第二功率二極體（第二PFC Diode) (4 5 )第一電源轉換器絕緣柵雙極晶體管（第一 inverter IGBT) (4 6 )第二電源轉換器絕緣柵雙極晶體管（第二 inverter IGBT) 11〇) The average force σ) It can be known from the above embodiments that the heat dissipating device of the present invention can effectively take away the heat generated by the actuating electronic component, and the experimental result is obvious; the heat dissipating device f (1 〇) of the invention can not only Effectively transferring the thermal element of the electronic component to the whole ", and can be circulated by the formed plurality of conductive channels: strong air convection to achieve rapid heat dissipation, and thus has considerable advantages for the development of the invention. In addition, the present invention The heat sink (i 〇) has only one frame (work 1), so it can save time and is quite convenient to assemble it in the UPS (1). [Simplified illustration] The first figure is a perspective view of the present invention. The second drawing is a front view of the present invention. The second drawing is a perspective view of the present invention installed in an uninterruptible power system. The fourth drawing is a side view of the state of use of the present invention installed in an uninterruptible power system. A perspective view of a conventional heat sink. The sixth figure is a stereo 10 installed in an uninterruptible power system. 200847899. [Main component symbol description] (1) (1 ') Uninterruptible power system (USP) (1 0 Heat sink (1) 1) Frame (1 2 ) Heat sink fin (1 3 ) Guide channel (2 0 ) Fan # ( 3 0 ) Heat sink (3 1 ) Heat sink (3 2 ) Frame (3 3 ) Heat sink fin ( 4 1) DC/DC field effect crystal (4 1 a) first field effect crystal (4 2 ) input rectifier (4 3 ) first power diode (first PFC Diode) • ( 4 4 ) second power 2 Polar body (second PFC Diode) (4 5 ) first power converter insulated gate bipolar transistor (first inverter IGBT) (4 6 ) second power converter insulated gate bipolar transistor (second inverter IGBT) 11