CN103124807B - 用于电子产品制造中的锡银浸镀法 - Google Patents

用于电子产品制造中的锡银浸镀法 Download PDF

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Publication number
CN103124807B
CN103124807B CN201080059776.0A CN201080059776A CN103124807B CN 103124807 B CN103124807 B CN 103124807B CN 201080059776 A CN201080059776 A CN 201080059776A CN 103124807 B CN103124807 B CN 103124807B
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CN
China
Prior art keywords
tin
copper
coating
temperature
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080059776.0A
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English (en)
Chinese (zh)
Other versions
CN103124807A (zh
Inventor
邱勇亨
王兴平
王才
罗伯特·法雷尔
叶萍萍
小爱德华·J·库德拉克
卡尔·F·温根罗思
约瑟夫·A·阿比斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of CN103124807A publication Critical patent/CN103124807A/zh
Application granted granted Critical
Publication of CN103124807B publication Critical patent/CN103124807B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201080059776.0A 2009-10-28 2010-10-28 用于电子产品制造中的锡银浸镀法 Expired - Fee Related CN103124807B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/607,375 2009-10-28
US12/607,375 US9175400B2 (en) 2009-10-28 2009-10-28 Immersion tin silver plating in electronics manufacture
PCT/US2010/054413 WO2011056698A2 (en) 2009-10-28 2010-10-28 Immersion tin silver plating in electronics manufacture

Publications (2)

Publication Number Publication Date
CN103124807A CN103124807A (zh) 2013-05-29
CN103124807B true CN103124807B (zh) 2015-11-25

Family

ID=43828214

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080059776.0A Expired - Fee Related CN103124807B (zh) 2009-10-28 2010-10-28 用于电子产品制造中的锡银浸镀法

Country Status (8)

Country Link
US (1) US9175400B2 (cg-RX-API-DMAC7.html)
EP (1) EP2494094B1 (cg-RX-API-DMAC7.html)
JP (1) JP2013517375A (cg-RX-API-DMAC7.html)
KR (1) KR20120099697A (cg-RX-API-DMAC7.html)
CN (1) CN103124807B (cg-RX-API-DMAC7.html)
ES (1) ES2712079T3 (cg-RX-API-DMAC7.html)
TW (1) TW201132796A (cg-RX-API-DMAC7.html)
WO (1) WO2011056698A2 (cg-RX-API-DMAC7.html)

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FR2993579B1 (fr) * 2012-07-20 2015-09-25 Tyco Electronics France Sas Procede de revetement et revetement pour contact a insertion a force
US20140225231A1 (en) * 2013-02-12 2014-08-14 International Business Machines Corporation Modulating bow of thin wafers
JP6186596B2 (ja) * 2013-10-23 2017-08-30 石原ケミカル株式会社 接触型無電解スズメッキ方法
TWI588292B (zh) * 2014-10-24 2017-06-21 國立高雄應用科技大學 錫銀膠體奈米粒子、及其製造方法與應用
US9847468B1 (en) * 2016-06-20 2017-12-19 Asm Technology Singapore Pte Ltd Plated lead frame including doped silver layer
US10774425B2 (en) 2017-05-30 2020-09-15 Macdermid Enthone Inc. Elimination of H2S in immersion tin plating solution
DE102018109059B4 (de) 2018-01-15 2020-07-23 Doduco Solutions Gmbh Elektrischer Einpress-Kontaktstift
CN113061827A (zh) * 2021-02-25 2021-07-02 宁波博威合金板带有限公司 一种热浸镀锡银合金涂层及其制备方法和应用
CN114340188B (zh) * 2021-12-30 2024-11-19 清远市富盈电子有限公司 改善无铅喷锡板pth槽孔铜层起泡分层生产方法
JP7582243B2 (ja) * 2022-04-14 2024-11-13 トヨタ自動車株式会社 電波透過性金属調部材及びその製造方法
CN114905106B (zh) * 2022-05-23 2023-03-24 北京科技大学 一种基于Cu6Sn5取向复合涂层制备的Cu/SnAgCu/Cu钎焊方法

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US3303029A (en) * 1964-01-23 1967-02-07 Shipley Co Tin coating of copper surfaces by replacement plating
CN1649676A (zh) * 2002-04-30 2005-08-03 技术公司 在锡的电沉积物中最小化晶须生长
US20070037377A1 (en) * 2005-08-15 2007-02-15 Enthone Inc. Tin-silver solder bumping in electronics manufacture
CN101031367A (zh) * 2004-07-29 2007-09-05 恩索恩公司 电子产品生产中的镀银
US20070284258A1 (en) * 2006-06-09 2007-12-13 Masakazu Yoshimoto Method For Silver Plating
EP1947215A2 (en) * 2007-01-22 2008-07-23 C. Uyemura & Co, Ltd Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance
CN100478492C (zh) * 2002-11-27 2009-04-15 技术公司 提高镀敷在基底上的金属涂层的再流动性能或可焊接性的方法
JP2009155703A (ja) * 2007-12-27 2009-07-16 Ishihara Chem Co Ltd 無電解メッキによるスズホイスカーの防止方法

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US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
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JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
DE19954613A1 (de) * 1999-11-12 2001-05-17 Enthone Omi Deutschland Gmbh Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
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JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303029A (en) * 1964-01-23 1967-02-07 Shipley Co Tin coating of copper surfaces by replacement plating
CN1649676A (zh) * 2002-04-30 2005-08-03 技术公司 在锡的电沉积物中最小化晶须生长
CN100478492C (zh) * 2002-11-27 2009-04-15 技术公司 提高镀敷在基底上的金属涂层的再流动性能或可焊接性的方法
CN101031367A (zh) * 2004-07-29 2007-09-05 恩索恩公司 电子产品生产中的镀银
US20070037377A1 (en) * 2005-08-15 2007-02-15 Enthone Inc. Tin-silver solder bumping in electronics manufacture
US20070284258A1 (en) * 2006-06-09 2007-12-13 Masakazu Yoshimoto Method For Silver Plating
EP1947215A2 (en) * 2007-01-22 2008-07-23 C. Uyemura & Co, Ltd Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance
JP2009155703A (ja) * 2007-12-27 2009-07-16 Ishihara Chem Co Ltd 無電解メッキによるスズホイスカーの防止方法

Also Published As

Publication number Publication date
EP2494094A2 (en) 2012-09-05
US20110097597A1 (en) 2011-04-28
TW201132796A (en) 2011-10-01
WO2011056698A3 (en) 2013-04-18
CN103124807A (zh) 2013-05-29
ES2712079T3 (es) 2019-05-09
EP2494094B1 (en) 2018-12-05
WO2011056698A2 (en) 2011-05-12
US9175400B2 (en) 2015-11-03
JP2013517375A (ja) 2013-05-16
KR20120099697A (ko) 2012-09-11

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20211028