JP2012511105A - 無電解パラジウムめっき液及び使用法 - Google Patents
無電解パラジウムめっき液及び使用法 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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Abstract
Description
本国際特許出願は、本明細書に参照により組み込まれる2008年12月5日出願の米国仮出願第61/120,127号の優先権及び利益を主張する。
(μ”)/分)の速度で沈着させることを含む。本発明の別の実施形態において、パラジウムの層を金属表面上へ被着させるのは、約40℃〜約70℃の範囲の温度で行われる。本発明のさらに別の実施形態において、金属表面上に沈着するパラジウムの層は、厚さが約0.1μm〜約1.0μm(約4マイクロインチ〜約40マイクロインチ)の範囲である。時間及び温度に対するパラジウムの層の厚みを示す代表的なグラフは、図1で見られる。
酸洗浄浴組成
成分 量
脱イオン水 約88.9体積%
グリコール酸 約5.0体積%
硫酸 約1.0体積%
リン酸 約5.0体積%
湿潤剤 約0.05体積%
キレート剤 約0.05体積%
マイクロエッチング浴組成
成分 量
脱イオン水 約50体積%
硫酸過酸化物 約25体積%
硫酸 約25体積%
以下の組成の活性化浴を、物品の金属表面の活性化に使用した:
以下の組成の無電解パラジウム浴を、物品の金属表面のめっきに使用した:
成分 量(g/L)
水 1Lまで
クエン酸アンモニウム 15.0g/l,
水酸化アンモニウム(58%) 24mL
フェノールスルホン酸ナトリウム 0.25g/L
硫酸パラジウム溶液(40g/L) 20mL
pH 9.1
1)Mil−Std−883 Method 2003−「Solderability(はんだ濡れ性)」;
2)IPC JSTD−002−「Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires(部品リード、末端、取っ手、端子、及びワイヤのはんだ濡れ性試験)」;
3)IPC JSTD−003−「Solderability Tests for Printed Boards(プリント基板のはんだ濡れ性試験)」;及び
4)JESD22−B102;及び5)IEC 60749のPart 21。
γSV+γSL+γLV=0,
γSV=γSL+γLV・cosθ(ヤングの関係)
F=γLV・cosθ・P−ρ・v(ラプラスの法則)
式中、様々なパラメータは以下によって定義される:
F=毛管力;
ρ=溶融合金の比重;
v=部品が溶融合金中に浸漬された部分の体積;
ρ・v=部品が溶融合金中に浸漬された部分によって生じるアルキメデスの原理による浮力;
γSV=固体部品/フラックス蒸気の表面張力;
γSL=固体部品/溶融合金の表面張力;
γLV=溶融合金/フラックス蒸気の表面張力;及び
P=部品の濡れ可能な周囲長
0°<θ<30° 非常に良好な濡れ
30°<θ<40° 良好な濡れ
40°<θ<55° 許容可能な濡れ
55°<θ<70° 濡れが悪い
θ>70° 非常に濡れが悪い
a.試料がはんだ浴の表面に達する;
b.試料が浸漬深さの端にある;
c.力が平衡である;
d.最大の濡れ力が測定される;
e.試料がはんだ浴から持ち上げられる;及び
f.試料がはんだ浴から取り出される。
Claims (20)
- 極性溶媒と;
少なくとも1つのパラジウム塩と;
少なくとも1つの非窒素化錯化剤と;
めっき液を少なくとも8.0のpHに調整するアルカリ性調整剤と;
還元剤と
を含む、無電解めっき液。 - 少なくとも1つのパラジウム塩が、硫酸パラジウム、塩化パラジウム、酢酸パラジウム、及びそれらの混合物からなる群から選択される、請求項1に記載のめっき液。
- 非窒素化錯化剤が、クエン酸ナトリウム、クエン酸アンモニウム、リンゴ酸ナトリウム、フェノールスルホン酸ナトリウム、酒石酸ナトリウム、酒石酸カリウムナトリウム、及びそれらの混合物からなる群から選択される、請求項1に記載のめっき液。
- アルカリ性調整剤が水酸化アンモニウムである、請求項1に記載のめっき液。
- 還元剤がギ酸の塩である、請求項1に記載のめっき液。
- ギ酸の塩がギ酸ナトリウムである、請求項5に記載のめっき液。
- 極性溶媒が水である、請求項1に記載のめっき液。
- めっき液のpHが少なくとも9.0である、請求項1に記載のめっき液。
- 物品の表面にパラジウムの層を形成する方法であって、
回路基板、微小電極、及び電子部品からなる群から選択される、金属表面を有する物品を提供するステップと;
8.0を超えるpHのパラジウム塩を含む作業浴を提供するステップと;
クエン酸ナトリウム、クエン酸アンモニウム、リンゴ酸ナトリウム、フェノールスルホン酸ナトリウム、酒石酸ナトリウム、及び酒石酸カリウムナトリウムからなる群から選択される、少なくとも1つの非窒素化錯化剤を提供するステップと;
還元剤を提供することにより浴からパラジウムを還元させるステップと;
パラジウムの層が金属表面の少なくとも一部に形成されるように、金属表面を浴に接触させるステップと
を含む方法。 - 硫酸過酸化物の浴中で金属表面にマイクロエッチングを施すステップと;
パラジウム塩を含む酸性浴に金属表面を接触させることにより、金属表面を活性化させるステップと
をさらに含む、請求項9に記載の方法。 - 金属表面を活性化させるための酸性浴が、酸化剤、エトキシ化アルコール及びポリオールをさらに含む、請求項10に記載の方法。
- pHが少なくとも9.0である、請求項9に記載の方法。
- 還元剤がギ酸の塩である、請求項9に記載の方法。
- ギ酸の塩がギ酸ナトリウムである、請求項13に記載の方法。
- パラジウムの層を金属表面上に約0.025μm/分〜約0.075μm/分(約1マイクロインチ/分〜約3マイクロインチ/分)の速度で沈着させる、請求項9に記載の方法。
- パラジウムの層を金属表面上に約40℃〜約70℃の範囲の温度で沈着させる、請求項15に記載の方法。
- 金属表面上に沈着するパラジウムの層が、約0.1μm〜約1.0μm(約4マイクロインチ〜約40マイクロインチ)の範囲の厚みを有する、請求項9に記載の方法。
- 金属表面が、銅、銀、ニッケル、及びコバルトのうちの少なくとも1つを含む、請求項9に記載の方法。
- 金属表面が、銅、銀、ニッケル、及びコバルトからなる群から選択される元素の合金を含む、請求項9に記載の方法。
- 水と;
硫酸パラジウムと;
クエン酸アンモニウムと;
めっき液を少なくとも8.0のpHに調整する水酸化アンモニウムと;
フェノールスルホン酸ナトリウムと;
ギ酸ナトリウムと
を含む無電解めっき液。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12012708P | 2008-12-05 | 2008-12-05 | |
US61/120,127 | 2008-12-05 | ||
PCT/US2009/066767 WO2010065851A2 (en) | 2008-12-05 | 2009-12-04 | Electroless palladium plating solution and method of use |
Publications (1)
Publication Number | Publication Date |
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JP2012511105A true JP2012511105A (ja) | 2012-05-17 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011539735A Pending JP2012511105A (ja) | 2008-12-05 | 2009-12-04 | 無電解パラジウムめっき液及び使用法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110236565A1 (ja) |
EP (1) | EP2373831A4 (ja) |
JP (1) | JP2012511105A (ja) |
KR (1) | KR20110105371A (ja) |
CN (1) | CN102245806A (ja) |
WO (1) | WO2010065851A2 (ja) |
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TW201302616A (zh) * | 2011-07-12 | 2013-01-16 | Ind Tech Res Inst | 硫化銦薄膜的製備方法 |
CN103184441B (zh) * | 2011-12-30 | 2015-04-01 | 中国科学院长春应用化学研究所 | 钯纳米薄膜的制备方法和钯/铂纳米薄膜的制备方法 |
KR101617654B1 (ko) | 2013-08-23 | 2016-05-03 | 숭실대학교 산학협력단 | 무전해 도금법을 이용한 팔라듐 박막 제조방법 |
US20150307995A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS |
CN103981514A (zh) * | 2014-06-11 | 2014-08-13 | 深圳市兴经纬科技开发有限公司 | 一种电路板化学镀镍的活化液及活化方法 |
EP3271500B1 (en) * | 2015-03-20 | 2018-06-20 | ATOTECH Deutschland GmbH | Activation method for silicon substrates |
CN105296974A (zh) * | 2015-08-27 | 2016-02-03 | 中国科学院兰州化学物理研究所 | 一种镀钯液及使用其在铜表面镀钯的方法 |
ES2646237B2 (es) * | 2017-09-28 | 2018-07-27 | Avanzare Innovacion Tecnologica S.L. | Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos |
US20190394888A1 (en) * | 2018-06-21 | 2019-12-26 | Averatek Corporation | Patterning of electroless metals |
CN114086160A (zh) * | 2021-11-10 | 2022-02-25 | 江苏艾森半导体材料股份有限公司 | 一种铜表面化学镀钯活化液及其应用 |
CN115110070B (zh) * | 2022-07-13 | 2023-10-27 | 上海天承化学有限公司 | 一种用于离子钯活化工艺的预浸液及其应用 |
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KR101329989B1 (ko) * | 2006-11-06 | 2013-11-15 | 우에무라 고교 가부시키가이샤 | 다이렉트 플레이팅 방법 및 팔라듐 도전체층 형성 용액 |
JP4885954B2 (ja) * | 2007-02-28 | 2012-02-29 | 小島化学薬品株式会社 | 無電解純パラジウムめっき液 |
JP5013077B2 (ja) * | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | 無電解金めっき方法及び電子部品 |
GB0719260D0 (en) * | 2007-10-03 | 2007-11-14 | Univ Napier | Method for the manufacturing of an anode for fuel cell |
-
2009
- 2009-12-04 WO PCT/US2009/066767 patent/WO2010065851A2/en active Application Filing
- 2009-12-04 CN CN2009801490448A patent/CN102245806A/zh active Pending
- 2009-12-04 JP JP2011539735A patent/JP2012511105A/ja active Pending
- 2009-12-04 EP EP09831189.7A patent/EP2373831A4/en not_active Withdrawn
- 2009-12-04 US US13/130,637 patent/US20110236565A1/en not_active Abandoned
- 2009-12-04 KR KR1020117009235A patent/KR20110105371A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001295061A (ja) * | 2000-04-10 | 2001-10-26 | Hideo Honma | 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品 |
WO2007010760A1 (ja) * | 2005-07-20 | 2007-01-25 | Nippon Mining & Metals Co., Ltd. | 無電解パラジウムめっき液 |
JP4117016B1 (ja) * | 2007-08-15 | 2008-07-09 | 小島化学薬品株式会社 | 無電解パラジウムめっき液 |
Also Published As
Publication number | Publication date |
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EP2373831A2 (en) | 2011-10-12 |
EP2373831A4 (en) | 2013-11-27 |
CN102245806A (zh) | 2011-11-16 |
WO2010065851A2 (en) | 2010-06-10 |
KR20110105371A (ko) | 2011-09-26 |
US20110236565A1 (en) | 2011-09-29 |
WO2010065851A3 (en) | 2010-09-16 |
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