CN102918934B - 柔性电路基板 - Google Patents

柔性电路基板 Download PDF

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Publication number
CN102918934B
CN102918934B CN201080067037.6A CN201080067037A CN102918934B CN 102918934 B CN102918934 B CN 102918934B CN 201080067037 A CN201080067037 A CN 201080067037A CN 102918934 B CN102918934 B CN 102918934B
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CN
China
Prior art keywords
heat dissipation
layer
flexible circuit
circuit board
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080067037.6A
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English (en)
Chinese (zh)
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CN102918934A (zh
Inventor
加治屋笃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meikeda Co ltd
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN102918934A publication Critical patent/CN102918934A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/047—Box-like arrangements of PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN201080067037.6A 2010-05-27 2010-12-24 柔性电路基板 Active CN102918934B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010121519A JP5463205B2 (ja) 2010-05-27 2010-05-27 フレキシブル回路基板
JP2010-121519 2010-05-27
PCT/JP2010/073385 WO2011148532A1 (ja) 2010-05-27 2010-12-24 フレキシブル回路基板

Publications (2)

Publication Number Publication Date
CN102918934A CN102918934A (zh) 2013-02-06
CN102918934B true CN102918934B (zh) 2015-11-25

Family

ID=45003536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080067037.6A Active CN102918934B (zh) 2010-05-27 2010-12-24 柔性电路基板

Country Status (6)

Country Link
US (1) US9089050B2 (enExample)
EP (1) EP2579692B1 (enExample)
JP (1) JP5463205B2 (enExample)
CN (1) CN102918934B (enExample)
TW (1) TWI514936B (enExample)
WO (1) WO2011148532A1 (enExample)

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JP5274586B2 (ja) * 2011-01-17 2013-08-28 キヤノン・コンポーネンツ株式会社 フレキシブル回路基板
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JP5942507B2 (ja) * 2012-03-16 2016-06-29 日立化成株式会社 電子部品の製造方法
JP6212482B2 (ja) * 2012-04-13 2017-10-11 日本発條株式会社 銅ベース回路基板
JP6344689B2 (ja) * 2013-07-16 2018-06-20 パナソニックＩｐマネジメント株式会社 基板、発光装置、照明用光源、および照明装置
JP6335619B2 (ja) 2014-01-14 2018-05-30 新光電気工業株式会社 配線基板及び半導体パッケージ
WO2015153476A1 (en) 2014-03-31 2015-10-08 The Regents Of The University Of California Methods of producing glycolipids
CN104019385B (zh) * 2014-04-21 2016-08-31 上海霓弘光电科技有限公司 一种立方体led发光器件
JP6317989B2 (ja) 2014-04-24 2018-04-25 新光電気工業株式会社 配線基板
JP2015225984A (ja) * 2014-05-29 2015-12-14 イビデン株式会社 回路基板及びその製造方法
TWI573503B (zh) * 2014-06-09 2017-03-01 The Power Supply Path Structure of Soft Circuit Board
CN107004752B (zh) * 2014-12-08 2019-04-26 夏普株式会社 发光装置用基板、发光装置以及照明装置
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JP6518451B2 (ja) 2015-02-02 2019-05-22 株式会社フジクラ 伸縮性回路基板
US10420538B2 (en) 2015-02-05 2019-09-24 Obp Medical Corporation Illuminated surgical retractor
US9867602B2 (en) 2015-02-05 2018-01-16 Obp Medical Corporation Illuminated surgical retractor
TWI611740B (zh) * 2015-02-05 2018-01-11 頎邦科技股份有限公司 可撓性基板
CN208657154U (zh) * 2015-03-20 2019-03-26 3M创新有限公司 用于附接发光半导体装置的柔性多层基板
JP6284277B2 (ja) * 2015-04-15 2018-02-28 ミネベアミツミ株式会社 面状照明装置
JP6333215B2 (ja) * 2015-05-19 2018-05-30 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
US10939899B2 (en) 2015-06-03 2021-03-09 Obp Medical Corporation End cap assembly for retractor and other medical devices
US10881387B2 (en) 2015-06-03 2021-01-05 Obp Medical Corporation Retractor
CN106488652B (zh) * 2015-08-25 2019-10-18 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
US10257932B2 (en) * 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
US10722621B2 (en) 2016-07-11 2020-07-28 Obp Medical Corporation Illuminated suction device
JP6541629B2 (ja) * 2016-08-02 2019-07-10 ゼネラル・エレクトリック・カンパニイ 発光半導体を相互接続するためのオーバーレイ回路構造
JP2018041803A (ja) * 2016-09-06 2018-03-15 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
WO2018060231A1 (en) * 2016-09-27 2018-04-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Highly thermally conductive dielectric structure for heat spreading in component carrier
US9805972B1 (en) * 2017-02-20 2017-10-31 Globalfoundries Inc. Skip via structures
CN110419097B (zh) * 2017-03-23 2023-04-18 三菱电机株式会社 半导体元件接合体及其制造方法、半导体装置
CN112996269A (zh) * 2017-04-12 2021-06-18 健鼎（无锡）电子有限公司 高散热效率电路板及其制作方法
KR20190006344A (ko) * 2017-07-10 2019-01-18 송영석 방열 무선통신 안테나 구조
WO2019018470A1 (en) 2017-07-18 2019-01-24 Obp Medical Corporation MINIMUM CONTACT-FREE BREAKING ACT (MINT) FOR REMOVING THE GREAT SAPHENE VEIN (GSV) AND HYDRODUCTOR AND VENOUS SCRAPER FOR USE IN THE MINT ACT
KR102059478B1 (ko) * 2017-09-15 2019-12-26 스템코 주식회사 회로 기판 및 그 제조 방법
US10278572B1 (en) 2017-10-19 2019-05-07 Obp Medical Corporation Speculum
US10799229B2 (en) 2018-02-20 2020-10-13 Obp Medical Corporation Illuminated medical devices
EP4606345A3 (en) * 2018-02-20 2025-12-17 CooperSurgical, Inc. Illuminated medical devices
DE102018111791A1 (de) * 2018-05-16 2019-11-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
USD911521S1 (en) 2019-02-19 2021-02-23 Obp Medical Corporation Handle for medical devices including surgical retractors
WO2020195544A1 (ja) * 2019-03-25 2020-10-01 株式会社村田製作所 伸縮性実装基板
KR102647414B1 (ko) * 2019-10-11 2024-03-12 엘지디스플레이 주식회사 스트레쳐블 표시장치
JP2021082639A (ja) * 2019-11-15 2021-05-27 日本メクトロン株式会社 フレキシブルプリント基板及びフレキシブルプリント基板の製造方法
US11500433B2 (en) 2020-01-14 2022-11-15 Au Optronics Corporation Flexible electronic device
TW202032226A (zh) * 2020-01-14 2020-09-01 友達光電股份有限公司 軟性電路結構
US10959609B1 (en) 2020-01-31 2021-03-30 Obp Medical Corporation Illuminated suction device
US10966702B1 (en) * 2020-02-25 2021-04-06 Obp Medical Corporation Illuminated dual-blade retractor
JP7535922B2 (ja) * 2020-11-26 2024-08-19 メクテック株式会社 フレキシブル回路基板の成形装置及び成形方法
JP7559972B2 (ja) * 2021-10-22 2024-10-02 株式会社村田製作所 伸縮性実装基板
US12318080B2 (en) 2023-07-21 2025-06-03 Coopersurgical, Inc. Illuminated surgical retractor capable of hand-held operation and of being mounted to a fixed frame
CN117794081A (zh) * 2024-01-02 2024-03-29 深圳恒宝士线路板有限公司 一种双层单侧铜基热电分离基板的制作方法
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US20100079989A1 (en) * 2008-09-27 2010-04-01 Kuang-Chao Yeh Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip

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US5268813A (en) * 1990-12-12 1993-12-07 International Business Machines Corp. Flexible printed circuit package and flexible printed circuit for incorporating in such a package
CN1388777A (zh) * 2000-08-25 2003-01-01 三井金属鉱业株式会社 包铜层压板
US20030089519A1 (en) * 2001-11-13 2003-05-15 Kenichi Okada Flexible printed circuit
JP2004351759A (ja) * 2003-05-29 2004-12-16 Mitsui Chemicals Inc 反りの小さい樹脂金属積層板及びその製造方法
CN101180925A (zh) * 2005-05-20 2008-05-14 日立化成工业株式会社 印制电路板
JP2007294619A (ja) * 2006-04-24 2007-11-08 Nec Saitama Ltd 放熱構造
US20090226656A1 (en) * 2008-03-06 2009-09-10 Stylmark, Inc. Layered structure for use with high power light emitting diode systems
TW201008403A (en) * 2008-07-11 2010-02-16 Mitsui Mining & Smelting Co Printed circuit board having excellent heat dissipation
US20100079989A1 (en) * 2008-09-27 2010-04-01 Kuang-Chao Yeh Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip

Also Published As

Publication number Publication date
TW201220975A (en) 2012-05-16
TWI514936B (zh) 2015-12-21
JP2011249574A (ja) 2011-12-08
JP5463205B2 (ja) 2014-04-09
WO2011148532A1 (ja) 2011-12-01
EP2579692A4 (en) 2015-06-03
US9089050B2 (en) 2015-07-21
EP2579692A1 (en) 2013-04-10
CN102918934A (zh) 2013-02-06
EP2579692B1 (en) 2018-08-15
US20130092421A1 (en) 2013-04-18

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CP03 Change of name, title or address

Address after: Tokyo, Japan, the port district, Zhi Zhi, Ding Ding, No. 12, No. 15

Patentee after: Meikeda Co.,Ltd.

Country or region after: Japan

Address before: Tokyo, Japan, the port district, Zhi Zhi, Ding Ding, No. 12, No. 15

Patentee before: NIPPON MEKTRON, Ltd.

Country or region before: Japan

CP03 Change of name, title or address