CN102712753B - 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法 - Google Patents

热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法 Download PDF

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CN102712753B
CN102712753B CN201080051264.XA CN201080051264A CN102712753B CN 102712753 B CN102712753 B CN 102712753B CN 201080051264 A CN201080051264 A CN 201080051264A CN 102712753 B CN102712753 B CN 102712753B
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film
dianhydride
polyimide
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pmda
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CN102712753A (zh
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B·C·奥曼
M·L·邓巴
T·何
K·库塔基斯
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EIDP Inc
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EI Du Pont de Nemours and Co
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CN201080051264.XA 2009-11-20 2010-11-19 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法 Expired - Fee Related CN102712753B (zh)

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Application Number Priority Date Filing Date Title
US26326609P 2009-11-20 2009-11-20
US61/263,266 2009-11-20
PCT/US2010/057379 WO2011063204A1 (en) 2009-11-20 2010-11-19 Thermally and dimensionally stable polyimide films and methods relating thereto

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CN102712753A CN102712753A (zh) 2012-10-03
CN102712753B true CN102712753B (zh) 2015-08-26

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CN201080051264.XA Expired - Fee Related CN102712753B (zh) 2009-11-20 2010-11-19 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
CN2010800602792A Pending CN102803345A (zh) 2009-11-20 2010-11-19 薄膜晶体管组合物及其相关方法
CN2010800517836A Pending CN102712754A (zh) 2009-11-20 2010-11-19 表护层组合物及与其相关的方法
CN2010800609325A Pending CN102791769A (zh) 2009-11-20 2010-11-19 线材包裹组合物及其相关方法
CN2010800517840A Pending CN102668108A (zh) 2009-11-20 2010-11-19 包含聚酰亚胺膜和电极的组合件以及与它们相关的方法
CN2010800610464A Pending CN102714192A (zh) 2009-11-20 2010-11-19 用于半导体封装应用中的互连导电物薄膜及其相关方法

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